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    VACUUMSCHMELZE VACODUR Max cobalt-iron lamination material illustrated as thin metallic rotor and stator stacks.

    VACUUMSCHMELZE Introduced VACODUR Max Cobalt-Iron Alloy for Motor Laminations

    Stackpole RPCQ thick-film chip resistors in rectangular surface-mount packages with end terminations

    Stackpole Releases Pulse-Withstanding Chip Resistors up to 4 W

    Bourns CRT-G thin film chip resistor illustration with a rectangular body and metallic end terminations

    Bourns Introduces Precision Thin Film Resistors for Measurement

    Würth Elektronik ABC of Thermal Management textbook

    Würth Elektronik Launches ABC of Thermal Management Guide

    Schematic of six-arm nitrene crosslinker joining PEI polymer chains in a free-standing dielectric film.

    Crosslinked PEI Film Capacitor Dielectrics Reach 6 J/cm³ at 200°C

    Conceptual illustration of Peak Nano NanoPlex HDC capacitor dielectric film rolls beside a cast-film production line

    Peak Nano Scales NanoPlex HDC Capacitor Film Production 20-Fold

    Bourns Releases 450 V DC Bus TVS Diode

    YAGEO Nexensos M422 Pb-free platinum RTD graphic showing the operating temperature range, nominal resistance options and joining methods.

    YAGEO Introduces Pb-Free Platinum RTD Temperature Sensor

    Reference tantalum capacitor anode characterization, tantalum anode modeling, process selection and life-test verification.

    Tantalum Anode Design Combines Structural Benchmarks and Modeling

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    VACUUMSCHMELZE VACODUR Max cobalt-iron lamination material illustrated as thin metallic rotor and stator stacks.

    VACUUMSCHMELZE Introduced VACODUR Max Cobalt-Iron Alloy for Motor Laminations

    Stackpole RPCQ thick-film chip resistors in rectangular surface-mount packages with end terminations

    Stackpole Releases Pulse-Withstanding Chip Resistors up to 4 W

    Bourns CRT-G thin film chip resistor illustration with a rectangular body and metallic end terminations

    Bourns Introduces Precision Thin Film Resistors for Measurement

    Würth Elektronik ABC of Thermal Management textbook

    Würth Elektronik Launches ABC of Thermal Management Guide

    Schematic of six-arm nitrene crosslinker joining PEI polymer chains in a free-standing dielectric film.

    Crosslinked PEI Film Capacitor Dielectrics Reach 6 J/cm³ at 200°C

    Conceptual illustration of Peak Nano NanoPlex HDC capacitor dielectric film rolls beside a cast-film production line

    Peak Nano Scales NanoPlex HDC Capacitor Film Production 20-Fold

    Bourns Releases 450 V DC Bus TVS Diode

    YAGEO Nexensos M422 Pb-free platinum RTD graphic showing the operating temperature range, nominal resistance options and joining methods.

    YAGEO Introduces Pb-Free Platinum RTD Temperature Sensor

    Reference tantalum capacitor anode characterization, tantalum anode modeling, process selection and life-test verification.

    Tantalum Anode Design Combines Structural Benchmarks and Modeling

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
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Yageo to Acquire 20% in uPI Semiconductor Power Management Affiliate of Asustek Computer 

27.5.2024
Reading Time: 3 mins read
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YAGEO Corporation announced that it will participate fully in uPI Semiconductor Corp.’s private placement for 21 million shares, following a mutual resolution passed at a meeting of the Board of Directors.

After the transaction, YAGEO will become uPI’s largest single strategic shareholder with 20.23% share after the new issuance. This strategic investment into uPI will further drive YAGEO to capture higher content share per board through co-development and channel collaborations. 

RelatedPosts

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Stackpole Releases Pulse-Withstanding Chip Resistors up to 4 W

Bourns Introduces Precision Thin Film Resistors for Measurement

“In a highly competitive electronic world, it is important to offer our customers not only the highest performance products and services but also product breadth. We believe uPI’s strong design capabilities across many different important semiconductor products, especially in its multi-phase VCore (core voltage) controller ICs and its highly integrated power stages, will best complement our existing portfolio.

Given the nature of having to work closely with CPU, GPU, and memory for VCore controller ICs and power stages, this strategic investment into uPI will further strengthen our relationships with world leading IC design companies to be even earlier in the customers’ design cycle.

In addition, we will be able to provide more value-added products and services to our customers by enhancing our one stop shop model with differentiated products such as power modules and others. This strategic move is another testament to YAGEO’s unique position in the global electronic supply chain with premium channels and strong customer relationships in all the most highly anticipated markets such as AI, high performance computing, industrial and automotive.” said Pierre Chen, the Founder and Chairman of YAGEO.

“The key rationale behind the private placement is to accelerate and to open up more opportunities through leveraging YAGEO’s strengths in its brand and channels in high end applications like high performance computing, automotive, industrial, and medical, as well as premium markets like North America, Europe, Japan, and Korea.

Having YAGEO as a strategic partner, uPI and YAGEO togetherwill be able to create and capture more opportunities by providing more value added products and solutions.  The additional capital obtained from the private placement will also provide uPI with more flexibility to look for more immediate opportunities to expand its business and operations to maintain and improve its competitive advantage, and evetually to reach an even more global scale.” uPI’s Chairman S.Y. Hsu cited.  

uPI is one of the few power semiconductor design companies in which its product portfolio includes both PMIC (power management IC) and power discretes such as MOSFETs. uPI focuses on the design and development of high density power management solutions and high performance power components. Its main products include PMIC, power stage, converter, battery protection IC, discretes and GaN solutions.

Its end applications cover 5 major areas—computing, telecommunication, battery protection and management, industrials and consumers. Its VCore controllers and power semiconductor solutions have a leading market position. With that, uPI is able to emerge as one of the most prominent analog semiconductor players in Asia and in the world.

YAGEO will continue to explore ways to allocate and optimize the resources among its various stakeholders and strategic partners. With its existing leadership in passive components combined with its new sensor portfolio, this strategic step towards power semiconductor is another important milestone to YAGEO’s long-term growth strategy.

Related

Source: YAGEO

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