Passive Components Blog
No Result
View All Result
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    High-Q RF & Microwave MLCCs: A Cross-Vendor Benchmark

    Molex Unveils Automotive Ethernet Connectors for Next‑Gen SDV Architectures

    TAIYO YUDEN Introduced Hybrid Aluminum Capacitors for 48V Automotive Power Supplies

    ECIA Industry Pulse June 2026 Reaches Five‑Year High

    YAGEO Announces July 2026 Capacitor Price Increase

    YAGEO Presents Single-Phase Common Mode Chokes for Industrial EMI Suppression

    Enabling the 800 V AI Server Era: How C0G High-Voltage MLCC Supports Next-Generation Power Architectures

    binder Prints Electronics on 3D Components Connector Surface

    Vishay Introduces SMD Polymer PTC Thermistors for Fast Resettable Overcurrent Protection

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    KYOCERA AVX Presents Antenna Integrator Studio Tutorial for Antenna Placement and RF Design

    Power Design Simulation Tools for Faster Inductor Selection and Loss Optimization

    EMC‑Compliant PCB and Connector Design Guidelines

    Why Isolated DC/DC Power Supplies Fail Late, Würth Elektronik Podcast

    Designing 800 V DC EMC Filters: Calculation, Simulation and Measurement

    Current Sense Transformer Datasheet and Design‑in Guide

    Designing a USB Type‑C Flyback Planar Transformer with Frenetic’s Planar Tool

    Magnetics Design in High‑Frequency GaN Converters

    Qi2 Wireless Charging: Inductors, Capacitors and EMC Filters

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • DossiersNew
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    High-Q RF & Microwave MLCCs: A Cross-Vendor Benchmark

    Molex Unveils Automotive Ethernet Connectors for Next‑Gen SDV Architectures

    TAIYO YUDEN Introduced Hybrid Aluminum Capacitors for 48V Automotive Power Supplies

    ECIA Industry Pulse June 2026 Reaches Five‑Year High

    YAGEO Announces July 2026 Capacitor Price Increase

    YAGEO Presents Single-Phase Common Mode Chokes for Industrial EMI Suppression

    Enabling the 800 V AI Server Era: How C0G High-Voltage MLCC Supports Next-Generation Power Architectures

    binder Prints Electronics on 3D Components Connector Surface

    Vishay Introduces SMD Polymer PTC Thermistors for Fast Resettable Overcurrent Protection

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    KYOCERA AVX Presents Antenna Integrator Studio Tutorial for Antenna Placement and RF Design

    Power Design Simulation Tools for Faster Inductor Selection and Loss Optimization

    EMC‑Compliant PCB and Connector Design Guidelines

    Why Isolated DC/DC Power Supplies Fail Late, Würth Elektronik Podcast

    Designing 800 V DC EMC Filters: Calculation, Simulation and Measurement

    Current Sense Transformer Datasheet and Design‑in Guide

    Designing a USB Type‑C Flyback Planar Transformer with Frenetic’s Planar Tool

    Magnetics Design in High‑Frequency GaN Converters

    Qi2 Wireless Charging: Inductors, Capacitors and EMC Filters

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • DossiersNew
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

Hirose Releases High Current Vibration-Resistant Connectors

4.8.2025
Reading Time: 2 mins read
A A

Hirose Electric unveils industry leading high current vibration-resistant connectors for the EV and HEV Markets.

Hirose Electric Co., Ltd. announced the launch of the FX31 Series, the world’s first board-to-board connector series that combines high current capability with a rugged, vibration-resistant design.

RelatedPosts

Hirose Releases Ultra‑low Profile FPC‑to‑board Connector

Hirose Releases 0.5 mm Floating Board-to-Board Connector for EV Powertrain Designs

Hirose Expands Compact High‑Voltage EV connectors

This groundbreaking innovation is set to transform the automotive industry by addressing the growing demands of electric vehicles (EVs) and hybrid electric vehicles (HEVs) for high currents and durability in harsh vibration environments.

Powertrain Innovation: Unlocking New Possibilities with High-Current Connectors

As powertrain systems in EVs and HEVs increasingly require high currents, traditional busbars with screw-fastening methods have posed challenges such as large component size, limited design flexibility, and complex assembly. Hirose Electric has leveraged its expertise in vibration-resistant signal connectors to develop the FX31, a connector-based solution that replaces conventional busbars. This innovation enables miniaturization, weight reduction, and supports assembly automation, leading to greater manufacturing efficiency and cost savings.

The FX31, when combined with the FX26 Series for signal transmission, supports hybrid power and signal connections in a compact form factor, contributing to high-density mounting and significant cost reductions.

Unique Features of the FX31 Series

  • World’s First High Current + Vibration-Resistant Structure: The FX31 features a proprietary floating design that absorbs vibration and shock while safely delivering high current, up to 25A per contact, with potential support for up to 40A per contact in a 2-position configuration.
  • Floating Design for Greater Assembly Flexibility and Labor Savings: Eliminates the need for screw fastening, facilitating seamless integration into automated assembly lines, including robotic systems.
  • Compact and Lightweight: Smaller and lighter than traditional busbars, offering greater design flexibility for PCB layouts.
  • Hybrid Connection with FX26 Series: Supports high-density mounting and contributes to total cost reduction when combined with the FX26 Series for signal lines.

The FX31 Series is designed to support powertrain system integration and meet the high-current demands of next-generation high-end IVI (In-Vehicle Infotainment) automotive computers, driving continued market expansion.

Under Development

Hirose Electric is expanding the FX31 Series lineup to meet customer demand, with the following variations currently in mass production and planned for development:

  • Currently in Mass Production: 2-position connectors with a height of 20mm.
  • Planned for Development: 3-position and 4-position connectors with heights of 25mm and 30mm, respectively.

Related

Source: Hirose

Recent Posts

Molex Unveils Automotive Ethernet Connectors for Next‑Gen SDV Architectures

2.7.2026
13

TAIYO YUDEN Introduced Hybrid Aluminum Capacitors for 48V Automotive Power Supplies

2.7.2026
21

YAGEO Announces July 2026 Capacitor Price Increase

1.7.2026
278

Enabling the 800 V AI Server Era: How C0G High-Voltage MLCC Supports Next-Generation Power Architectures

1.7.2026
77

binder Prints Electronics on 3D Components Connector Surface

1.7.2026
15

MLCCs in the Age of AI: Q2 2026 Market Tightness

30.6.2026
231

Bourns Planar Transformers for SiC and GaN Gate Driver Isolation

26.6.2026
55

100 V Hybrid Polymer Capacitor from VINA Enesol Targets 48–72 V Power Platforms

26.6.2026
129

Panasonic Releases Relays for IEC 62955 Compliant Single‑Phase EV Wallboxes

25.6.2026
29

Upcoming Events

Jul 14
16:00 - 17:00 CEST

EMC Design Essentials: Mastering Varistors and Common Mode Chokes

Jul 21
16:00 - 17:00 CEST

Safety by design: X and Y Interference suppression capacitors for power line filters

Jul 28
8:00 - 11:00 CEST

Post Procurement Testing of EEE Components for LEO Space Applications

View Calendar

Popular Posts

  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • MLCC and Ceramic Capacitors

    0 shares
    Share 0 Tweet 0
  • Nvidia Vera Rubin: Why One AI Rack Needs So Many More MLCC Capacitors

    0 shares
    Share 0 Tweet 0
  • Earthing Systems and IEC Classification Explained

    0 shares
    Share 0 Tweet 0
  • Dual Active Bridge (DAB) Topology

    0 shares
    Share 0 Tweet 0
  • MLCC Case Sizes Standards Explained

    0 shares
    Share 0 Tweet 0
  • SEPIC Converter Design and Calculation

    0 shares
    Share 0 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© EPCI - Leading Passive Components Educational and Information Site

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • Dossiers
  • PCNS

© EPCI - Leading Passive Components Educational and Information Site

This website uses cookies. By continuing to use this website you are giving consent to cookies being used. Visit our Privacy and Cookie Policy.
Go to mobile version