Passive Components Blog
No Result
View All Result
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    Modelithics Releases COMPLETE Library v26.2 for Keysight Genesys

    Why Isolated DC/DC Power Supplies Fail Late, Würth Elektronik Podcast

    Wk 23 Electronics Supply Chain Digest

    Power Converter Dossier: Passive Components Design and Selection Guide 2026

    Evans Group Unifies Four High-Rel Capacitor Leaders

    Skeleton Releases Graphene‑Based UPS for AI Data Centers

    Designing 800 V DC EMC Filters: Calculation, Simulation and Measurement

    TDK Releases DC-link Film Capacitors with Ultra-low Inductance for SiC Power Converters

    Murata Introduces World First 2.2uF 100V Soft‑Term MLCC in 0805 Size for Automotive

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    Why Isolated DC/DC Power Supplies Fail Late, Würth Elektronik Podcast

    Designing 800 V DC EMC Filters: Calculation, Simulation and Measurement

    Current Sense Transformer Datasheet and Design‑in Guide

    Designing a USB Type‑C Flyback Planar Transformer with Frenetic’s Planar Tool

    Magnetics Design in High‑Frequency GaN Converters

    Qi2 Wireless Charging: Inductors, Capacitors and EMC Filters

    Two‑capacitor paradox explained for engineers

    Capacitances of Nonlinear MLCCs: What Datasheets Don’t Tell You

    Tapped Inductor Buck Converter Fundamentals

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • DossiersNew
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    Modelithics Releases COMPLETE Library v26.2 for Keysight Genesys

    Why Isolated DC/DC Power Supplies Fail Late, Würth Elektronik Podcast

    Wk 23 Electronics Supply Chain Digest

    Power Converter Dossier: Passive Components Design and Selection Guide 2026

    Evans Group Unifies Four High-Rel Capacitor Leaders

    Skeleton Releases Graphene‑Based UPS for AI Data Centers

    Designing 800 V DC EMC Filters: Calculation, Simulation and Measurement

    TDK Releases DC-link Film Capacitors with Ultra-low Inductance for SiC Power Converters

    Murata Introduces World First 2.2uF 100V Soft‑Term MLCC in 0805 Size for Automotive

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    Why Isolated DC/DC Power Supplies Fail Late, Würth Elektronik Podcast

    Designing 800 V DC EMC Filters: Calculation, Simulation and Measurement

    Current Sense Transformer Datasheet and Design‑in Guide

    Designing a USB Type‑C Flyback Planar Transformer with Frenetic’s Planar Tool

    Magnetics Design in High‑Frequency GaN Converters

    Qi2 Wireless Charging: Inductors, Capacitors and EMC Filters

    Two‑capacitor paradox explained for engineers

    Capacitances of Nonlinear MLCCs: What Datasheets Don’t Tell You

    Tapped Inductor Buck Converter Fundamentals

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • DossiersNew
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

New Approach Uses Light Instead of Robots to Assemble Electronic Components

9.11.2017
Reading Time: 4 mins read
A A

source: OSA.org news

WASHINGTON — An international team of researchers has developed a new light-based manipulation method that could one day be used to mass produce electronic components for smartphones, computers and other devices. A cheaper and faster way to produce these components could make it less expensive to connect everyday objects — from clothing to household appliances — to the internet, advancing the concept known as the Internet of Things. The micromanipulation technique might also be used to create a safer and faster-charging replacement for mobile device batteries.
Optical traps, which use light to hold and move small objects in liquid, are a promising non-contact method for assembling electronic and optical devices. However, when using these traps for manufacturing applications, the liquid must be removed, a process that tends to displace any pattern or structure that has been formed using an optical trap.

RelatedPosts

Modelithics Releases COMPLETE Library v26.2 for Keysight Genesys

Why Isolated DC/DC Power Supplies Fail Late, Würth Elektronik Podcast

Wk 23 Electronics Supply Chain Digest

In The Optical Society (OSA) journal Optics Express, researchers in Steven Neale’s Micromanipulation Research Group, University of Glasgow, Scotland, detail their method for using an advanced optical trapping approach known as optoelectronic tweezers to assemble electrical contacts. Thanks to an innovative freeze-drying method developed by Shuailong Zhang, a member of Neale’s research group, the liquid could be removed without disturbing the assembled components.

“The forces formed by these optoelectronic tweezers have been compared to Star-Trek like tractor beams that can move objects through a medium with nothing touching them,” said Neale. “This conjures up images of assembly lines with no robotic arms. Instead, discrete components assemble themselves almost magically as they are guided by the patterns of light.”

 

 

 

After using optoelectronic tweezers to assemble a line of solder beads (a), the researchers froze the liquid (b) and then reduced the pressure so that the frozen liquid turned directly from a solid into a gas, drying out the device (c). They then heated the beads to fuse them into an electrical connection. Image Credit: Shuailong Zhang

The researchers demonstrated the technique by assembling a pattern of tiny solder beads with an optoelectronic trap, removing the liquid, and then heating the pattern to fuse the beads together, forming electrical connections. They used the solder beads to demonstrate that in the future, these microparticles could be assembled and fused to create electrical connections.

“Optoelectronic tweezers are cost-effective and allow parallel micromanipulation of particles,” said Zhang, who is now at the University of Toronto in Canada. “In principle, we can move 10,000 beads at the same time. Combining this with our freeze-drying approach creates a very inexpensive platform that is suitable for use in mass production.”

Improved electronics manufacturing
The new technique could offer an alternative way to make the circuit boards that connect the components found in most of today’s electronics. These types of devices are currently made using automated machines that pick up tiny parts, place them onto the circuit board and solder them into place. This process requires an expensive motorized stage to position the board and a costly high-precision robotic arm to pick up and place the tiny parts onto the device. The cost of these micromanipulation systems continues to rise as the shrinking size of electronics increases precision requirements.

“The optoelectronic tweezers and freeze-drying technique can be used to not only assemble solder beads, but also to assemble a broad range of objects such as semiconductor nanowires, carbon nanotubes, microlasers and microLEDs,” said Zhang. “Eventually, we want to use this tool to assemble electronic components such as capacitors and resistors as well as photonic devices, such as lasers and LEDs, together in a device or system.”

Trapping particles with optoelectronic manipulation
The researchers used optoelectronic tweezers because this optical manipulation approach can form thousands of traps at once, offering the potential of massively parallel assembly. The tweezers are formed using a layer of silicon that changes its electrical conductivity when exposed to light. In the areas exposed to points of light, a non-uniform electric field forms that interacts with particles or beads in a liquid layer on top of the silicon, allowing the particles to be precisely moved by moving the point of light. Creating patterns of light points allows multiple particles to be moved simultaneously.

“Using our method, we can move solder beads measuring from the nanometer range up to about 150 microns,” said Zhang. “We have been able to move objects that are over 150 microns, but it’s more challenging because as the size of the object increases, the frictional force also increases.”

After using the optoelectronic tweezers to assemble a pattern of 40-micron-diameter, commercially available solder beads, the researchers froze the liquid in the optoelectronic tweezer device and then reduced the surrounding pressure to allow the frozen liquid to turn from a solid directly into a gas. This freeze-drying approach allowed the assembled solder beads to remain fixed in place after the liquid was removed. The researchers say it can be used to remove liquid used with any type of optical trap, or even traps formed with acoustic waves.

In addition to assembling the solder beads into different lines, the researchers also demonstrated parallel assembly of several beads and used the beads to form electrical connections. The solder beads exhibit a strong dielectric force, which means they can be moved accurately and fast, allowing very efficient assembly of structures.

The researchers are now working to turn their laboratory-based system into one that would combine the optoelectronic tweezer and freeze-drying process in a single unit. They are also developing a software interface to control the generation of a light pattern based on the number of particles that needed to be trapped.

“We are now using a computer to generate the light pattern to move the beads, but we are working on an app that would allow a tablet or smart phone to be used instead,” said Zhang. “This could allow someone to sit away from the system and use their finger to control the movements of the particles, for example.”

Neale recently received funding to continue this line of research by using the new optical micromanipulation approach to create high energy density capacitors to replace batteries in mobile devices.

The full paper can is available online: S. Zhang, Y. Liu, Y. Qian, W. Li, J. Juvert, P. Tian, J.-C. Navarro, A.W. Clark, E. Gu, M.D. Dawson, J.M. Cooper, S.L. Neale, “Manufacturing with light – micro-assembly of opto-electronic microstructures,” Opt. Express, Volume 25, Issue 23, 28838-28850 (2017).
DOI: 10.1364/OE.25.028838.

Related

Recent Posts

Modelithics Releases COMPLETE Library v26.2 for Keysight Genesys

8.6.2026
9

Power Converter Dossier: Passive Components Design and Selection Guide 2026

5.6.2026
33

Evans Group Unifies Four High-Rel Capacitor Leaders

5.6.2026
26

Skeleton Releases Graphene‑Based UPS for AI Data Centers

5.6.2026
31

TDK Releases DC-link Film Capacitors with Ultra-low Inductance for SiC Power Converters

4.6.2026
45

Murata Introduces World First 2.2uF 100V Soft‑Term MLCC in 0805 Size for Automotive

4.6.2026
34

Nvidia Vera Rubin: Why One AI Rack Needs So Many More MLCC Capacitors

2.6.2026
226

Stackpole Introduces 1400A Busbar Shunt Resistors

2.6.2026
28

Tecate Unveils High‑temp 105C Supercapacitors for Harsh‑Environment Designs

2.6.2026
22

Upcoming Events

Jun 16
16:00 - 17:00 CEST

EMC with EMC – EMC‑compliant design with electromechanical connectors

Jul 14
16:00 - 17:00 CEST

EMC Design Essentials: Mastering Varistors and Common Mode Chokes

Jul 21
16:00 - 17:00 CEST

Safety by design: X and Y Interference suppression capacitors for power line filters

View Calendar

Popular Posts

  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • MLCC and Ceramic Capacitors

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • What Electronics Engineer Needs to Know About Passive Low Pass Filters

    0 shares
    Share 0 Tweet 0
  • Dual Active Bridge (DAB) Topology

    0 shares
    Share 0 Tweet 0
  • SEPIC Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Capacitor Charging and Discharging

    0 shares
    Share 0 Tweet 0
  • Earthing Systems and IEC Classification Explained

    0 shares
    Share 0 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© EPCI - Leading Passive Components Educational and Information Site

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • Dossiers
  • PCNS

© EPCI - Leading Passive Components Educational and Information Site

This website uses cookies. By continuing to use this website you are giving consent to cookies being used. Visit our Privacy and Cookie Policy.
Go to mobile version