Passive Components Blog
No Result
View All Result
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    Würth Elektronik Coupled Inductors Harnessing Leakage Inductance in SEPIC, ZETA and Ćuk Converters

    Samsung Introduces Ultra‑compact, High‑Capacitance MLCCs for AI Edge and Wearable designs

    Knowles Presents Pulse Power Capacitors for Demanding MedTech, Industrial and Defense Applications

    Bourns Introduces LTCC Band Pass Filters for 5G C‑Band RF Front‑End Designs

    YAGEO Extends its Supercapacitor Series Line-Up

    SCHURTER Presents EKO High‑Voltage Fuses for Global Energy Systems

    June 2026: AI Demand Pushes Japanese and Korean MLCC Makers to Five‑Year Shipment High

    TDK Releases SMD Common‑Mode Chokes for Compact High‑Current EMI Filtering

    July 2026 Interconnect, Passives and Electromechanical Components Market Insights

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    EMC Design Fundamentals: Safe Use of Varistors and Common Mode Chokes in Mains and Data-Line Filters

    Ferrite versus Nanocrystalline Power Inductor Cores: Turns, Gap and Size

    KYOCERA AVX Presents Antenna Integrator Studio Tutorial for Antenna Placement and RF Design

    Power Design Simulation Tools for Faster Inductor Selection and Loss Optimization

    EMC‑Compliant PCB and Connector Design Guidelines

    Why Isolated DC/DC Power Supplies Fail Late, Würth Elektronik Podcast

    Designing 800 V DC EMC Filters: Calculation, Simulation and Measurement

    Current Sense Transformer Datasheet and Design‑in Guide

    Designing a USB Type‑C Flyback Planar Transformer with Frenetic’s Planar Tool

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • Dossiers
    • AI Hardware Dossier
    • Power Converter Dossier
    • Automotive Dossier
    • Capacitor Dossier
    • Resistor Dossier
    • Inductor Dossier
    • Circuit Protection Dossier
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    Würth Elektronik Coupled Inductors Harnessing Leakage Inductance in SEPIC, ZETA and Ćuk Converters

    Samsung Introduces Ultra‑compact, High‑Capacitance MLCCs for AI Edge and Wearable designs

    Knowles Presents Pulse Power Capacitors for Demanding MedTech, Industrial and Defense Applications

    Bourns Introduces LTCC Band Pass Filters for 5G C‑Band RF Front‑End Designs

    YAGEO Extends its Supercapacitor Series Line-Up

    SCHURTER Presents EKO High‑Voltage Fuses for Global Energy Systems

    June 2026: AI Demand Pushes Japanese and Korean MLCC Makers to Five‑Year Shipment High

    TDK Releases SMD Common‑Mode Chokes for Compact High‑Current EMI Filtering

    July 2026 Interconnect, Passives and Electromechanical Components Market Insights

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    EMC Design Fundamentals: Safe Use of Varistors and Common Mode Chokes in Mains and Data-Line Filters

    Ferrite versus Nanocrystalline Power Inductor Cores: Turns, Gap and Size

    KYOCERA AVX Presents Antenna Integrator Studio Tutorial for Antenna Placement and RF Design

    Power Design Simulation Tools for Faster Inductor Selection and Loss Optimization

    EMC‑Compliant PCB and Connector Design Guidelines

    Why Isolated DC/DC Power Supplies Fail Late, Würth Elektronik Podcast

    Designing 800 V DC EMC Filters: Calculation, Simulation and Measurement

    Current Sense Transformer Datasheet and Design‑in Guide

    Designing a USB Type‑C Flyback Planar Transformer with Frenetic’s Planar Tool

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • Dossiers
    • AI Hardware Dossier
    • Power Converter Dossier
    • Automotive Dossier
    • Capacitor Dossier
    • Resistor Dossier
    • Inductor Dossier
    • Circuit Protection Dossier
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

Silicon Materials Allow State-of-the-Art Operating Controls with Elastic Circuits

18.4.2016
Reading Time: 2 mins read
A A

source: INM news

15. April 2016
The research scientists at INM have succeeded in manufacturing circuit paths on thin, elastic foil made of silicone. Since these are relatively insensitive to compression and elongation strain, the electrical circuits can adapt to the curvature of appliances.

RelatedPosts

Würth Elektronik Coupled Inductors Harnessing Leakage Inductance in SEPIC, ZETA and Ćuk Converters

Samsung Introduces Ultra‑compact, High‑Capacitance MLCCs for AI Edge and Wearable designs

Knowles Presents Pulse Power Capacitors for Demanding MedTech, Industrial and Defense Applications

Industry and product designers have a strong interest in being able to install electrical circuits such as display elements or operating controls even on the shaped surfaces of electronic appliances. Now, in the Optical Materials department at INM – Leibniz-Institute for New Materials, this aim has come one step closer. The research scientists have succeeded in manufacturing circuit paths on thin, elastic foil made of silicone. Since these are relatively insensitive to compression and elongation strain, the electrical circuits can adapt to the curvature of appliances.

In future, it will therefore be possible to put console elements or touch sensitive displays on the ergonomically shaped handles of small electrical appliances and household appliances or console elements. Gestures such as lightly touching or wiping the surface still function reliably although the surface is not planar. As a result, in future, conventional buttons, keys or switches will not be necessary.

The researchers have now achieved the possibility of such electronic switching on elastic material on silicone foil using a process known as photochemical metallization. In this process, colorless silver compounds are transformed into electrically conductive silver when a photoactive layer is irradiated by UV light.

Peter William de Oliveira, Head of INM’s program division Optical Materials explains, “First, the silicone foils are coated with a photoactive layer of metal oxide nanoparticles. After that, we apply a specially developed fluid containing colorless silver ions”.

When this sequence of layers is irradiated with UV light, the silver compound disintegrates on the photoactive layer and the silver ions are reduced to form metallic, electrically conductive silver.

By the use of adjustable pattern, the UV irradiation can be controlled. So, paths or other structures on the carrier material are reduced to form silver. In this way, very narrow conductor paths with widths down to only a few micrometers can be produced on the silicone foil. The electronic circuitry is then transparent to the observer.

Until now, researchers have been able to apply this combination of materials in laboratory format in postcard size. In future, developers would like to extend this manufacturing principle in cooperation with interested partners from industry into a roll-to-roll process. This would make allow a fast, economical and environmentally-friendly manufacturing also in large dimensions including in large formats.

INM conducts research and development to create new materials – for today, tomorrow and beyond. Chemists, physicists, biologists, materials scientists and engineers team up to focus on these essential questions: Which material properties are new, how can they be investigated and how can they be tailored for industrial applications in the future? Four research thrusts determine the current developments at INM: New materials for energy application, new concepts for medical surfaces, new surface materials for tribological systems and nano safety and nano bio. Research at INM is performed in three fields: Nanocomposite Technology, Interface Materials, and Bio Interfaces.
INM – Leibniz Institute for New Materials, situated in Saarbrücken, is an internationally leading centre for materials research. It is an institute of the Leibniz Association and has about 220 employees.

Related

Recent Posts

Can Copper Conductive Inks Displace Silver in Hybrid Electronics?

14.7.2026
81

YAGEO Presents NANOMET Soft Magnetic Cores for High‑Density Power Conversion

8.7.2026
173

High-Crystallinity Nanocrystalline Composites for MHz Chip Inductors

7.5.2026
152

Kyocera Developed Multilayer Ceramic Core Substrate for AI Packages

30.4.2026
202

Peak Nano to Develop Fusion Grade High Energy Film Capacitors

11.3.2026
84

Paumanok Unveils Aluminum Capacitor Foils World Markets Study 2025-2030

6.11.2025
72

Murata and QuantumScape Joint Development for Solid Batteries Ceramic Separators

14.10.2025
82

Researchers Demonstrated High Energy Ceramic Capacitors Stable in Wide Temperature Range

2.10.2025
60

Improving SMPS Performance with Thermal Interface Material

30.9.2025
64

Upcoming Events

Jul 29
17:30 - 18:30 CEST

To Ferrite or to Nanocrystalline in Transformer Design

Sep 29
16:00 - 17:00 CEST

Cybersecurity 2026

View Calendar

Popular Posts

  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • YAGEO Announces July 2026 Capacitor Price Increase

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • MLCCs in the Age of AI: Q2 2026 Market Tightness

    0 shares
    Share 0 Tweet 0
  • MLCC and Ceramic Capacitors

    0 shares
    Share 0 Tweet 0
  • Earthing Systems and IEC Classification Explained

    0 shares
    Share 0 Tweet 0
  • Dual Active Bridge (DAB) Topology

    0 shares
    Share 0 Tweet 0
  • Nvidia Vera Rubin: Why One AI Rack Needs So Many More MLCC Capacitors

    0 shares
    Share 0 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© EPCI - Leading Passive Components Educational and Information Site

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • Dossiers
  • PCNS

© EPCI - Leading Passive Components Educational and Information Site

This website uses cookies. By continuing to use this website you are giving consent to cookies being used. Visit our Privacy and Cookie Policy.