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    VACUUMSCHMELZE VACODUR Max cobalt-iron lamination material illustrated as thin metallic rotor and stator stacks.

    VACUUMSCHMELZE Introduced VACODUR Max Cobalt-Iron Alloy for Motor Laminations

    Stackpole RPCQ thick-film chip resistors in rectangular surface-mount packages with end terminations

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    Würth Elektronik ABC of Thermal Management textbook

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    Crosslinked PEI Film Capacitor Dielectrics Reach 6 J/cm³ at 200°C

    Conceptual illustration of Peak Nano NanoPlex HDC capacitor dielectric film rolls beside a cast-film production line

    Peak Nano Scales NanoPlex HDC Capacitor Film Production 20-Fold

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    YAGEO Nexensos M422 Pb-free platinum RTD graphic showing the operating temperature range, nominal resistance options and joining methods.

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    Reference tantalum capacitor anode characterization, tantalum anode modeling, process selection and life-test verification.

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    VACUUMSCHMELZE VACODUR Max cobalt-iron lamination material illustrated as thin metallic rotor and stator stacks.

    VACUUMSCHMELZE Introduced VACODUR Max Cobalt-Iron Alloy for Motor Laminations

    Stackpole RPCQ thick-film chip resistors in rectangular surface-mount packages with end terminations

    Stackpole Releases Pulse-Withstanding Chip Resistors up to 4 W

    Bourns CRT-G thin film chip resistor illustration with a rectangular body and metallic end terminations

    Bourns Introduces Precision Thin Film Resistors for Measurement

    Würth Elektronik ABC of Thermal Management textbook

    Würth Elektronik Launches ABC of Thermal Management Guide

    Schematic of six-arm nitrene crosslinker joining PEI polymer chains in a free-standing dielectric film.

    Crosslinked PEI Film Capacitor Dielectrics Reach 6 J/cm³ at 200°C

    Conceptual illustration of Peak Nano NanoPlex HDC capacitor dielectric film rolls beside a cast-film production line

    Peak Nano Scales NanoPlex HDC Capacitor Film Production 20-Fold

    Bourns Releases 450 V DC Bus TVS Diode

    YAGEO Nexensos M422 Pb-free platinum RTD graphic showing the operating temperature range, nominal resistance options and joining methods.

    YAGEO Introduces Pb-Free Platinum RTD Temperature Sensor

    Reference tantalum capacitor anode characterization, tantalum anode modeling, process selection and life-test verification.

    Tantalum Anode Design Combines Structural Benchmarks and Modeling

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Air Force chemists advancing high-K plastic synthesis for microelectronics

22.2.2019
Reading Time: 1 min read
A A

Source: Tech Link news

A significant advancement in the synthesis of thermoplastics used to miniaturize microelectronics has been developed by the Air Force Research Laboratory introducing advanced capabilities for film capacitors, electric vehicles, pulsed power, and gate dielectric field-effect transistors.

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Drs. Loon-Seng Tan, David Wang, and Lei Zhu, Air Force research scientists, have invented a new way to produce a “sulfonyl-substituted polyphenylene-ether polymer (PPO) having improved dielectric properties,” according to a U.S. patent application published Thursday.

Such “high-k” materials, which have a melting point greater than 150 degrees Celsius, are used in high energy-density-storage capacitors, gate dielectrics, and electroactive materials.

They are critical as embedded capacitors, enabling electronics to be miniaturized without compromising performance, and in other applications, enhance the performance of electronic systems.

But before advanced high-k materials can be transitioned from the lab into use by “film capacitors for power-conditioning, power electronics in hybrid electric vehicles, pulsed power, and gate dielectric field-effect transistors,” the patent application states, they “must possess processability, good dielectric properties over a broad frequency range, and be thermally stable.”

And that’s where the Air Force is expanding capabilities through organic chemistry.

Using a scalable, radical halogenation process (in this case bromination), the researchers created halogenated PPO, which “is a versatile intermediate for introducing a wide range of functional groups to impart desired final properties (such as chemical resistance and higher thermal stability) without the risk of molecular weight reduction and the possibility of converting the linear architecture of PPO to that of a network.”

featured image: Dr. David Wang (left) and Dr. Loon-Seng Tan hold a project discussion in the Soft Matter Materials Branch collaboration space. (Air Force photo)

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