Passive Components Blog
No Result
View All Result
  • Home
  • News
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    Samsung MLCC Revenue Seen Above KRW 8T by 2027, Murata EOL Actions Reshape Supply

    ROHM SDR01 high anti-surge thick-film chip resistor in 1005 metric 0402 package with 0.33 W rated power

    ROHM Introduces Anti-Surge 0402 Resistors Rated at 0.33 W

    ECIA Industry Pulse Q3 2026 chart showing passive components, semiconductors and electro-mechanical component market sentiment and lead-time pressure

    ECIA Industry Pulse Moderates as Passive Lead Times Tighten

    LG Innotek Demonstrates FC-BGA Substrates With Embedded Silicon Capacitors for AI Power Delivery

    On-Chip 3D-Printed Copper Microinductors: A New Route to Compact RF Electronics

    Emerging Capacitor Markets in Fusion Energy

    Murata DLW32SH_MF 1210 surface-mount common mode choke coil with metal terminals for automotive CAN FD signal-line noise suppression

    Murata Introduces Common Mode Chokes for Automotive CAN FD up to 150°C

    onsemi solid-state transformer concept for 800 V HVDC AI data center power conversion with SiC modules, DC-link capacitors and high-frequency magnetics

    Solid-State Transformers for 800 V AI Data Centers: Passive Component Design Considerations

    Littelfuse TX00AT314AMA omnipolar TMR magnetic switch sensor in a leaded TO-92-3 through-hole package

    Littelfuse Expands Omnipolar TMR Switch with Leaded TO-92 Package Option

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • Knowledge Blog
  • Dossiers
    • AI Hardware Dossier
    • Automotive Dossier
    • Industrial Robotics Dossier
    • Power Converter Dossier
    • Capacitor Dossier
    • Resistor Dossier
    • Inductor Dossier
    • Circuit Protection Dossier
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
  • Home
  • News
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    Samsung MLCC Revenue Seen Above KRW 8T by 2027, Murata EOL Actions Reshape Supply

    ROHM SDR01 high anti-surge thick-film chip resistor in 1005 metric 0402 package with 0.33 W rated power

    ROHM Introduces Anti-Surge 0402 Resistors Rated at 0.33 W

    ECIA Industry Pulse Q3 2026 chart showing passive components, semiconductors and electro-mechanical component market sentiment and lead-time pressure

    ECIA Industry Pulse Moderates as Passive Lead Times Tighten

    LG Innotek Demonstrates FC-BGA Substrates With Embedded Silicon Capacitors for AI Power Delivery

    On-Chip 3D-Printed Copper Microinductors: A New Route to Compact RF Electronics

    Emerging Capacitor Markets in Fusion Energy

    Murata DLW32SH_MF 1210 surface-mount common mode choke coil with metal terminals for automotive CAN FD signal-line noise suppression

    Murata Introduces Common Mode Chokes for Automotive CAN FD up to 150°C

    onsemi solid-state transformer concept for 800 V HVDC AI data center power conversion with SiC modules, DC-link capacitors and high-frequency magnetics

    Solid-State Transformers for 800 V AI Data Centers: Passive Component Design Considerations

    Littelfuse TX00AT314AMA omnipolar TMR magnetic switch sensor in a leaded TO-92-3 through-hole package

    Littelfuse Expands Omnipolar TMR Switch with Leaded TO-92 Package Option

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • Knowledge Blog
  • Dossiers
    • AI Hardware Dossier
    • Automotive Dossier
    • Industrial Robotics Dossier
    • Power Converter Dossier
    • Capacitor Dossier
    • Resistor Dossier
    • Inductor Dossier
    • Circuit Protection Dossier
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

Ripple Current and MLCC: Basic principles; Kemet Tech Paper

7.5.2021
Reading Time: 6 mins read
A A

When talking about ripple current in capacitors, terms like ESR, overheating, lifetime and reliability cannot be out of the conversation. Choosing the correct solution by considering the ripple current of the application could prevent shorter component lifetime. See Kemet Technical paper that explains the basic principles.

WHAT IS RIPPLE CURRENT?

RelatedPosts

Tantalum Capacitor History

Understanding the Influence of ESR and Ripple Current for the Capacitor Selection

Resonant OBC Capacitors

Ripple current is the AC current that enters and leaves the capacitor during its operation in a circuit.
Ripple current generates heat and increase the temperature of the capacitor. This rate of heat generation in a capacitor can be described by using the common power formula:


Pdis = power dissipated
Irms = rms value of the ripple current
ESR = equivalent series resistance

HEAT AND RIPPLE CURRENT RELATION

As there is a heat generation, there is also a rate of heat removal (Prem) from the capacitor:

Rth is the thermal resistance (°C/watt)
ΔT is the temperature rise of the capacitor (°C)

At steady state Pdis = Prem, so:

It is important to mention that is influenced by factors as MLCC design, ambient temperature, PCB characteristics, circuit design, pads, trace thickness, etc.

Figure 1 –Temperature rise comparison by dielectrics.

AC VOLTAGE CONSIDERATIONS

MLCCs normally rated at DC voltages still can be used in AC applications, but there are some considerations since DC ≠ AC (e.g. 100 VDC ≠ 100 VAC):

  • Heating due to losses (Current limited region)
  • High AC voltages (Voltage limited region)
Figure 2–AC Voltage VS AC Current limited regions

Heating due to I2R losses (Current limited region)

If the voltage is known, this equation can be used to calculate the AC current by following the conventional RLC equivalent circuit and capacitor parameters:

If AC Voltage is held constant, higher frequencies, as well as higher capacitance, result in higher AC currents, even with low AC voltages.

Power can be calculated by using equation [3] with capacitor and application parameters, in order to determine if the chosen MLCC is suitable for it.

Table 1–Thermal risk due to ripple current

High AC Voltages (Voltage limited region)

Figure 2 shows that at lower frequencies no more voltage is allowed, and the reason is that the amount of power dissipated is not high enough to overcome the following two rules for max voltage allowed for an MLCC.

Even if ripple current does not cause excessive heating, peak AC voltage (vp) needs to be considered.

Vp from AC waveform plus the DC voltage must be less than the rated DC voltage of the MLCC.

Vp from AC waveform must be less than the rated DC voltage of the MLCC divided by two.

Then, if the current is known, the AC voltage can be calculated by the following formula:

If AC Current is held constant, lower frequencies, as well as lower capacitance, results in higher AC voltages.

EXTERNAL FACTORS AFFECTING CURRENT

AC Current not only depends on the  losses, but also:

  • Ambient temperature.
  • Thermal characteristics of PCB.
  • Active/passive cooling of the MLCC.
  • Proximity of the part to other sources of heat.

FINAL RECOMMENDATIONS

When working with high ripple current, recommended MLCCs are Class I dielectrics which have a higher ripple current capability, compared against Class II. If more capability is needed, stacking capacitor solution as KEMET KC-LINK™ which is a Class I 150°C, could be an option.

This last technology is also available merged with KONNEKT™ Technology, that stacked in low loss orientation offers even a higher ripple current capability.

How to determine and measure MLCC ripple current and ESR

Related

Source: Kemet Electronics

Recent Posts

Samsung MLCC Revenue Seen Above KRW 8T by 2027, Murata EOL Actions Reshape Supply

11.9.2026
17

LG Innotek Demonstrates FC-BGA Substrates With Embedded Silicon Capacitors for AI Power Delivery

10.9.2026
30

Emerging Capacitor Markets in Fusion Energy

10.9.2026
33
onsemi solid-state transformer concept for 800 V HVDC AI data center power conversion with SiC modules, DC-link capacitors and high-frequency magnetics

Solid-State Transformers for 800 V AI Data Centers: Passive Component Design Considerations

9.9.2026
69
TDK CN series 10 µF 100 V X7R soft-termination multilayer ceramic capacitor in 3225 EIA 1210 package

TDK Releases 100 V Soft-Termination X7R MLCCs 10 uF in 3225 Package

9.9.2026
14
Overview of fabricated ferroelectric capacitors improving hyperdimensional computing task learning accuracy. a The experimental work reported in this study comprises ferroelectric capacitor (FeCAP) device fabrication, structural and electrical characterization, analog state identification and their reliability study. b The computational part of the work explores the benefits of using characteristics from the fabricated devices in a hyperdimensional computing scheme; source: authors

High-Precision Hyperdimensional Computing with Multi-Level Ferroelectric HZO Capacitors

7.9.2026
23

August 2026 Interconnect, Passives and Electromechanical Components Market Insights

4.9.2026
53

Knowles Cornell Dubilier 105C Flatpack Aluminum Electrolytic Capacitors Target Low-Profile High-Density Power Designs

4.9.2026
43

Samsung Electro-Mechanics Secures KRW 1.0722 Trillion AI Server MLCC Supply Contract

3.9.2026
71

Upcoming Events

Sep 16
17:00 - 18:00 CEST

Designing a 5 kW, 800 V-to-50 V PSFB Converter for Next-Generation Data Centers

Sep 29
16:00 - 17:00 CEST

Cybersecurity 2026

Nov 24
16:00 - 17:00 CET

Component selection with the WE REDEXPERT® DC-DC Converter Designer Tool

View Calendar

Popular Posts

  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Earthing Systems and IEC Classification Explained

    0 shares
    Share 0 Tweet 0
  • MLCC and Ceramic Capacitors

    0 shares
    Share 0 Tweet 0
  • Resistor Symbols

    0 shares
    Share 0 Tweet 0
  • Capacitor Charging and Discharging

    0 shares
    Share 0 Tweet 0
  • Audio Capacitors: Choosing Capacitors for Crossover Circuits

    0 shares
    Share 0 Tweet 0
  • Ohm’s Law Answers Your Questions

    0 shares
    Share 0 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© 2015–2026
All rights reserved

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • Dossiers
  • PCNS

© 2015–2026
All rights reserved