Passive Components Blog
No Result
View All Result
  • Home
  • News
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Optoelectronics and Isolation
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    Bourns Adds ACXX57SQ Air Coil Inductors for RF Design

    Samsung Electro-Mechanics MLCC capacitor solutions for high-voltage converter snubbing and GPU power delivery

    Samsung MLCC Options for 1 MW AI Rack Power

    Frenetic planar ER transformer simulation for a 5 kW 800 V-to-50 V PSFB converter, showing low-profile core geometry and high-current planar winding arrangement

    5 kW 800 V-to-50 V PSFB Transformer Design for Data Centers

    Samtec 100-CM 1.0 mm vertical solderless compression-mount 50 ohm RF PCB connector

    Samtec 100-CM 1.0 mm RF Connectors Extend to 120 GHz

    Exxelia PM film capacitor and passive-component technologies for BepiColombo space electronics

    Exxelia Passive Components Support BepiColombo Mission

    TT Electronics OPI1268T green through-hole phototransistor optocoupler used for optical isolation in power systems.

    Optocoupler Reliability: Designing Optical Isolation for 25-Year Grid Assets

    TDK B43657 and B43658 ultra-compact snap-in aluminum electrolytic capacitors for 500 V DC power-supply and DC-link applications

    TDK Extends Compact Snap-In Capacitors to 500 V for AI Servers

    Stackpole RNAN aluminium nitride thin-film chip resistors in 0603, 0805, 1206 and 2512 package sizes for precision high-power electronics

    Stackpole RNAN AlN Thin-Film Resistors Reach 6 W

    binder angled M12-A midmount panel-mount PCB connector for centric board mounting, showing compact front-facing industrial connector geometry

    binder Adds Midmount M12-A PCB Connectors for Slim Sensors

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • Knowledge Blog
  • Dossiers
    • AI Hardware Dossier
    • Automotive Dossier
    • Industrial Robotics Dossier
    • Power Converter Dossier
    • Capacitor Dossier
    • Resistor Dossier
    • Inductor Dossier
    • Circuit Protection Dossier
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
  • Home
  • News
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Optoelectronics and Isolation
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    Bourns Adds ACXX57SQ Air Coil Inductors for RF Design

    Samsung Electro-Mechanics MLCC capacitor solutions for high-voltage converter snubbing and GPU power delivery

    Samsung MLCC Options for 1 MW AI Rack Power

    Frenetic planar ER transformer simulation for a 5 kW 800 V-to-50 V PSFB converter, showing low-profile core geometry and high-current planar winding arrangement

    5 kW 800 V-to-50 V PSFB Transformer Design for Data Centers

    Samtec 100-CM 1.0 mm vertical solderless compression-mount 50 ohm RF PCB connector

    Samtec 100-CM 1.0 mm RF Connectors Extend to 120 GHz

    Exxelia PM film capacitor and passive-component technologies for BepiColombo space electronics

    Exxelia Passive Components Support BepiColombo Mission

    TT Electronics OPI1268T green through-hole phototransistor optocoupler used for optical isolation in power systems.

    Optocoupler Reliability: Designing Optical Isolation for 25-Year Grid Assets

    TDK B43657 and B43658 ultra-compact snap-in aluminum electrolytic capacitors for 500 V DC power-supply and DC-link applications

    TDK Extends Compact Snap-In Capacitors to 500 V for AI Servers

    Stackpole RNAN aluminium nitride thin-film chip resistors in 0603, 0805, 1206 and 2512 package sizes for precision high-power electronics

    Stackpole RNAN AlN Thin-Film Resistors Reach 6 W

    binder angled M12-A midmount panel-mount PCB connector for centric board mounting, showing compact front-facing industrial connector geometry

    binder Adds Midmount M12-A PCB Connectors for Slim Sensors

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • Knowledge Blog
  • Dossiers
    • AI Hardware Dossier
    • Automotive Dossier
    • Industrial Robotics Dossier
    • Power Converter Dossier
    • Capacitor Dossier
    • Resistor Dossier
    • Inductor Dossier
    • Circuit Protection Dossier
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

Merck: The Next Decade is Going to be the Decade of Materials

30.8.2021
Reading Time: 4 mins read
A A

Building out manufacturing capacity is one answer to the ongoing electronic components supply chain shortages, but it’s not the only answer. As semiconductor companies like Intel, GlobalFoundries and Samsung announce plans to build new sites or expand existing ones to add more capacity they are sending the message that they will do whatever they can to address the chip shortage and growing customer demand, but ultimately other business practices within the supply chain also will need to evolve, according to Anand Nambiar, global head of semiconductor materials for EMD Electronics, a business of Germany’s Merck KGaA.

“These announcements by the giants are commitments to create space,” he said. “Essentially, the new fabs are white space, and equipment and materials are needed to fill that white space. So the question becomes, ‘How do you fill this white space?’ It will take the supply chain time to catch up.”

RelatedPosts

Bourns Adds ACXX57SQ Air Coil Inductors for RF Design

Samsung MLCC Options for 1 MW AI Rack Power

5 kW 800 V-to-50 V PSFB Transformer Design for Data Centers

The chip shortage isn’t just a chip shortage. As other industry players have noted, it is also a shortage of both raw and integrated materials necessary for the manufacturing process. At the same time, the supply chain won’t get a chance to come up for air anytime soon, as fresh demand for all kinds of chips is increasing.

“All of these market segments that need chips–AI, 5G smartphones, data center servers, sensors, autonomous driving and others–they’re all growing at a rapid rate,” Nambiar said. 

These trends are also going to generate more data, which means a growing requirement for more data analysis and development of insights based on the data, all of which means chips will need to be more powerful and more capable, with an increasing likelihood that more data analysis will happen on-chip or on-device. Right now, there is collectively still very little data analysis being done across all industries–different research sources put the figure in the low-to-mid single digits percentage-wise. If that percentage grows even a little, it could represent a doubling of the amount of analysis being done now, which could translate to an explosion in the need for chips with AI capabilities.

“All of these technology drivers are happening at the same time to create much more market demand, and that has been compounded by the fact of the supply shortage to create the more significant demand/supply disruption,” Nambiar said

Due to the wide range of factors in play to create this perfect storm of disruption, constraints in different parts of the semiconductor supply chain are likely to continue to pop up for years to come, he added.

The shortage combined with ever-broadening demand are the reasons “why companies are building so much more capacity, but for the next decade there are going to be ups and downs with market corrections and changes in pricing,” Nambiar said. “There will be a stabilizing effect from improvements in capacity and logistics, but there will also be sustained demand.”

Rethinking materials practices

This “new normal” means that chip companies will need to start to rethink how they acquire and work with the materials they need.

The demand/supply disruption has exposed the weakness of modern global-scale supply chains. For one thing, supply chains have become extremely complex, with too many moving parts for any one company to adequately control. Also, some manufacturing processes or  supply sources for some materials have become so concentrated in individual countries (most tungsten traditionally come out of China, for example) that when problems arise in these locations, the supply chain can crash.

That could drive more companies to try to localize their sourcing to some degree to mitigate some of the blips that might occur in a more distributed chain, a practice companies and governments around the world are starting to buy into. 

“Regarding the geopolitical aspects, there definitely is a nationalistic drive to build more capacity and ecosystem support in countries that are feeling left out of the chain,” Nambiar said. “But they need to do this smartly and focus on a strategy to localize their supply chain where this is possible. It’s important that materials and supplies are locally present for the new capacity being built [by chip companies].”

Living in a material world

Beyond localization, chip companies might also need to create longer-term strategies to acquire more raw materials and seek more integrated and packaged materials where they can to offset delays of these materials coming out of certain suppliers or countries. 

“Two to three decades ago, fewer than 10 elements were used in chip processes,” Nambiar said. “Now, 50 to 70 of the elements on the periodic table are used, with even more under scrutiny. The next decade is going to be the decade of materials.”

But along with the exigent supply chain challenges, the broader range of materials being used means that the ability to integrate and package these materials to streamline the manufacturing process is increasingly critical.

“Materials are an opportunity for us to solve complex problems,” Nambiar said. “What happens today is that the chip customer works with many different materials suppliers, and the onus is on that customer to integrate everything.

“Think about how this market is evolving,” Nambiar said. “Google has started to drive chip design. Some companies want to own the entire value chain, others want to farm everything out, but they all need hardware. Facebook is doing AR and they need both display and semiconductor hardware competency to make that work. Amazon, Microsoft, Google — they all have hardware roadmaps. These companies are emerging to drive how semiconductor processes will work in the future.”

Related

Source: Fierce Electronics

Recent Posts

Samsung MLCC Revenue Seen Above KRW 8T by 2027, Murata EOL Actions Reshape Supply

11.9.2026
73
ECIA Industry Pulse Q3 2026 chart showing passive components, semiconductors and electro-mechanical component market sentiment and lead-time pressure

ECIA Industry Pulse Moderates as Passive Lead Times Tighten

10.9.2026
40

Emerging Capacitor Markets in Fusion Energy

10.9.2026
58
onsemi solid-state transformer concept for 800 V HVDC AI data center power conversion with SiC modules, DC-link capacitors and high-frequency magnetics

Solid-State Transformers for 800 V AI Data Centers: Passive Component Design Considerations

9.9.2026
123

August 2026 Interconnect, Passives and Electromechanical Components Market Insights

4.9.2026
61

Samsung Electro-Mechanics Secures KRW 1.0722 Trillion AI Server MLCC Supply Contract

3.9.2026
78

Connector Industry Performance Accelerates Through Mid-2026

31.8.2026
57

Passive Components for Industrial Automation and Robotics (Dossier Report 08/26)

20.8.2026
131

Advanced Electronics Markets Reshape Capacitor Demand for 2026/2027

20.8.2026
145

Upcoming Events

Sep 29
16:00 - 17:00 CEST

Cybersecurity 2026

Sep 30
15:00 - 16:00 CEST

Positronic Space and Military Connectors

Oct 14
17:00 - 18:00 CEST

Live Demo! Discover KYOCERA AVX Antenna Integrator Studio (AIS)

View Calendar

Popular Posts

  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Resistor Symbols

    0 shares
    Share 0 Tweet 0
  • Capacitor Charging and Discharging

    0 shares
    Share 0 Tweet 0
  • MLCC and Ceramic Capacitors

    0 shares
    Share 0 Tweet 0
  • Earthing Systems and IEC Classification Explained

    0 shares
    Share 0 Tweet 0
  • Audio Capacitors: Choosing Capacitors for Crossover Circuits

    0 shares
    Share 0 Tweet 0
  • Capacitor Symbols

    0 shares
    Share 0 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© 2015–2026
All rights reserved

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • Dossiers
  • PCNS

© 2015–2026
All rights reserved