Researchers from RIKEN Pioneering Research Institute, Nagoya University, and Tohoku University demonstrated in article published by Nature that a molecular...
Read moreDetailsThis article based on Frenetic webinar summarizes a practical design workflow using Frenetic AI, Frenetic Simulator and the new Planar...
Read moreDetailsThis article, authored by Vladimir Azbel, Ph.D., a semiconductor process reliability engineer consultant, provides deep inside explanation of energy dissipation during formation...
Read moreDetailsFringing field effects at air gaps represent a significant but often underestimated source of additional winding losses in magnetic components....
Read moreDetailsThis article, authored by Vladimir Azbel, Ph.D., a semiconductor process reliability engineer consultant, delves into the intricate process of miniaturizing tantalum...
Read moreDetailsThermal management is a challenge for any electronics designer. Among the possible solutions, heatsinks are a key element that aids...
Read moreDetailsMurata has introduced a new bulk case packaging format for ultra‑small multilayer ceramic capacitors (MLCCs) that dramatically reduces packaging material...
Read moreDetailsThis article, written by Vladimir Azbel, Ph.D., a semiconductor process reliability engineer consultant, delves into the significance of the metallic...
Read moreDetailsThis post is based on edited tutorial video by Sam Ben-Yaakov that provides an educational content about power inductor design...
Read moreDetailsThis work by Vladimir Azbel Ph.D. Semiconductor Process Reliability Engineer Consultant, presents an AI-assisted framework for structural diagnostics and physics-based...
Read moreDetails
© EPCI - Leading Passive Components Educational and Information Site
© EPCI - Leading Passive Components Educational and Information Site