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    Power line EMI filter on a copper ground-plane fixture connected to a vector network analyzer with a toroidal balun

    How to Measure Filter Performance: Insertion Loss, VNA Fixtures and CM/DM Separation

    Assorted EMI and RF filter components: common mode choke, ferrite beads, feedthrough filter, X2 capacitor, cavity filter, ceramic coaxial resonators, thin-film filter and SAW/BAW packages

    Passive Filter Technologies Compared: LC, Ferrite, Feedthrough, Ceramic, Cavity, Microstrip, SAW and BAW

    Illustration of a thin-film capacitor stack with TiN electrodes and an ultrathin hafnium zirconium oxide ferroelectric layer on silicon

    Sub-Volt Ferroelectric HZO Capacitor Pairs Speed and Endurance

    Cut-open lithium-ion capacitor pouch cell showing stacked carbon electrodes and separators, with vials of carbon powder

    Lithium-Ion Capacitor Review Backs Hard Carbon//AC Pairing

    Rack power shelf in an AI data center with film DC-link capacitors, a supercapacitor bank and a converter board

    800 VDC AI Data Centers Reshape Capacitor Demand for 2027

    Schematic of a titanium nitride thin-film inductor within a CMOS poly-resistor stack beside its integrated resonator circuit.

    TiN Superinductors Bring Compact Cryogenic Inductance to CMOS

    Close-up of reddish-brown metallic rocks illustrating TTI MarketEYE’s connector raw material cost analysis

    Connector Raw Material Costs Rise 20.9% in Q2 2026

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    YAGEO PMT6397 push-pull transformer with a segmented toroidal winding and surface-mount terminals

    YAGEO Releases Push-Pull Transformers for Isolated 3 W Supplies

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    Power line EMI filter on a copper ground-plane fixture connected to a vector network analyzer with a toroidal balun

    How to Measure Filter Performance: Insertion Loss, VNA Fixtures and CM/DM Separation

    Assorted EMI and RF filter components: common mode choke, ferrite beads, feedthrough filter, X2 capacitor, cavity filter, ceramic coaxial resonators, thin-film filter and SAW/BAW packages

    Passive Filter Technologies Compared: LC, Ferrite, Feedthrough, Ceramic, Cavity, Microstrip, SAW and BAW

    Illustration of a thin-film capacitor stack with TiN electrodes and an ultrathin hafnium zirconium oxide ferroelectric layer on silicon

    Sub-Volt Ferroelectric HZO Capacitor Pairs Speed and Endurance

    Cut-open lithium-ion capacitor pouch cell showing stacked carbon electrodes and separators, with vials of carbon powder

    Lithium-Ion Capacitor Review Backs Hard Carbon//AC Pairing

    Rack power shelf in an AI data center with film DC-link capacitors, a supercapacitor bank and a converter board

    800 VDC AI Data Centers Reshape Capacitor Demand for 2027

    Schematic of a titanium nitride thin-film inductor within a CMOS poly-resistor stack beside its integrated resonator circuit.

    TiN Superinductors Bring Compact Cryogenic Inductance to CMOS

    Close-up of reddish-brown metallic rocks illustrating TTI MarketEYE’s connector raw material cost analysis

    Connector Raw Material Costs Rise 20.9% in Q2 2026

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    YAGEO PMT6397 push-pull transformer with a segmented toroidal winding and surface-mount terminals

    YAGEO Releases Push-Pull Transformers for Isolated 3 W Supplies

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Q1 was worst quarterly semi performance for 10 years

30.5.2019
Reading Time: 2 mins read
A A
detail of a silicon chip wafer reflecting different colors

detail of a silicon chip wafer reflecting different colors

Source: Electronics Weekly news

In Q1 the chip market posted its worst quarterly performance in 10 years, according to IHS Markit.

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How to Measure Filter Performance: Insertion Loss, VNA Fixtures and CM/DM Separation

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Sub-Volt Ferroelectric HZO Capacitor Pairs Speed and Endurance

Revenues fell to $101.2 billion in Q1,;down 12.9% from $116.2 billion in Q118. This represented the largest y-o-y quarterly decrease since the second quarter of 2009. Memory drove the sales plunge exacerbated by excess inventory and falling demand from key end markets. If memory were excluded from total semiconductor revenue, the market would have declined by ~4.4% on a y-o-y basis.

Of the top ten vendors,

  • Samsung’s sales dropped most falling by 34.6% y-o-y.Samsung, (at No.2 in the rankings) was hit by falling demand, rising inventory and plunging prices for memory chips, which constituted nearly 84% of the company’s semiconductor business in Q1.
  • Hynix, at No.3, had  a 26.3% revenue drop and  Micron, at No.4, fell by 22.5% compared Q118.
  • The memory market fell 25% q-o-q with DRAM revenues down 26.1% sequentially, while NAND flash declined by 23.8%.
  • Intel, at No.1,  posted the best performance among the top-10 competitors in the first quarter, with sales falling by a negligible 0.3% year-over-year. Intel escaped the worst effects of the chip downturn because the company is not heavily exposed to memory sales, with memory chips accounting for less than 6% of company revenues. However, the company’s microprocessor business was still affected by rising inventory and decreasing demand from the PC, enterprise and cloud sectors. Based on its relatively strong results, Intel was able to hold on to the top spot in the semiconductor rankings in the first quarter of 2019. This represented the second consecutive quarter that Intel has held market leadership, after moving past Samsung in the fourth quarter of 2018.
  • Infineon rose three places un the rankings  to take eighth place. Infineon outperformed its competitors by limiting its sequential revenue decline to just 0.3% boosted by auto IC sales.
  • ST’s sales declined by 6.7% year-over-year because of sluggish sales in the wireless market.
  • Nvidia had  the third-worst results of the top-10 players in Q1 with a 23.7% y-o-y revenue drop. Nvidia’s results were impacted by the steep decline of cryptocurrency and AMD’s move to push its GPU products into data center applications – directly competing with Nvidia.

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