Passive Components Blog
No Result
View All Result
  • Home
  • News
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Optoelectronics and Isolation
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest
    TDK M704 and M705 NTC temperature sensors with a leaded plastic housing and metal-tag ring-lug assembly

    TDK M704 and M705 NTC Sensors for High-Voltage Power Systems

    Conceptual illustration for Modelithics COMPLETE 26.5 showing RF capacitors, inductors and resistors on a microwave PCB.

    Modelithics COMPLETE 26.5 Adds RF Passive Models for AWR

    TDK B3201 series Y1 film safety capacitors with rectangular cases and parallel wire leads

    TDK Introduces Y1 Film Safety Capacitors for 500 V AC EMI Filtering

    Littelfuse C&K SDE surface-mount DIP switches with gull-wing terminals and top-mounted actuators

    Littelfuse C&K SDE End-Stackable SMT DIP Switches

    Bourns SM91522AL BMS signal transformer with integrated common-mode chokes

    Bourns Releases BMS Transformer with 3.5 mm Height

    DigiKey product distribution center in Thief River Falls, Minnesota

    DigiKey Invests $100 Million to Expand Distribution Capacity

    Conceptual illustration of a Murata NCU01 surface-mount NTC thermistor beside densely arranged electronic components

    Murata World First 008004 NTC Thermistors for Temperature Sensing

    Modelithics COMPLETE+3D v26.4 library for RF passive-component and 3D electromagnetic simulation in Keysight ADS/RFPro

    Modelithics COMPLETE+3D v26.4 Expands RF Models and 3D Workflows

    Wk 42 Electronics Supply Chain Digest

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • Knowledge Blog
  • Dossiers
    • Aerospace and Defense Passive Components Dossier
    • AI Hardware Dossier
    • Automotive Dossier
    • Industrial Robotics Dossier
    • Power Converter Dossier
    • Capacitor Dossier
    • Circuit Protection Dossier
    • Inductor Dossier
    • Resistor Dossier
    • Silicon Capacitors and Integrated Passives Dossier
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
  • Home
  • News
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Optoelectronics and Isolation
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest
    TDK M704 and M705 NTC temperature sensors with a leaded plastic housing and metal-tag ring-lug assembly

    TDK M704 and M705 NTC Sensors for High-Voltage Power Systems

    Conceptual illustration for Modelithics COMPLETE 26.5 showing RF capacitors, inductors and resistors on a microwave PCB.

    Modelithics COMPLETE 26.5 Adds RF Passive Models for AWR

    TDK B3201 series Y1 film safety capacitors with rectangular cases and parallel wire leads

    TDK Introduces Y1 Film Safety Capacitors for 500 V AC EMI Filtering

    Littelfuse C&K SDE surface-mount DIP switches with gull-wing terminals and top-mounted actuators

    Littelfuse C&K SDE End-Stackable SMT DIP Switches

    Bourns SM91522AL BMS signal transformer with integrated common-mode chokes

    Bourns Releases BMS Transformer with 3.5 mm Height

    DigiKey product distribution center in Thief River Falls, Minnesota

    DigiKey Invests $100 Million to Expand Distribution Capacity

    Conceptual illustration of a Murata NCU01 surface-mount NTC thermistor beside densely arranged electronic components

    Murata World First 008004 NTC Thermistors for Temperature Sensing

    Modelithics COMPLETE+3D v26.4 library for RF passive-component and 3D electromagnetic simulation in Keysight ADS/RFPro

    Modelithics COMPLETE+3D v26.4 Expands RF Models and 3D Workflows

    Wk 42 Electronics Supply Chain Digest

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • Knowledge Blog
  • Dossiers
    • Aerospace and Defense Passive Components Dossier
    • AI Hardware Dossier
    • Automotive Dossier
    • Industrial Robotics Dossier
    • Power Converter Dossier
    • Capacitor Dossier
    • Circuit Protection Dossier
    • Inductor Dossier
    • Resistor Dossier
    • Silicon Capacitors and Integrated Passives Dossier
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

How can failures in vibration tests be avoided?

3.6.2019
Reading Time: 5 mins read
A A

Source: Alter Technology article

by María Teresa Rodríguez.

RelatedPosts

TDK M704 and M705 NTC Sensors for High-Voltage Power Systems

Modelithics COMPLETE 26.5 Adds RF Passive Models for AWR

TDK Introduces Y1 Film Safety Capacitors for 500 V AC EMI Filtering

Vibration tests are important to check the reliability of the components/assemblies. These tests can be a headache and suppose a great cost if the design of the device and the fixing tool are not properly done. Simulation tools are the key to anticipate the problems reducing costs and lead times and doEEEt gives you access, in just one site, to components and specifications from different systems and space agencies

Introduction to Modal Analysis:

All objects have a natural frequency inherent to each object, at which they vibrate when they are subjected to certain external forces. When a force is applied at the object’s natural frequency, it goes into resonance, and a higher amplitude vibration response is created. This situation can cause a collapse of the object. To avoid resonance, the frequency applied should not be at or near the natural frequency of the device or element under test. If the forcing frequency cannot be changed, natural frequency needs to be modified. This can only be done by altering the mass or its stiffness.

Simulation is used to validate the designs before manufacturing and testing phase in a laboratory. It is really useful to crosscheck the results of this analysis with the results obtained in the validation of the final assembly under the applicable vibration test and avoiding the resonance effect.

Vibration simulation, as others, is based in finite element analysis (FEA). The main goal of a modal analysis is to determinate the natural frequencies and vibration modes of an element during vibration. Usually to develop this type of analysis, Finite Elements Method (FEM) is used.

FEM is a method to solve differential equations and boundary value problems. It involves dividing a whole domain into simpler parts that are called finite elements.

A set of finite elements that make up the model to be simulated is called mesh. The mesh should be as regular and uniform as possible, and the size of the elements will depend on the precision needed to reproduce properly the geometry of the item to simulate. Once the model is ready, simulation tools proceed to the calculation and analysis of the results.

 

 

 

 

Example of a discretization model in finite elements

 

Step of a Correct Simulation:
To develop a correct simulation, it is necessary to follow the steps showed in the diagram below:

The success relies on the simulation of the natural frequencies of the DUT, the fixing tool and the assembly of both parts. The final simulation consists of the analysis of the forced response of the assembly under the conditions of the requirements. If any of the results fails, a re-design of any of the parts (the device, the fixing tool or the assembly) is required.

Requirements for the Simulation:

To perform all the simulations, the following information needs to be provided:

  • Materials and their mechanical properties of the fixing tools and the device under test (DUT). Also the surrounding elements, meaning the fitting interfaces of the tool with the shaker, in order to be able to do a proper model for the MEF analysis and to check with our vibration tool. This point is important because it may cause a big variation of the results due to the variation of the inner dynamics and damping of the DUT and are mainly known as boundary conditions.
  • Damping is a very important factor in the simulation. It is the way a system naturally dissipates energy. Its level cannot be studied by FEM. It is usually taken out by a Modal test. It can be used a value based on our experience in other projects or if it is necessary, we can use damping ranges in the FEM and see their effect.
  • By last, also is mandatory to know the full specification of the vibration profile. Sine, Random and/or Mechanical Shock vibration conditions. And their respective information, an axis of the vibration or the test which the information is related.

For vibration conditions, Alter Technology frequently tests according to the next specifications:

Title Reference Organization Parts
1 Generic Specification for Connectors Electrical Non-Filtered Circular and Rectangular ESCC 3401 European Space Components Coordination (ESCC) Connectors
7 High-reliability soldering for surface-mount and mixed technology ECSS-Q-ST-70-38C European Cooperation for Space Standardization (ECSS) Sodered system including Surface mounted devices (SMD), printed circuit boards (PCB)
10 Manual soldering of high-reliability electrical connections ECSS-Q-ST-70-08C European Cooperation for Space Standardization (ECSS) Sodered system including Surface mounted devices (SMD), printed circuit boards (PCB)
13 Test Method Standard, Microcircuits MIL-STD-883 TM2005 / TM2006 / TM2007 / TM2026 Defense and Logistic Agency Microcircuits
16 Test Methods for Semiconductor Devices MIL-STD-750 TM2016 TM2046 TM2051 TM2056 TM2057 MIL-STD-750 TM2016 / TM2046 / TM2051 / TM2056 / TM2057 Defense and Logistic Agency Semiconductors
19 Test Method Standard, Microcircuits MIL-STD-202 TM201 TM204 TM214 TM213 MIL-STD-202 TM201 / TM204 / TM214 / TM213 Defense and Logistic Agency Component parts

Related

Recent Posts

TDK B3201 series Y1 film safety capacitors with rectangular cases and parallel wire leads

TDK Introduces Y1 Film Safety Capacitors for 500 V AC EMI Filtering

21.10.2026
17
Bourns SM91522AL BMS signal transformer with integrated common-mode chokes

Bourns Releases BMS Transformer with 3.5 mm Height

21.10.2026
5
Modelithics COMPLETE+3D v26.4 library for RF passive-component and 3D electromagnetic simulation in Keysight ADS/RFPro

Modelithics COMPLETE+3D v26.4 Expands RF Models and 3D Workflows

19.10.2026
11
Siemens executives Markus Grabmeier and Barry Powell with Skeleton Technologies CEO Taavi Madiberk at the investment announcement

Siemens Backs Skeleton’s US AI Power Manufacturing Expansion

15.10.2026
57
Supercapacitor LSM production

LS Materials Wins $51.5M AI Data Center Supercapacitor Order

13.10.2026
93
Features of BCZT and strontium titanate dielectric layers in a thin-film superlattice

Relaxor superlattice capacitors approach 99% efficiency

12.10.2026
38
Stackpole RMAN thick-film chip resistors with rectangular bodies and metal end terminations

Stackpole 2512 AlN Thick-Film Resistors Rated up to 3.5 W

12.10.2026
16
Concept illustration of TT Electronics resistor and sensing technologies with chip resistors, a shaft potentiometer and a slotted optical sensor

TT Electronics: Resistor and Sensing Trends at electronica 2026

9.10.2026
15
Conceptual Toray heat-resistant film capacitor beside an inverter cooling structure.

Toray Film Capacitor Enables 150°C Inverter Operation

9.10.2026
80

Upcoming Events

Oct 27
15:00 - 16:00 CET

Heraeus Electronics Webinar: What materials perform when failure is not an option?

Oct 27
16:00 - 17:00 CET

Power Inductor technologies

Oct 28
13:00 - 14:00 CDT

Inductor Design in a Multi-Phase Buck Converter

View Calendar

Popular Posts

  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Capacitor Charging and Discharging

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Audio Capacitors: Choosing Capacitors for Crossover Circuits

    0 shares
    Share 0 Tweet 0
  • MLCC and Ceramic Capacitors

    0 shares
    Share 0 Tweet 0
  • RF Connector Types: How To Choose the Right One

    0 shares
    Share 0 Tweet 0
  • Passive Low Pass Filters: Fundamentals and EMI Design

    0 shares
    Share 0 Tweet 0
  • Thermistor Basics: NTC and PTC Selection Guide

    0 shares
    Share 0 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© 2015–2026
All rights reserved

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • Dossiers
  • PCNS

© 2015–2026
All rights reserved