Passive Components Blog
No Result
View All Result
  • Home
  • News
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Optoelectronics and Isolation
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest
    TDK B3201 series Y1 film safety capacitors with rectangular cases and parallel wire leads

    TDK Introduces Y1 Film Safety Capacitors for 500 V AC EMI Filtering

    Littelfuse C&K SDE surface-mount DIP switches with gull-wing terminals and top-mounted actuators

    Littelfuse C&K SDE End-Stackable SMT DIP Switches

    Bourns SM91522AL BMS signal transformer with integrated common-mode chokes

    Bourns Releases BMS Transformer with 3.5 mm Height

    DigiKey product distribution center in Thief River Falls, Minnesota

    DigiKey Invests $100 Million to Expand Distribution Capacity

    Conceptual illustration of a Murata NCU01 surface-mount NTC thermistor beside densely arranged electronic components

    Murata World First 008004 NTC Thermistors for Temperature Sensing

    Modelithics COMPLETE+3D v26.4 library for RF passive-component and 3D electromagnetic simulation in Keysight ADS/RFPro

    Modelithics COMPLETE+3D v26.4 Expands RF Models and 3D Workflows

    Wk 42 Electronics Supply Chain Digest

    Siemens executives Markus Grabmeier and Barry Powell with Skeleton Technologies CEO Taavi Madiberk at the investment announcement

    Siemens Backs Skeleton’s US AI Power Manufacturing Expansion

    Concept illustration of an LTCC antenna module with multilayer ceramic substrate, antenna elements and an integrated beamforming IC

    Murata LTCC 6G Antenna Module Demonstrates 135 GHz Operation

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • Knowledge Blog
  • Dossiers
    • Aerospace and Defense Passive Components Dossier
    • AI Hardware Dossier
    • Automotive Dossier
    • Industrial Robotics Dossier
    • Power Converter Dossier
    • Capacitor Dossier
    • Circuit Protection Dossier
    • Inductor Dossier
    • Resistor Dossier
    • Silicon Capacitors and Integrated Passives Dossier
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
  • Home
  • News
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Optoelectronics and Isolation
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest
    TDK B3201 series Y1 film safety capacitors with rectangular cases and parallel wire leads

    TDK Introduces Y1 Film Safety Capacitors for 500 V AC EMI Filtering

    Littelfuse C&K SDE surface-mount DIP switches with gull-wing terminals and top-mounted actuators

    Littelfuse C&K SDE End-Stackable SMT DIP Switches

    Bourns SM91522AL BMS signal transformer with integrated common-mode chokes

    Bourns Releases BMS Transformer with 3.5 mm Height

    DigiKey product distribution center in Thief River Falls, Minnesota

    DigiKey Invests $100 Million to Expand Distribution Capacity

    Conceptual illustration of a Murata NCU01 surface-mount NTC thermistor beside densely arranged electronic components

    Murata World First 008004 NTC Thermistors for Temperature Sensing

    Modelithics COMPLETE+3D v26.4 library for RF passive-component and 3D electromagnetic simulation in Keysight ADS/RFPro

    Modelithics COMPLETE+3D v26.4 Expands RF Models and 3D Workflows

    Wk 42 Electronics Supply Chain Digest

    Siemens executives Markus Grabmeier and Barry Powell with Skeleton Technologies CEO Taavi Madiberk at the investment announcement

    Siemens Backs Skeleton’s US AI Power Manufacturing Expansion

    Concept illustration of an LTCC antenna module with multilayer ceramic substrate, antenna elements and an integrated beamforming IC

    Murata LTCC 6G Antenna Module Demonstrates 135 GHz Operation

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • Knowledge Blog
  • Dossiers
    • Aerospace and Defense Passive Components Dossier
    • AI Hardware Dossier
    • Automotive Dossier
    • Industrial Robotics Dossier
    • Power Converter Dossier
    • Capacitor Dossier
    • Circuit Protection Dossier
    • Inductor Dossier
    • Resistor Dossier
    • Silicon Capacitors and Integrated Passives Dossier
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

Introduction of Press-Fit Assembly on Aluminum Electrolytic Capacitors

29.4.2020
Reading Time: 4 mins read
A A

Can Press-Fit capacitors still deliver the necessary robustness and electrical connection? Read quick overview by Wilmer Companioni, Kemet Technical Marketing Team Leader.

It’s a simple concept, just press the pins into the holes and voila, you’ve installed your capacitor. One the face of it, it doesn’t sound like it is a very solid assembly, but we put a lot of thought into how we can bring the reliability you’re used to with our aluminum electrolytic Press-Fit capacitors. We’ll get into how this very simple method of assembly can still deliver the necessary robustness and electrical connection.

RelatedPosts

TDK Introduces Y1 Film Safety Capacitors for 500 V AC EMI Filtering

Littelfuse C&K SDE End-Stackable SMT DIP Switches

Bourns Releases BMS Transformer with 3.5 mm Height

What is Press-Fit?

There are many ways to mount components onto a board. The two most popular processes are surface mount technology and through-hole technology. Both of those processes use solder to mechanically affix components to the board.

One mounting technology type that has become increasingly popular is Press-Fit. This consists of “pins” that are capable of exerting lateral force on the holes in which they are inserted. Press-Fit has been successfully used in many electronics, such as IGBT modules for some time. KEMET is among the first to apply a Press-Fit connection to capacitors.

So, is it better than solder?

The question here is one that attempts to compare the mechanical robustness of solder-in connections with a press-fit connection. To take full advantage of a press-fit connection it requires a laying down additional copper tracking around the connections and full plated through hole.

The real question here is, “Is a press-fit connection as mechanically sound as a solder-in connection?” A bit of a loaded question if you ask me as the failure mode of a Press-Fit connection is slightly different than that of a solder-down connection.

Many times, large electrolytic capacitors are mechanically clamped to the casing because either solder-in or press-fit, such large components can create large amounts of torque on the board. Ultimately when equivalently affixed, solder-in connections and press-fit connections exhibit similar performance. The following is an example of a comparison of vibration performance.

An Option for Serviceability

Perhaps the biggest advantage of Press-Fit connections is that they can be more easily serviced. Our aluminum electrolytic capacitors are designed for long service life. Even so, sometimes these need to be serviced.

Using solder-in methods replacing a component can be a challenge. The equipment in which these components live are usually ones that must be continuously operational or there can be fines for down-time, such as power distribution systems. The less time the system is down the better. Replacing solder-in components may sometimes take hours but the replacement of press-fit items is more on the order of minutes.

Is Press-Fit Right for Me?

As with any good question, that depends. Press-Fit offers a favorable mix of serviceability with reliability. And that is the message of Press-Fit, being able to deliver a robust mechanical and electrical connection without sacrificing the necessary mechanical reliability of a system.

The only real way to know is to try out Press-Fit for yourself. While not a drop-in replacement for through-hole or snap-in connections, you can find you necessary combination of capacitance, voltage, and size. Check out Kemet offering of Press-Fit capacitors here.

Related

Recent Posts

TDK B3201 series Y1 film safety capacitors with rectangular cases and parallel wire leads

TDK Introduces Y1 Film Safety Capacitors for 500 V AC EMI Filtering

21.10.2026
5
Littelfuse C&K SDE surface-mount DIP switches with gull-wing terminals and top-mounted actuators

Littelfuse C&K SDE End-Stackable SMT DIP Switches

21.10.2026
1
Conceptual illustration of a Murata NCU01 surface-mount NTC thermistor beside densely arranged electronic components

Murata World First 008004 NTC Thermistors for Temperature Sensing

20.10.2026
13
Modelithics COMPLETE+3D v26.4 library for RF passive-component and 3D electromagnetic simulation in Keysight ADS/RFPro

Modelithics COMPLETE+3D v26.4 Expands RF Models and 3D Workflows

19.10.2026
10
Siemens executives Markus Grabmeier and Barry Powell with Skeleton Technologies CEO Taavi Madiberk at the investment announcement

Siemens Backs Skeleton’s US AI Power Manufacturing Expansion

15.10.2026
55
Concept illustration of an LTCC antenna module with multilayer ceramic substrate, antenna elements and an integrated beamforming IC

Murata LTCC 6G Antenna Module Demonstrates 135 GHz Operation

15.10.2026
26
TDK X series surface-mount multilayer varistors with ceramic chip bodies and metal end terminations

TDK X Series SMD Varistors for Industrial Transient Protection

14.10.2026
13
Supercapacitor LSM production

LS Materials Wins $51.5M AI Data Center Supercapacitor Order

13.10.2026
87
Features of BCZT and strontium titanate dielectric layers in a thin-film superlattice

Relaxor superlattice capacitors approach 99% efficiency

12.10.2026
32

Upcoming Events

Oct 27
15:00 - 16:00 CET

Heraeus Electronics Webinar: What materials perform when failure is not an option?

Oct 27
16:00 - 17:00 CET

Power Inductor technologies

Oct 28
13:00 - 14:00 CDT

Inductor Design in a Multi-Phase Buck Converter

View Calendar

Popular Posts

  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Capacitor Charging and Discharging

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Audio Capacitors: Choosing Capacitors for Crossover Circuits

    0 shares
    Share 0 Tweet 0
  • MLCC and Ceramic Capacitors

    0 shares
    Share 0 Tweet 0
  • RF Connector Types: How To Choose the Right One

    0 shares
    Share 0 Tweet 0
  • Passive Low Pass Filters: Fundamentals and EMI Design

    0 shares
    Share 0 Tweet 0
  • Thermistor Basics: NTC and PTC Selection Guide

    0 shares
    Share 0 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© 2015–2026
All rights reserved

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • Dossiers
  • PCNS

© 2015–2026
All rights reserved