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    Samsung MLCC Revenue Seen Above KRW 8T by 2027, Murata EOL Actions Reshape Supply

    ROHM SDR01 high anti-surge thick-film chip resistor in 1005 metric 0402 package with 0.33 W rated power

    ROHM Introduces Anti-Surge 0402 Resistors Rated at 0.33 W

    ECIA Industry Pulse Q3 2026 chart showing passive components, semiconductors and electro-mechanical component market sentiment and lead-time pressure

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    On-Chip 3D-Printed Copper Microinductors: A New Route to Compact RF Electronics

    Emerging Capacitor Markets in Fusion Energy

    Murata DLW32SH_MF 1210 surface-mount common mode choke coil with metal terminals for automotive CAN FD signal-line noise suppression

    Murata Introduces Common Mode Chokes for Automotive CAN FD up to 150°C

    onsemi solid-state transformer concept for 800 V HVDC AI data center power conversion with SiC modules, DC-link capacitors and high-frequency magnetics

    Solid-State Transformers for 800 V AI Data Centers: Passive Component Design Considerations

    Littelfuse TX00AT314AMA omnipolar TMR magnetic switch sensor in a leaded TO-92-3 through-hole package

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    Samsung MLCC Revenue Seen Above KRW 8T by 2027, Murata EOL Actions Reshape Supply

    ROHM SDR01 high anti-surge thick-film chip resistor in 1005 metric 0402 package with 0.33 W rated power

    ROHM Introduces Anti-Surge 0402 Resistors Rated at 0.33 W

    ECIA Industry Pulse Q3 2026 chart showing passive components, semiconductors and electro-mechanical component market sentiment and lead-time pressure

    ECIA Industry Pulse Moderates as Passive Lead Times Tighten

    LG Innotek Demonstrates FC-BGA Substrates With Embedded Silicon Capacitors for AI Power Delivery

    On-Chip 3D-Printed Copper Microinductors: A New Route to Compact RF Electronics

    Emerging Capacitor Markets in Fusion Energy

    Murata DLW32SH_MF 1210 surface-mount common mode choke coil with metal terminals for automotive CAN FD signal-line noise suppression

    Murata Introduces Common Mode Chokes for Automotive CAN FD up to 150°C

    onsemi solid-state transformer concept for 800 V HVDC AI data center power conversion with SiC modules, DC-link capacitors and high-frequency magnetics

    Solid-State Transformers for 800 V AI Data Centers: Passive Component Design Considerations

    Littelfuse TX00AT314AMA omnipolar TMR magnetic switch sensor in a leaded TO-92-3 through-hole package

    Littelfuse Expands Omnipolar TMR Switch with Leaded TO-92 Package Option

    Trending Tags

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TDK and NIPPON CHEMICAL to Establish Joint Venture for MLCC Material Development

27.11.2025
Reading Time: 1 min read
A A

TDK Corporation has signed a basic agreement with NIPPON CHEMICAL INDUSTRIAL CO.,LTD. to begin considering the establishment of joint venture related to the development of electronic component materials and manufacturing processes.

This includes ceramic materials for multilayer ceramic capacitors (MLCCs), which both companies manufacture.

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TDK Releases 100 V Soft-Termination X7R MLCCs 10 uF in 3225 Package

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TDK Releases SMD Common‑Mode Chokes for Compact High‑Current EMI Filtering

Since its founding, NIPPON CHEMICAL INDUSTRIAL has a history of over 130 years and has been stably manufacturing and selling a wide range of products, with inorganic chemicals as its main focus, as well as electronic materials and organic chemicals.

For over 90 years, TDK has shaped the world from within; from the pioneering ferrite cores to powering the digital age with advanced components, sensors, and batteries, leading the way towards a more sustainable future. 

By combining the technological capabilities and development and evaluation expertise of TDK and NIPPON CHEMICAL INDUSTRIAL, both companies aim to accelerate the speed of research and development, shorten the lead time from prototyping and evaluation to market launch, and establish a scheme that can quickly respond to customer needs.

Both companies will proceed with discussions toward the establishment of joint venture based on this basic agreement.

Related

Source: TDK

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