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    Power line EMI filter on a copper ground-plane fixture connected to a vector network analyzer with a toroidal balun

    How to Measure Filter Performance: Insertion Loss, VNA Fixtures and CM/DM Separation

    Assorted EMI and RF filter components: common mode choke, ferrite beads, feedthrough filter, X2 capacitor, cavity filter, ceramic coaxial resonators, thin-film filter and SAW/BAW packages

    Passive Filter Technologies Compared: LC, Ferrite, Feedthrough, Ceramic, Cavity, Microstrip, SAW and BAW

    Illustration of a thin-film capacitor stack with TiN electrodes and an ultrathin hafnium zirconium oxide ferroelectric layer on silicon

    Sub-Volt Ferroelectric HZO Capacitor Pairs Speed and Endurance

    Cut-open lithium-ion capacitor pouch cell showing stacked carbon electrodes and separators, with vials of carbon powder

    Lithium-Ion Capacitor Review Backs Hard Carbon//AC Pairing

    Rack power shelf in an AI data center with film DC-link capacitors, a supercapacitor bank and a converter board

    800 VDC AI Data Centers Reshape Capacitor Demand for 2027

    Schematic of a titanium nitride thin-film inductor within a CMOS poly-resistor stack beside its integrated resonator circuit.

    TiN Superinductors Bring Compact Cryogenic Inductance to CMOS

    Close-up of reddish-brown metallic rocks illustrating TTI MarketEYE’s connector raw material cost analysis

    Connector Raw Material Costs Rise 20.9% in Q2 2026

    AI and Passive Components: Structural Growth Beyond Data Centers

    YAGEO PMT6397 push-pull transformer with a segmented toroidal winding and surface-mount terminals

    YAGEO Releases Push-Pull Transformers for Isolated 3 W Supplies

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    Power line EMI filter on a copper ground-plane fixture connected to a vector network analyzer with a toroidal balun

    How to Measure Filter Performance: Insertion Loss, VNA Fixtures and CM/DM Separation

    Assorted EMI and RF filter components: common mode choke, ferrite beads, feedthrough filter, X2 capacitor, cavity filter, ceramic coaxial resonators, thin-film filter and SAW/BAW packages

    Passive Filter Technologies Compared: LC, Ferrite, Feedthrough, Ceramic, Cavity, Microstrip, SAW and BAW

    Illustration of a thin-film capacitor stack with TiN electrodes and an ultrathin hafnium zirconium oxide ferroelectric layer on silicon

    Sub-Volt Ferroelectric HZO Capacitor Pairs Speed and Endurance

    Cut-open lithium-ion capacitor pouch cell showing stacked carbon electrodes and separators, with vials of carbon powder

    Lithium-Ion Capacitor Review Backs Hard Carbon//AC Pairing

    Rack power shelf in an AI data center with film DC-link capacitors, a supercapacitor bank and a converter board

    800 VDC AI Data Centers Reshape Capacitor Demand for 2027

    Schematic of a titanium nitride thin-film inductor within a CMOS poly-resistor stack beside its integrated resonator circuit.

    TiN Superinductors Bring Compact Cryogenic Inductance to CMOS

    Close-up of reddish-brown metallic rocks illustrating TTI MarketEYE’s connector raw material cost analysis

    Connector Raw Material Costs Rise 20.9% in Q2 2026

    AI and Passive Components: Structural Growth Beyond Data Centers

    YAGEO PMT6397 push-pull transformer with a segmented toroidal winding and surface-mount terminals

    YAGEO Releases Push-Pull Transformers for Isolated 3 W Supplies

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Hirose Launches World’s Lowest Profile and Narrowest Pitch FPC Connector

1.8.2025
Reading Time: 2 mins read
A A

Hirose Electric unveils FH76 series: revolutionizing ultra-low-profile FPC connectors for compact devices.

Hirose Electric Co., Ltd., a global leader in electronic connectors, announces the launch of the FH76 Series, a groundbreaking One Action FPC connector designed to meet the demands of ultra-thin and compact wearable devices.

RelatedPosts

Hirose Automotive FPC/FFC Connector Adds One-Action Mating up to 125°C

Hirose Releases Ultra‑low Profile FPC‑to‑board Connector

Hirose Releases 0.5 mm Floating Board-to-Board Connector for EV Powertrain Designs

This innovative series boasts the world’s lowest profile of 0.5 mm and the narrowest pitch of 0.175 mm among board-to-board connectors with a One Action structure, setting a new standard in the industry.

The FH76 Series is specifically optimized for smartwatches and foldable smartphones, where space-saving and low-profile connectors are increasingly essential.

Its simple One Action locking mechanism eliminates the need for actuator operation during FPC insertion, significantly reducing the risk of assembly errors and enhancing operational efficiency. This design innovation addresses the challenges posed by the miniaturization and thinning of consumer electronics, ensuring seamless integration and improved usability.

Key features of the FH76 Series include:

  • Ultra-Low Profile (0.5 mm): The world’s lowest profile for a One Action structure.
  • Ultra-Narrow Pitch (0.175 mm): The world’s narrowest pitch for a One Action structure.
  • Actuator Retention: Stays closed during transport after mounting to prevent detachment.
  • Dust Prevention: Wiping structure cleans contact points.
  • Improved Operability: No actuator operation needed—easy insertion despite low profile.

Currently available in 34 positions, the FH76 Series is in development for 21, 25, and 41 positions, with plans to expand the lineup to include wider pitch options such as 0.2 mm and 0.25 mm, while maintaining the same structural design.

Hirose Electric remains committed to advancing the consumer market through further miniaturization and improved device usability. The FH76 Series is a testament to the company’s dedication to innovation and excellence in electronic connector technology.

Related

Source: Hirose

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