Passive Components Blog
No Result
View All Result
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    KYOCERA AVX Introduces Traction‑Grade DC Link Film Capacitors

    When More Capacitance Hurts Reliability: The Role of the Metallic Skeleton in Tantalum Anodes

    Why Power Inductors Use a Ferrite Core With an Air Gap

    Wk 16 Electronics Supply Chain Digest

    YAGEO Introduces High‑Current Y2/X1 Film Capacitors for Wide-bandgap Power Systems

    Amphenol Explanded Liquid Cooling Connectors for AI, ESS and EV Systems

    Hirose Introduced BGA connector for PCIe Gen6 for AI and Edge Computing

    YAGEO Introduces High Rel MLCCs Beyond MIL-Spec Limits

    Würth Elektronik Expanded Capacity for Validation and Services in Asia

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    Why Power Inductors Use a Ferrite Core With an Air Gap

    Transformer-Based Power-Line Harvester Magnetic Design

    Thermal Modeling of Magnetics

    Standard vs Planar LLC transformers Comparison for Battery Chargers

    How Modern Tools Model Magnetic Components for Power Electronics

    Advanced Loss Modeling for Planar Magnetics in the Frenetic Planar Tool

    2026 Power Magnetics Design Trends: Flyback, DAB and Planar

    Enabling Software‑Defined Vehicle Architectures: Automotive Ethernet and Zonal Smart Power

    Calculating Resistance Value of a Flyback RC Snubber 

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • DossiersNew
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    KYOCERA AVX Introduces Traction‑Grade DC Link Film Capacitors

    When More Capacitance Hurts Reliability: The Role of the Metallic Skeleton in Tantalum Anodes

    Why Power Inductors Use a Ferrite Core With an Air Gap

    Wk 16 Electronics Supply Chain Digest

    YAGEO Introduces High‑Current Y2/X1 Film Capacitors for Wide-bandgap Power Systems

    Amphenol Explanded Liquid Cooling Connectors for AI, ESS and EV Systems

    Hirose Introduced BGA connector for PCIe Gen6 for AI and Edge Computing

    YAGEO Introduces High Rel MLCCs Beyond MIL-Spec Limits

    Würth Elektronik Expanded Capacity for Validation and Services in Asia

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    Why Power Inductors Use a Ferrite Core With an Air Gap

    Transformer-Based Power-Line Harvester Magnetic Design

    Thermal Modeling of Magnetics

    Standard vs Planar LLC transformers Comparison for Battery Chargers

    How Modern Tools Model Magnetic Components for Power Electronics

    Advanced Loss Modeling for Planar Magnetics in the Frenetic Planar Tool

    2026 Power Magnetics Design Trends: Flyback, DAB and Planar

    Enabling Software‑Defined Vehicle Architectures: Automotive Ethernet and Zonal Smart Power

    Calculating Resistance Value of a Flyback RC Snubber 

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • DossiersNew
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

KEMET Tantalum Polymer Capacitors Set New Performance in Automotive and Super Computing

12.6.2019
Reading Time: 2 mins read
A A

Source: Kemet news

Extended life, single digit ESR, CV and volumetric efficiency performance enable T598 devices to provide component solutions for ADAS, autonomous driving and digitalization.

RelatedPosts

KYOCERA AVX Introduces Traction‑Grade DC Link Film Capacitors

When More Capacitance Hurts Reliability: The Role of the Metallic Skeleton in Tantalum Anodes

Why Power Inductors Use a Ferrite Core With an Air Gap

FORT LAUDERDALE, Fla., June 6, 2019 — KEMET Corporation (“KEMET” or the “Company”) (NYSE: KEM), a leading global supplier of electronic components, today expanded the temperature capability of T598 devices, a first-to-market Tantalum Polymer Surface Mount Capacitor.

These devices uniquely address the stringent requirements and new challenges presented by megatrend applications in automotive Advanced Driver Assistance Systems (ADAS), autonomous driving and in digitalization uses such as supercomputing, mobility services, connectivity and infotainment. T598 automotive grade polymer electrolytic devices combine multiple high-performance characteristics including high capacitance / voltage (CV) ratings, single digit equivalent series resistance (ESR), class-leading ripple performance, and ultra-extended life to truly enable the development and deployment of exciting and revolutionary technologies.

AEC-200 qualified T598 devices have excellent volumetric efficiency, which in tandem with high capacitance values now up to 470μF, voltage offerings of 2.5VDC – 50VDC and new single digit ESR, means single components can be used where current solutions dictate that multiple devices must be used. Therefore, KEMET’s new devices can help designers achieve both vital board real estate and cost savings.

Robust and stable performance to 2000 hours at temperatures to 125°C – equating to an ultra-extended mission profile of around 15 years – aligns with the requirements for vehicle applications ranging from ADAS features such as blind spot detection, adaptive cruise control and emergency brake assist, to safety systems including airbag occupant detection and alarm systems and electronic stability control.

The increase in electronic content on vehicles to enable ADAS, comfort and convenience and connectivity as well as the transition to hybrid and fully electrified powertrains, and ultimately fully autonomous driving, creates new opportunities for companies like KEMET to develop component technologies that can satisfy performance and life requirements not previously seen in the sector. The T598 series provides the latest example of this being achieved.

Commenting on the temperature capability extension of the Company’s automotive grade polymer electrolytic devices, Dr. Philip Lessner, KEMET Senior Vice President and Chief Technology Officer, said, “The developments and megatrends we are witnessing in the automotive sector and in areas such as 5G base stations and cloud computing server farms are dramatic, exciting and more significant than anything seen in decades. In order for these megatrends to maintain their momentum and deliver the end products being developed, component technologies that achieve new performance levels across multiple criteria are essential. The T598 family is a perfect example of this and will allow electronic design engineers to evolve their concepts to reality.”

For more information on KEMET’s T598 Tantalum Polymer Capacitors, please visit http://go.kemet.com/T598-2000hrs.

Related

Recent Posts

KYOCERA AVX Introduces Traction‑Grade DC Link Film Capacitors

21.4.2026
10

When More Capacitance Hurts Reliability: The Role of the Metallic Skeleton in Tantalum Anodes

20.4.2026
21

YAGEO Introduces High‑Current Y2/X1 Film Capacitors for Wide-bandgap Power Systems

17.4.2026
18

YAGEO Introduces High Rel MLCCs Beyond MIL-Spec Limits

16.4.2026
46

Würth Elektronik Expanded Capacity for Validation and Services in Asia

16.4.2026
13

Samsung Introduces Ultra-High-Voltage 1500 V MLCCs for xEV Powertrains

16.4.2026
26

YAGEO Q1 2026 Results: AI Servers and Pricing Power Behind a Moderate Q2 Outlook

16.4.2026
65

YAGEO Releases Ferrite Shielded Power Inductors for High‑Density Designs

15.4.2026
16

Samsung Presents MLCC Selection Guide for Humanoids and Robotic Applications

15.4.2026
40

Upcoming Events

Apr 22
17:00 - 17:30 CEST

Magnetics in a high frequency GaN era

Apr 22
17:00 - 18:00 CEST

Derating Tantalum, Film, and Ceramic Capacitors

Apr 29
10:00 - 11:00 CDT

SEPIC Design Done Right

View Calendar

Popular Posts

  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • MLCC and Ceramic Capacitors

    0 shares
    Share 0 Tweet 0
  • Dual Active Bridge (DAB) Topology

    0 shares
    Share 0 Tweet 0
  • Capacitor Charging and Discharging

    0 shares
    Share 0 Tweet 0
  • Ripple Current and its Effects on the Performance of Capacitors

    3 shares
    Share 3 Tweet 0
  • What Electronics Engineer Needs to Know About Passive Low Pass Filters

    0 shares
    Share 0 Tweet 0
  • MLCC Case Sizes Standards Explained

    0 shares
    Share 0 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© EPCI - Leading Passive Components Educational and Information Site

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • PCNS

© EPCI - Leading Passive Components Educational and Information Site

This website uses cookies. By continuing to use this website you are giving consent to cookies being used. Visit our Privacy and Cookie Policy.
Go to mobile version