Passive Components Blog
No Result
View All Result
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    Wk 11 Electronics Supply Chain Digest

    Binder Extends NCC Circular Connectors for Harsh Environments

    Standard vs Planar LLC transformers Comparison for Battery Chargers

    Würth Elektronik and Grinn Launch Edge AI Cooperation

    Bourns Expanded Semi-Shielded Low Profile Automotive Power Inductor

    Peak Nano to Develop Fusion Grade High Energy Film Capacitors

    Murata New Vibration Sensor Targets High‑Frequency Predictive Maintenance

    Kyocera Releases 30fs Jitter Differential Clock Oscillator

    Panasonic Expands Automotive PP Film Capacitors Voltage Range

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    Standard vs Planar LLC transformers Comparison for Battery Chargers

    How Modern Tools Model Magnetic Components for Power Electronics

    Advanced Loss Modeling for Planar Magnetics in the Frenetic Planar Tool

    2026 Power Magnetics Design Trends: Flyback, DAB and Planar

    Enabling Software‑Defined Vehicle Architectures: Automotive Ethernet and Zonal Smart Power

    Calculating Resistance Value of a Flyback RC Snubber 

    One‑Pulse Characterization of Nonlinear Power Inductors

    Thermistor Linearization Challenges

    Coaxial Connectors and How to Connect with PCB

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • DossiersNew
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    Wk 11 Electronics Supply Chain Digest

    Binder Extends NCC Circular Connectors for Harsh Environments

    Standard vs Planar LLC transformers Comparison for Battery Chargers

    Würth Elektronik and Grinn Launch Edge AI Cooperation

    Bourns Expanded Semi-Shielded Low Profile Automotive Power Inductor

    Peak Nano to Develop Fusion Grade High Energy Film Capacitors

    Murata New Vibration Sensor Targets High‑Frequency Predictive Maintenance

    Kyocera Releases 30fs Jitter Differential Clock Oscillator

    Panasonic Expands Automotive PP Film Capacitors Voltage Range

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    Standard vs Planar LLC transformers Comparison for Battery Chargers

    How Modern Tools Model Magnetic Components for Power Electronics

    Advanced Loss Modeling for Planar Magnetics in the Frenetic Planar Tool

    2026 Power Magnetics Design Trends: Flyback, DAB and Planar

    Enabling Software‑Defined Vehicle Architectures: Automotive Ethernet and Zonal Smart Power

    Calculating Resistance Value of a Flyback RC Snubber 

    One‑Pulse Characterization of Nonlinear Power Inductors

    Thermistor Linearization Challenges

    Coaxial Connectors and How to Connect with PCB

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • DossiersNew
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

Yageo to Acquire 20% in uPI Semiconductor Power Management Affiliate of Asustek Computer 

27.5.2024
Reading Time: 3 mins read
A A

YAGEO Corporation announced that it will participate fully in uPI Semiconductor Corp.’s private placement for 21 million shares, following a mutual resolution passed at a meeting of the Board of Directors.

After the transaction, YAGEO will become uPI’s largest single strategic shareholder with 20.23% share after the new issuance. This strategic investment into uPI will further drive YAGEO to capture higher content share per board through co-development and channel collaborations. 

RelatedPosts

Wk 11 Electronics Supply Chain Digest

Binder Extends NCC Circular Connectors for Harsh Environments

Standard vs Planar LLC transformers Comparison for Battery Chargers

“In a highly competitive electronic world, it is important to offer our customers not only the highest performance products and services but also product breadth. We believe uPI’s strong design capabilities across many different important semiconductor products, especially in its multi-phase VCore (core voltage) controller ICs and its highly integrated power stages, will best complement our existing portfolio.

Given the nature of having to work closely with CPU, GPU, and memory for VCore controller ICs and power stages, this strategic investment into uPI will further strengthen our relationships with world leading IC design companies to be even earlier in the customers’ design cycle.

In addition, we will be able to provide more value-added products and services to our customers by enhancing our one stop shop model with differentiated products such as power modules and others. This strategic move is another testament to YAGEO’s unique position in the global electronic supply chain with premium channels and strong customer relationships in all the most highly anticipated markets such as AI, high performance computing, industrial and automotive.” said Pierre Chen, the Founder and Chairman of YAGEO.

“The key rationale behind the private placement is to accelerate and to open up more opportunities through leveraging YAGEO’s strengths in its brand and channels in high end applications like high performance computing, automotive, industrial, and medical, as well as premium markets like North America, Europe, Japan, and Korea.

Having YAGEO as a strategic partner, uPI and YAGEO togetherwill be able to create and capture more opportunities by providing more value added products and solutions.  The additional capital obtained from the private placement will also provide uPI with more flexibility to look for more immediate opportunities to expand its business and operations to maintain and improve its competitive advantage, and evetually to reach an even more global scale.” uPI’s Chairman S.Y. Hsu cited.  

uPI is one of the few power semiconductor design companies in which its product portfolio includes both PMIC (power management IC) and power discretes such as MOSFETs. uPI focuses on the design and development of high density power management solutions and high performance power components. Its main products include PMIC, power stage, converter, battery protection IC, discretes and GaN solutions.

Its end applications cover 5 major areas—computing, telecommunication, battery protection and management, industrials and consumers. Its VCore controllers and power semiconductor solutions have a leading market position. With that, uPI is able to emerge as one of the most prominent analog semiconductor players in Asia and in the world.

YAGEO will continue to explore ways to allocate and optimize the resources among its various stakeholders and strategic partners. With its existing leadership in passive components combined with its new sensor portfolio, this strategic step towards power semiconductor is another important milestone to YAGEO’s long-term growth strategy.

Related

Source: YAGEO

Recent Posts

Binder Extends NCC Circular Connectors for Harsh Environments

13.3.2026
2

Standard vs Planar LLC transformers Comparison for Battery Chargers

13.3.2026
13

Bourns Expanded Semi-Shielded Low Profile Automotive Power Inductor

12.3.2026
13

Peak Nano to Develop Fusion Grade High Energy Film Capacitors

11.3.2026
28

Murata New Vibration Sensor Targets High‑Frequency Predictive Maintenance

10.3.2026
18

Panasonic Expands Automotive PP Film Capacitors Voltage Range

9.3.2026
23

Panasonic Extends Automotive Power Inductor Line

9.3.2026
30

February 2026 Interconnect, Passives and Electromechanical Components Market Insights

9.3.2026
55

YAGEO Presents 3.6 kW LLC Transformer Platform

6.3.2026
51

Upcoming Events

Mar 19
13:00 - 14:00 CDT

Smart Consideration of Inductor Thermal Performance

Mar 21
All day

PSMA Capacitor Workshop 2026

Apr 21
16:00 - 17:00 CEST

Heatsink Solutions: Thermal Management in electronic devices

View Calendar

Popular Posts

  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • MLCC Manufacturers Consider Price Increase as AI Demand Outpaces Supply

    0 shares
    Share 0 Tweet 0
  • Dual Active Bridge (DAB) Topology

    0 shares
    Share 0 Tweet 0
  • Ripple Current and its Effects on the Performance of Capacitors

    3 shares
    Share 3 Tweet 0
  • MLCC and Ceramic Capacitors

    0 shares
    Share 0 Tweet 0
  • MLCC Case Sizes Standards Explained

    0 shares
    Share 0 Tweet 0
  • 3-Phase EMI Filter Design, Simulation, Calculation and Test

    0 shares
    Share 0 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© EPCI - Leading Passive Components Educational and Information Site

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • PCNS

© EPCI - Leading Passive Components Educational and Information Site

This website uses cookies. By continuing to use this website you are giving consent to cookies being used. Visit our Privacy and Cookie Policy.
Go to mobile version