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    Assorted EMI and RF filter components: common mode choke, ferrite beads, feedthrough filter, X2 capacitor, cavity filter, ceramic coaxial resonators, thin-film filter and SAW/BAW packages

    Passive Filter Technologies Compared: LC, Ferrite, Feedthrough, Ceramic, Cavity, Microstrip, SAW and BAW

    Illustration of a thin-film capacitor stack with TiN electrodes and an ultrathin hafnium zirconium oxide ferroelectric layer on silicon

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    Cut-open lithium-ion capacitor pouch cell showing stacked carbon electrodes and separators, with vials of carbon powder

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    Rack power shelf in an AI data center with film DC-link capacitors, a supercapacitor bank and a converter board

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    Schematic of a titanium nitride thin-film inductor within a CMOS poly-resistor stack beside its integrated resonator circuit.

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    Close-up of reddish-brown metallic rocks illustrating TTI MarketEYE’s connector raw material cost analysis

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    AI and Passive Components: Structural Growth Beyond Data Centers

    YAGEO PMT6397 push-pull transformer with a segmented toroidal winding and surface-mount terminals

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    Assorted EMI and RF filter components: common mode choke, ferrite beads, feedthrough filter, X2 capacitor, cavity filter, ceramic coaxial resonators, thin-film filter and SAW/BAW packages

    Passive Filter Technologies Compared: LC, Ferrite, Feedthrough, Ceramic, Cavity, Microstrip, SAW and BAW

    Illustration of a thin-film capacitor stack with TiN electrodes and an ultrathin hafnium zirconium oxide ferroelectric layer on silicon

    Sub-Volt Ferroelectric HZO Capacitor Pairs Speed and Endurance

    Cut-open lithium-ion capacitor pouch cell showing stacked carbon electrodes and separators, with vials of carbon powder

    Lithium-Ion Capacitor Review Backs Hard Carbon//AC Pairing

    Rack power shelf in an AI data center with film DC-link capacitors, a supercapacitor bank and a converter board

    800 VDC AI Data Centers Reshape Capacitor Demand for 2027

    Schematic of a titanium nitride thin-film inductor within a CMOS poly-resistor stack beside its integrated resonator circuit.

    TiN Superinductors Bring Compact Cryogenic Inductance to CMOS

    Close-up of reddish-brown metallic rocks illustrating TTI MarketEYE’s connector raw material cost analysis

    Connector Raw Material Costs Rise 20.9% in Q2 2026

    AI and Passive Components: Structural Growth Beyond Data Centers

    YAGEO PMT6397 push-pull transformer with a segmented toroidal winding and surface-mount terminals

    YAGEO Releases Push-Pull Transformers for Isolated 3 W Supplies

    Transformer Losses and Thermal Design: Modelling and Validation

    Trending Tags

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Stackpole’s Foil on Ceramic Current Sense Resistors Offer Values Down to 2.5 Milliohm

29.3.2019
Reading Time: 1 min read
A A

Source: Stackpole news

RALEIGH,NC (Mar. 27, 2019) –Stackpole’s CSRF series utilizes foil on ceramic technology to achieve very low values in small chip sizes.

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The 0.25W rated CSRF0402–HP,for example,is available in resistance values from 20 milliohm down to 2.5milliohm. TCR ranges from±400 ppm to ±200 ppm are possible depending on resistance value with tolerances as low as 1%.

This combination of small size and low value make the CSRF0402-HPa popular choice fora wide range of portable consumer electronics for power control and battery monitoring.

Pricing for the CSRF0402-HPdepends on resistance value,and tolerance and ranges from $0.205to $0.23 each in full package quantities.

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