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Microwave Packaging Technology

virtual

Microwave Packaging Technology Instructor: Thomas Green Description: Microwave Hybrids, MICs, RF MMIC modules all require a unique set of materials and processes necessary to achieve reliable operations in extreme military and commercial environments, such as next generation 5G modules. This three-day course examines all aspects of microwave packaging from a practical perspective. The instructor shares […]

$895

Power supply efficiency improvements at low load conditions

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Power supply efficiency improvements at low load conditions Presented by Würth Elektronik and NXP Semiconductors Tuesday, January 23rd 2024 @ 10:00AM CET Traditionally, power supply efficiency is important for high power levels to reduce energy consumption of the overall application during normal operation. Designers must minimize the size and cost of component and power supplies […]

High-Temperature Film Capacitor for xEV Power Electronics; Murata Webinar

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Heat-Resilient Innovation Murata High-Temperature Film Capacitor for xEV Power Electronics 6th February 2024 11:00 AM IST time / 1:30 PM SGT In the ever-evolving landscape of mobility solutions, where innovation propels the industry forward, Murata's High-Temperature Film Capacitors (HTFC) take centre stage. While conventional film capacitors typically guarantee operation up to 105°C, Murata's HTFC breaks […]

Miniaturization, Function, Reliability: Embedded PCB WE Webinar

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Webinar: Miniaturization, function, reliability: DEVICE.embedding PCB sample WE.embed! Wed, Feb 7, 2024 11:00 AM - 12:00 PM CET LET THERE BE LIGHT! Dive into the fascinating world of miniaturization of printed circuit boards with embedded active and passive components. The efficient use of ever smaller housing volumes and tiny surfaces is becoming increasingly important. Embedding […]

Microelectronic Packaging Failure Modes and Analysis

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VIRTUAL: Microelectronic Packaging Failure Modes and Analysis Instructors: Thomas Green and Robert Lowry Description: The design and packaging of microelectronic devices such as hybrids, RF microwave modules, Class III medical implants and other types of packaged microcircuits intended for high reliability systems is a critical aspect of reliability engineering. This course is intended to review […]

$695

Transformer Design for EMC; WE Webinar

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Transformer Design for EMC Tuesday, February 20th 2024 @ 4:00PM CET Even though a transformer is a passive component, it has a great influence on the overall electromagnetic compatibility (EMC) of the power supply. In this webinar, I will highlight what we can do to keep the emissions low. I will discuss which properties of […]

Fast, faster, high speed! WE PCB Webinar

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Fast, faster, high speed! Würth Elektronik physical PCB sample WE.speed! Wed, Mar 6, 2024 11:00 AM - 12:00 PM CET WE.speed - the name of our hand sample for high-speed applications says it all! The world around us is getting faster and faster and electronic devices with WiFi 6, DDR5, PCIe or USB4 are coming […]

Pre Cap Visual Inspection per Mil-Std-883 (TM 2017)

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Pre Cap Visual Inspection per Mil-Std-883 (TM 2017) Instructor: Thomas Green Description: Hybrids/MCMs/RF Microwave Modules all require a visual inspection step just prior to encapsulation or hermetic seal. This is a critical process step that requires a high degree of operator skill and understanding of what to look for and reject as part of the […]

$995

External Visual Inspection per Mil-Std-883 TM 2009

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External Visual Inspection per Mil-Std-883 TM 2009 Instructor: Thomas Green Description: This course covers the visual inspection criteria for hermetic packaged microelectronic devices and similar devices and a review of typical plastic package defects in accordance with best commercial practices. Color photographs of actual production defects are reviewed and discussed in detail. The students are […]

$395

Simulation of Common-mode Chokes in QUCS and LTspice; WE Webinar

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Simulation of Common-mode Chokes in QUCS and LTspice Tue, 26th March 2024 @16:00 CET In this webinar we demonstrate how common-mode chokes, which represent an essential component for filtering of common-mode noise in electronics, can be used in the simulation tools QUCS and LTspice®. By means of LTspice® it is illustrated how measured scattering parameters […]

embedded world 2024

Nürnberg Messe Karl-Schönleben-Str., Messeplatz 1, Nürnberg, Germany

embedded world 2024 Connecting the embedded community: 9 – 11.4.2024 in Nuremberg. What awaits you at #ew24 The world of embedded systems is multifaceted – from hardware and software to services and tools. The embedded world Exhibition&Conference brings the entire embedded community together once a year in Nuremberg and provides a unique overview of the […]