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    Bourns Extends Rotational Life Option for its Guitar Potentiometer

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    Modeling and Simulation of Leakage Inductance

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    Bourns Extends Rotational Life Option for its Guitar Potentiometer

    Modeling and Simulation of Leakage Inductance

    Power Inductor Considerations for AI High Power Computing – Vishay Video

    TAIYO YUDEN Releases Compact SMD Power Inductors for Automotive Application

    Fischer Releases High Vibration Robust Ratchet Locking USB-C Connector System

    Littelfuse Unveils High-Use Tactile Switches with 2 Million Cycle Lifespan

    KYOCERA AVX Releases Compact High-Directivity Couplers

    Supercapacitors Emerge as a Promising Solution to AI-Induced Power Energy Spikes

    Wk 18 Electronics Supply Chain Digest

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
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    Modeling and Simulation of Leakage Inductance

    Power Inductor Considerations for AI High Power Computing – Vishay Video

    Coupled Inductors in Multiphase Boost Converters

    VPG Demonstrates Precision Resistor in Cryogenic Conditions

    Comparison Testing of Chip Resistor Technologies Under High Vibration

    EMC Challenges for High Speed Signal Immunity and Low EMI

    MOSFET Gate Drive Resistors Power Losses

    Modified Magnetic Reluctance Equivalent Circuit and its Implications

    Improving Common Mode Noise Reduction while Decreasing BOM

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    • Capacitors explained
    • Inductors explained
    • Resistors explained
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Vishay Pulse Proof High Power Thick Film Chip Resistors – Tech Specs Video

2.7.2020
Reading Time: 1 min read
A A

RelatedPosts

NIC Components Extends SMD High Voltage MLCC Offering

Stackpole Offers RoHS Compliant Lead-Free Thick Film Chip Resistors

Smiths Interconnect’s SMD Power Resistors with Heat Sink Qualified to Space Flights

Vishay’s AEC-Q200 qualified CRCW-HP series combines high power dissipation and small case size in a single device. This is made possible by the double-sided design that uses two resistive layers in parallel within the device, enabling power dissipation up to 1.5W in a 2512 case size and allowing designers to increase design density.

Related

Source: Vishay Intertechnology, TTI

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