• Latest
  • Trending
  • All
  • Capacitors
  • Resistors
  • Inductors
  • Filters
  • Fuses
  • Non-linear Passives
  • Applications
  • Integrated Passives
  • Oscillators
  • Passive Sensors
  • New Technologies
  • Aerospace & Defence
  • Automotive
  • Industrial
  • Market & Supply Chain
  • Medical
  • RF & Microwave
  • Telecommunication

Yageo and Foxconn to Form a Semiconductor Joint Venture, XSemi

6.5.2021

Introduction of Knowles MLCCs StackiCap, its Benefits and Applications

25.5.2023

Murata Unveils Compact MLCCs with Extended Creepage Distance

25.5.2023

Properties and Characteristics of Crystal Units

24.5.2023

YAGEO Releases High Capacitance 630V NP0 MLCC for Higher Power Density and Efficiency Circuits

24.5.2023

Skeleton Acquires Former Batteries Plant to Increase Manufacturing Capacity

23.5.2023

TDK Enhances Efficiency of Materials Development Using Advanced AI

23.5.2023
  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About
No Result
View All Result
NEWSLETTER
Passive Components Blog
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • Market & Supply Chain
    • Medical
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors
    • Resistors
    • RF & Microwave
    • Telecommunication

    Introduction of Knowles MLCCs StackiCap, its Benefits and Applications

    Murata Unveils Compact MLCCs with Extended Creepage Distance

    Properties and Characteristics of Crystal Units

    YAGEO Releases High Capacitance 630V NP0 MLCC for Higher Power Density and Efficiency Circuits

    Skeleton Acquires Former Batteries Plant to Increase Manufacturing Capacity

    TDK Enhances Efficiency of Materials Development Using Advanced AI

    Transformer Optimal Operating Frequency for Phase-Shifted Full-Bridge Converter

    Vishay Unveils 120W High Energy Power Resistor

    Knowles Offers Build-to-Print Services for Thin Film Circuits

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos
    • Sensors

    Fast 25kW SiC EV Charger Design; OnSemi and Würth Elektronik Webinar

    PFC Inductor Magnetic Design Considerations; Frenetic Webinar

    Introduction to Capacitor Technologies; WE Webinar

    Self-Adjusting and Economical Switched Capacitor Balancer for Serially Connected Storage-Cells

    How to Design EMC Efficient Power Converter; WE Webinar

    Selecting Capacitors for High Power Buck-Booster Converters

    How to use Off-the-Shelf Transformers in Switching Power Supplies

    Simple Capacitors Pre-Charger Based on Unique ‘Floating Integrator’

    Practical LLC Transformer Design Methodology

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • Suppliers
    • Preferred Suppliers
    • Who is Who
  • Events
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • Market & Supply Chain
    • Medical
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors
    • Resistors
    • RF & Microwave
    • Telecommunication

    Introduction of Knowles MLCCs StackiCap, its Benefits and Applications

    Murata Unveils Compact MLCCs with Extended Creepage Distance

    Properties and Characteristics of Crystal Units

    YAGEO Releases High Capacitance 630V NP0 MLCC for Higher Power Density and Efficiency Circuits

    Skeleton Acquires Former Batteries Plant to Increase Manufacturing Capacity

    TDK Enhances Efficiency of Materials Development Using Advanced AI

    Transformer Optimal Operating Frequency for Phase-Shifted Full-Bridge Converter

    Vishay Unveils 120W High Energy Power Resistor

    Knowles Offers Build-to-Print Services for Thin Film Circuits

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos
    • Sensors

    Fast 25kW SiC EV Charger Design; OnSemi and Würth Elektronik Webinar

    PFC Inductor Magnetic Design Considerations; Frenetic Webinar

    Introduction to Capacitor Technologies; WE Webinar

    Self-Adjusting and Economical Switched Capacitor Balancer for Serially Connected Storage-Cells

    How to Design EMC Efficient Power Converter; WE Webinar

    Selecting Capacitors for High Power Buck-Booster Converters

    How to use Off-the-Shelf Transformers in Switching Power Supplies

    Simple Capacitors Pre-Charger Based on Unique ‘Floating Integrator’

    Practical LLC Transformer Design Methodology

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • Suppliers
    • Preferred Suppliers
    • Who is Who
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

Yageo and Foxconn to Form a Semiconductor Joint Venture, XSemi

6.5.2021
Reading Time: 3 mins read
0 0
0
SHARES
0
VIEWS

Yageo Group and Hon Hai Technology Group (Foxconn Technology Group) today announced to enter into a joint venture agreement to form XSemi Corporation (“XSemi”). The goal of this newly established joint venture is to extend the businesses into the semiconductor industry, including product development and sales.

In the future, XSemi will be based in Hsinchu, Taiwan and consolidate the strengths and resources of the two market leaders, in addition to the upcoming multifaceted collaborations with leading semiconductor companies in product design, process and capacity planning, and sales channel. XSemi will create a complete semiconductor supply chain and provide customers total solution services with high-quality products and stable supplies.

RelatedPosts

Introduction of Knowles MLCCs StackiCap, its Benefits and Applications

Murata Unveils Compact MLCCs with Extended Creepage Distance

Properties and Characteristics of Crystal Units

Yageo and Hon Hai has developed and fine-tuned a superb strategy and operating model through their long-term cooperation. The partnership has created synergies through innovation and integration of services and resources, producing operation efficiencies and concreting growth for both conglomerates in a fast paced environment. The new joint venture XSemi will deepen their footprint in semiconductor, focusing on the development of semiconductor chips with average selling prices lower than US$2.00, in which they call it “Small IC”. So far, the two have started discussions with several global semiconductor companies, and will in the near future announce the collaboration plans in the semiconductor industry.

Young Liu, Chairman of Hon Hai, expresses his belief that “the semiconductor industry is facing the biggest upheaval in the past three decades, and the industry order will face a serious restructuring. Now is undoubtedly the best timing to initiate strategic partnerships in various segments.” Hon Hai has started its semiconductor strategy according to its mid-to-long term blueprints, making it one of the three core technologies for the conglomerate. Within its reach in the semiconductor supply chain, Hon Hai has built capabilities within semiconductor equipment, design services, IC design in 5G, AI, CIS (CMOS Image Sensors), and display driver, foundry fabs, and advanced packaging. This comprehensive portfolio will ride along Hon Hai’s long-term plan in the three major emerging industries in EV, digital health, and robotics, to enhance and vertically consolidate the industry supply chain.

XSemi‘s key product focus, small ICs, will become the most important element of Hon Hai’s future plan. It will not only create a steady semiconductor supply to the company’s current communication applications and future emerging technologies, but also fulfill the needs of its international customers, and ultimately enhance the company’s overall profitability.

Yageo’s strengths lie in efficient component production and process management, and it is known for comprehensive global sales channels. This new collaboration with Hon Hai could be seen as a natural extension and progression of the strategic alliance initiative with Hon Hai last year. This will not only fortify Hon Hai’s need for the key core components for EV and digital health, but also showcase Yageo’s forte in consolidation of resources.

After the acquisition of KEMET and Pulse, Yageo has put an emphasis on high-end product development to consolidate technologies and channels to be close to its customers. Yageo has extensive experiences in the key components of the creation of EV, including powertrain, battery management system, ADAS, on top of other high-end applications like digital health, industrial, and 5G technologies.

Pierre Chen, Chairman of Yageo, believes that “Yageo aims to create a one-stop shop for its customers, and through this joint venture, we will further provide the services and products that meet customers’ need for supply chain optimization.” With the creation of XSemi, Yageo will further expand its footprints in passive components into semiconductors, offering an even more complete component portfolio, opening more room for growth in the future.

Pierre Chen, Chairman of Yageo Group and Young Liu, Chairman of Hon Hai Technology Group attended the signing ceremony and announced the partnership in person. The market for power semiconductors will reach US$40 billion by 2025, and analog semiconductors to US$25 billion. In an electric vehicle, the quantity share of small IC will be over 90% among all semiconductor components. The presence of the two chairmen signifies the importance of this joint venture to the development of both companies. With the combination of the complementary strengths, Yageo and Hon Hai look forward to creating a powerful semiconductor company in the industry.

Source: Yageo

Related Posts

Market & Supply Chain

Skeleton Acquires Former Batteries Plant to Increase Manufacturing Capacity

23.5.2023
21
Market & Supply Chain

TDK Enhances Efficiency of Materials Development Using Advanced AI

23.5.2023
21
Integrated Passives

Integrated Passive Components Market Trend

17.5.2023
121

Upcoming Events

May 31
11:00 - 12:00 UTC-5

Why GFCIs with “Ground Check” Are the Future of Electrical Safety

Jun 1
June 1 @ 12:00 - June 2 @ 14:00 EDT

Space and Military Standards for Hybrids and RF Microwave Modules

Jun 13
June 13 @ 12:00 - June 16 @ 14:00 EDT

Pre Cap Visual Inspection per Mil-Std-883 (TM 2017)

View Calendar

Popular Posts

  • What is a Dielectric Constant of Plastic Materials ?

    4 shares
    Share 4 Tweet 0
  • Ripple Current and its Effects on the Performance of Capacitors

    3 shares
    Share 3 Tweet 0
  • Capacitor Selection for Coupling and Decoupling Applications

    28 shares
    Share 28 Tweet 0
  • Leakage Current Characteristics of Capacitors

    0 shares
    Share 0 Tweet 0
  • Understanding High-Precision Resistor Temperature Coefficient of Resistance

    0 shares
    Share 0 Tweet 0
  • How to Choose the Right Inductor for DC-DC Buck Applications

    0 shares
    Share 0 Tweet 0
  • Dielectric Constant and its Effects on the Properties of a Capacitor

    7 shares
    Share 7 Tweet 0
  • Filter Q Factor Explained

    0 shares
    Share 0 Tweet 0

Newsletter Subscription

 

PCNS Call for Papers !

Archive

2022
2021
2020
2019
2018
2017

Symposium

Passive Components Networking Symposium

Passives e-Learning

Knowledge Blog

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

© EPCI - Premium Passive Components Educational and Information Site

No Result
View All Result
  • Home
  • News
  • Video
  • Knowledge Blog
  • Preferred Suppliers
  • Events

© EPCI - Premium Passive Components Educational and Information Site

Welcome Back!

Login to your account below

Forgotten Password?

Retrieve your password

Please enter your username or email address to reset your password.

Log In
This website uses cookies. By continuing to use this website you are giving consent to cookies being used. Visit our Privacy and Cookie Policy.