Passive Components Blog
No Result
View All Result
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    Bourns Releases High Current Metal Alloy-based, Multilayer Power Chip Inductors

    Smiths Interconnect Extends Space-Qualified, High-Reliability Fixed Chip Attenuators 

    Samtec Expands Offering of Slim, High-Density HD Array Connectors

    Bourns Unveils High-Precision Wirewound Resistor with Long-Term Stability

    Common Mode Chokes Selection for RF Circuits in Next-Generation Communication Systems

    Capacitor Self-balancing in a Flying-Capacitor Buck Converter

    Littelfuse Acquires Basler Electric Enhancing High-Growth Industrial Market

    DigiKey Grows Inventory with Over 31K New Stocking Parts in Q3 2025

    Murata Expands Automotive Metal Frame Y2/X1 Safety MLCC Capacitors to 500V

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    Common Mode Chokes Selection for RF Circuits in Next-Generation Communication Systems

    Capacitor Self-balancing in a Flying-Capacitor Buck Converter

    How to Select Ferrite Bead for Filtering in Buck Boost Converter

    Power Inductors Future: Minimal Losses and Compact Designs

    Percolation Phenomenon: Degradation of Molded Power Inductors in DC/DC Converters

    Connector PCB Design Challenges

    Efficient Power Converters: Duty Cycle vs Conduction Losses

    Ripple Steering in Coupled Inductors: SEPIC Case

    SEPIC Converter with Coupled and Uncoupled Inductors

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    Bourns Releases High Current Metal Alloy-based, Multilayer Power Chip Inductors

    Smiths Interconnect Extends Space-Qualified, High-Reliability Fixed Chip Attenuators 

    Samtec Expands Offering of Slim, High-Density HD Array Connectors

    Bourns Unveils High-Precision Wirewound Resistor with Long-Term Stability

    Common Mode Chokes Selection for RF Circuits in Next-Generation Communication Systems

    Capacitor Self-balancing in a Flying-Capacitor Buck Converter

    Littelfuse Acquires Basler Electric Enhancing High-Growth Industrial Market

    DigiKey Grows Inventory with Over 31K New Stocking Parts in Q3 2025

    Murata Expands Automotive Metal Frame Y2/X1 Safety MLCC Capacitors to 500V

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    Common Mode Chokes Selection for RF Circuits in Next-Generation Communication Systems

    Capacitor Self-balancing in a Flying-Capacitor Buck Converter

    How to Select Ferrite Bead for Filtering in Buck Boost Converter

    Power Inductors Future: Minimal Losses and Compact Designs

    Percolation Phenomenon: Degradation of Molded Power Inductors in DC/DC Converters

    Connector PCB Design Challenges

    Efficient Power Converters: Duty Cycle vs Conduction Losses

    Ripple Steering in Coupled Inductors: SEPIC Case

    SEPIC Converter with Coupled and Uncoupled Inductors

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

Smolteks CNF-MIM Capacitors Meet Thermal and Voltage Stability Industry Requirements

30.6.2025
Reading Time: 2 mins read
A A

Smoltek is pleased to announce a significant milestone in the development of next-generation CNF-MIM wafer based capacitors. The latest prototypes of the capacitors have demonstrated exceptional stability under both temperature and voltage stress.

Smoltek Semi has successfully fabricated samples from the latest prototype generation using an advanced dielectric stack composed of zirconium oxide (ZrO₂) and aluminum oxide (Al₂O₃) that meets 125°C temperature and voltage stability.

RelatedPosts

Smolteks CNF MIM Capacitor Break 1 µF/mm²

Smoltek CNF-MIM Capacitor Commercialization Update

Smoltek is Closer to Establish CNF-MIM Capacitors Pilot Production

Dr. Farzan Ghavanini, CTO at Smoltek, emphasizes the significance of this breakthrough in CNF-MIM performance.

The combination of CNF electrodes with a ZrO₂/Al₂O₃ stack not only leverages the proven reliability of DRAM-grade dielectrics but also delivers exceptional TCC and VCC characteristics that surpass those of ultra-thin MLCCs currently used as landside decoupling capacitors in high-end processors.

Key Performance Highlights:

– Thermal Stability (TCC): The tested capacitors exhibited robust performance up to 125°C, maintaining only a slight 2.5% change in capacitance from room temperature (22°C). No signs of degradation were observed, indicating the durability and reliability of the dielectric stack under extended thermal stress.

– Voltage Stability (VCC): When tested across a bipolar voltage range of ±4V, the devices demonstrated minimal capacitance changes, with only about 3% variation. This further validates the dielectric integrity of the capacitors. Notably, at a 2V operating range, the target rating voltage for landside applications, the capacitance shift was contained within approximately 1%, highlighting the suitability of these devices for high-performance systems.

A Leap Forward in Smoltek’s CNF-MIM Technology:

The advanced dielectric stack, composed of zirconium oxide (ZrO₂) and aluminum oxide (Al₂O₃), used in Smotek Semi’s prototypes is the same stack employed in the charge storage capacitors of most advanced DRAM technologies.

In the next phase, Smoltek’s CNF-MIM capacitors will undergo extensive accelerated life testing to further validate their long-term reliability under various operating conditions.

Temperature Coefficient of Capacitance (TCC) and Voltage Coefficient of Capacitance (VCC) are two important concepts in the field of electronics. TCC describes the change in capacitance of a capacitor as the temperature varies, while VCC describes the change in capacitance under the influence of applied DC voltage. Understanding these coefficients is crucial for selecting and applying capacitors effectively, especially in circuits where temperature or voltage fluctuations can impact the performance of the device.

Related

Source: Smoltek

Recent Posts

Capacitor Self-balancing in a Flying-Capacitor Buck Converter

30.10.2025
5

Murata Expands Automotive Metal Frame Y2/X1 Safety MLCC Capacitors to 500V

30.10.2025
13

Exxelia 4-Terminal Safety Capacitors Compliant with NF F 62-102 Railway Standard

27.10.2025
25

Samsung Releases Automotive Molded 2220 1kV C0G MLCC

23.10.2025
43

VINATech Offers Smallest 100µF Al-Hybrid Capacitor

23.10.2025
41

Murata Integrates Component Models into Cadence EDA Tools

21.10.2025
48

High Energy Density Polymer Film Capacitors via Molecular and Interfacial Design

15.10.2025
32

KYOCERA AVX Expands Stacked MLCC Capacitors Offering

14.10.2025
50

Silicon Capacitors Market: Shaping the Foundation for Next-Gen Miniaturization Electronics

10.10.2025
87

Enhancing Energy Density in Nanocomposite Dielectric Capacitors

9.10.2025
44

Upcoming Events

Nov 4
10:00 - 11:00 PST

Design and Stability Analysis of GaN Power Amplifiers using Advanced Simulation Tools

Nov 4
November 4 @ 12:00 - November 6 @ 14:15 EST

Wirebond Materials, Processes, Reliability and Testing

Nov 6
14:30 - 16:00 CET

Self-healing polymer materials for the next generation of high-temperature power capacitors

View Calendar

Popular Posts

  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Ripple Current and its Effects on the Performance of Capacitors

    3 shares
    Share 3 Tweet 0
  • MLCC and Ceramic Capacitors

    0 shares
    Share 0 Tweet 0
  • Dual Active Bridge (DAB) Topology

    0 shares
    Share 0 Tweet 0
  • What is a Dielectric Constant and DF of Plastic Materials?

    4 shares
    Share 4 Tweet 0
  • SEPIC Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Flying Capacitors

    0 shares
    Share 0 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© EPCI - Leading Passive Components Educational and Information Site

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • PCNS

© EPCI - Leading Passive Components Educational and Information Site

This website uses cookies. By continuing to use this website you are giving consent to cookies being used. Visit our Privacy and Cookie Policy.
Go to mobile version