Passive Components Blog
No Result
View All Result
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    YAGEO Introduces High‑Current Y2/X1 Film Capacitors for Wide-bandgap Power Systems

    Amphenol Explanded Liquid Cooling Connectors for AI, ESS and EV Systems

    Hirose Introduced BGA connector for PCIe Gen6 for AI and Edge Computing

    YAGEO Introduces High Rel MLCCs Beyond MIL-Spec Limits

    Würth Elektronik Expanded Capacity for Validation and Services in Asia

    Samsung Introduces Ultra-High-Voltage 1500 V MLCCs for xEV Powertrains

    YAGEO Q1 2026 Results: AI Servers and Pricing Power Behind a Moderate Q2 Outlook

    TDK Introduces High‑Voltage Common‑Mode Chokes for Compact 1250 V DC Converters

    Vishay Extends Power Inductors for DC/DC with 1212 Compact Case

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    Transformer-Based Power-Line Harvester Magnetic Design

    Thermal Modeling of Magnetics

    Standard vs Planar LLC transformers Comparison for Battery Chargers

    How Modern Tools Model Magnetic Components for Power Electronics

    Advanced Loss Modeling for Planar Magnetics in the Frenetic Planar Tool

    2026 Power Magnetics Design Trends: Flyback, DAB and Planar

    Enabling Software‑Defined Vehicle Architectures: Automotive Ethernet and Zonal Smart Power

    Calculating Resistance Value of a Flyback RC Snubber 

    One‑Pulse Characterization of Nonlinear Power Inductors

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • DossiersNew
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    YAGEO Introduces High‑Current Y2/X1 Film Capacitors for Wide-bandgap Power Systems

    Amphenol Explanded Liquid Cooling Connectors for AI, ESS and EV Systems

    Hirose Introduced BGA connector for PCIe Gen6 for AI and Edge Computing

    YAGEO Introduces High Rel MLCCs Beyond MIL-Spec Limits

    Würth Elektronik Expanded Capacity for Validation and Services in Asia

    Samsung Introduces Ultra-High-Voltage 1500 V MLCCs for xEV Powertrains

    YAGEO Q1 2026 Results: AI Servers and Pricing Power Behind a Moderate Q2 Outlook

    TDK Introduces High‑Voltage Common‑Mode Chokes for Compact 1250 V DC Converters

    Vishay Extends Power Inductors for DC/DC with 1212 Compact Case

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    Transformer-Based Power-Line Harvester Magnetic Design

    Thermal Modeling of Magnetics

    Standard vs Planar LLC transformers Comparison for Battery Chargers

    How Modern Tools Model Magnetic Components for Power Electronics

    Advanced Loss Modeling for Planar Magnetics in the Frenetic Planar Tool

    2026 Power Magnetics Design Trends: Flyback, DAB and Planar

    Enabling Software‑Defined Vehicle Architectures: Automotive Ethernet and Zonal Smart Power

    Calculating Resistance Value of a Flyback RC Snubber 

    One‑Pulse Characterization of Nonlinear Power Inductors

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • DossiersNew
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

FastCAP Systems Rebrands to Nanoramic Laboratories

27.5.2018
Reading Time: 2 mins read
A A

Source: Nanoramic Laboratories news

As FastCAP expands its product lines to include advanced materials from carbon nanotubes, the company rebrands to Nanoramic Laboratories.

RelatedPosts

YAGEO Introduces High‑Current Y2/X1 Film Capacitors for Wide-bandgap Power Systems

Amphenol Explanded Liquid Cooling Connectors for AI, ESS and EV Systems

Hirose Introduced BGA connector for PCIe Gen6 for AI and Edge Computing

BOSTON, MA, May 24, 2018 — FastCAP Systems Corporation, an industry leader in extreme environment energy storage technology, is rebranding to Nanoramic Laboratories.  In addition to ultracapacitors, Nanoramic will specialize in advanced material solutions based on nanocarbon technology.

In 2018, FastCAP’s product offerings expanded to include a division focused on the development of advanced materials, with products as diverse as thermal interface materials, battery and capacitor electrodes, and EMI/RFI shielding technology.  The name FastCAP Systems no longer represents the company’s full suite of product offerings.  The shift in focus led executives to make the change from FastCAP Systems to Nanoramic Laboratories.

“By re-identifying our business around our core competencies in advanced materials, we are recognizing the broader market opportunities for our nanocarbon and composite material products.  These technologies are enablers for a host of energy storage technologies, thermal management and EMI shielding solutions, as well as light-weighting and structural materials to name a few,” said John Cooley, President and Chief Operating Officer.  “This, combined with overwhelming customer draw, has created a compelling opportunity to enter new and exciting markets while continuing to support our existing energy storage products.”

Nanoramic’s breakthrough product offering is a binder-free composite energy storage electrode initially designed for high temperature and high voltage ultracapacitors, also known as supercapacitors or electric double layer capacitors (EDLCs).  This binder-free feature allows for low ESR, high capacitance, and high electrochemical stability in the same electrode. The electrode is capable of wide temperature operation, with the ability to perform in conditions between -55ºC and 200ºC.  Its high operating voltage greater than 3V and high capacity retention make it superior to incumbent technology.

Nanoramic’s line of ultracapacitors will be sold under the name FastCAP Ultracapacitors.  FastCAP Ultracapacitors are the only ultracapacitors capable of operation in conditions up to 150ºC.  In fact, Nanoramic’s success in advanced material product development can be attributed to FastCAP Ultracapacitors’ years of research and expertise in developing carbon nanotube based electrodes.  FastCAP’s newest technology is a reflowable, slim profile, low-ESR ultracapacitor, that provides power loss protection in SSD and IOT technologies.

‍

‍


About Nanoramic:

Nanoramic specializes in material solutions based on nano-carbons.   Nano-carbons have exceptional electrical, thermal and mechanical properties at the nano-scale level. We synthesize and incorporate nano-carbons in various materials and transfer these properties at the macroscale level, addressing the needs of several applications. Nanoramic’s ultracapacitor division, FastCAP Ultracapacitors, is an industry leader in harsh environment energy storage, producing the only ultracapacitors capable of operating in temperatures up to 150ºC and under conditions of high shock and vibration.

Related

Recent Posts

YAGEO Introduces High‑Current Y2/X1 Film Capacitors for Wide-bandgap Power Systems

17.4.2026
3

Amphenol Explanded Liquid Cooling Connectors for AI, ESS and EV Systems

17.4.2026
2

Hirose Introduced BGA connector for PCIe Gen6 for AI and Edge Computing

17.4.2026
4

YAGEO Introduces High Rel MLCCs Beyond MIL-Spec Limits

16.4.2026
30

Würth Elektronik Expanded Capacity for Validation and Services in Asia

16.4.2026
10

Samsung Introduces Ultra-High-Voltage 1500 V MLCCs for xEV Powertrains

16.4.2026
15

YAGEO Q1 2026 Results: AI Servers and Pricing Power Behind a Moderate Q2 Outlook

16.4.2026
42

TDK Introduces High‑Voltage Common‑Mode Chokes for Compact 1250 V DC Converters

16.4.2026
16

Vishay Extends Power Inductors for DC/DC with 1212 Compact Case

16.4.2026
16

Upcoming Events

Apr 21
16:00 - 17:00 CEST

Heatsink Solutions: Thermal Management in electronic devices

Apr 22
17:00 - 17:30 CEST

Magnetics in a high frequency GaN era

Apr 22
17:00 - 18:00 CEST

Derating Tantalum, Film, and Ceramic Capacitors

View Calendar

Popular Posts

  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Dual Active Bridge (DAB) Topology

    0 shares
    Share 0 Tweet 0
  • MLCC and Ceramic Capacitors

    0 shares
    Share 0 Tweet 0
  • Capacitor Charging and Discharging

    0 shares
    Share 0 Tweet 0
  • Plastic Materials Dielectric Constant and DF

    4 shares
    Share 4 Tweet 0
  • MLCC Case Sizes Standards Explained

    0 shares
    Share 0 Tweet 0
  • Ripple Current and its Effects on the Performance of Capacitors

    3 shares
    Share 3 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© EPCI - Leading Passive Components Educational and Information Site

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • PCNS

© EPCI - Leading Passive Components Educational and Information Site

This website uses cookies. By continuing to use this website you are giving consent to cookies being used. Visit our Privacy and Cookie Policy.
Go to mobile version