Electronic components are often treated as static building blocks once sealed in bags and placed on warehouse shelves. In reality,...
Read moreDetailsThis article, written by Vladimir Azbel, Ph.D., a semiconductor process reliability engineering consultant, and adapted and edited for passive-components.eu, reviews mechanical SSC...
Read moreDetailsThis article summarizes how GDT (Gas Discharge Tube) work, how they differ from other surge protectors, and what design engineers...
Read moreDetailsCustom ferrite cores are becoming a practical necessity in high‑power, high‑frequency data center power supplies. This article summarizes a 10...
Read moreDetailsMagnetics in High‑Frequency GaN Converters: Design Lessons for the 0.5–1 MHz Era This article summarizes key insights from a Frenetic...
Read moreDetailsQi2 wireless power is pushing classic power‑electronics issues—EMC, magnetics and filter design—into very compact, consumer‑grade hardware. This Würth Elektronik webinar...
Read moreDetailsThis article based on edited report written by Vladimir Azbel, Ph.D., a semiconductor process reliability engineer consultant, explains and discuss why stress–strain curves...
Read moreDetailsThis article based on prof. Sam Ben-Yaakov video explains so‑called two‑capacitor paradox theory and practical implications to hardware designers. The...
Read moreDetailsNonlinear multilayer ceramic capacitors (MLCCs), especially class II types such as X7R and X5R, are ubiquitous in modern power electronics...
Read moreDetailsThis article written by Vladimir Azbel, Ph.D., a semiconductor process reliability engineer consultant, shows how a simple mechanical test — the stress–strain...
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© EPCI - Leading Passive Components Educational and Information Site