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    Würth Elektronik WE-LHMI and WE-HCI power inductor comparison slide showing current ratings and maximum operating temperatures

    Power Inductor Selection: Ferrite vs Powder Core Trade-Offs, Würth Elektronik Webinar

    Bourns PWR163 DPAK-style surface-mount power resistor with moulded housing, metal backplate and terminals

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    Murata SWL RF coaxial switch connector measurement diagram and SWL-to-SWJ board-area comparison.

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    Würth Elektronik WE-LHMI and WE-HCI power inductor comparison slide showing current ratings and maximum operating temperatures

    Power Inductor Selection: Ferrite vs Powder Core Trade-Offs, Würth Elektronik Webinar

    Bourns PWR163 DPAK-style surface-mount power resistor with moulded housing, metal backplate and terminals

    Bourns Releases Power Resistor Adds Reverse-Pin Configuration

    Conceptual polypropylene DC-link film capacitor module with parallel cells and copper interconnections

    DC-Link Film Capacitor Modules: Inductance and Thermal Design, Jianghai-Europe Tech Memo

    Panasonic EVP-BX surface-mount tactile switches with top-push actuators and two-terminal construction

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    TDK Introduces Gas-Filled High-Voltage DC Contactors up to 600 A

    Murata SWL RF coaxial switch connector measurement diagram and SWL-to-SWJ board-area comparison.

    Murata RF Switch Connectors Cut PCB Test-Point Area

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Würth Elektronik Introduces LTspice Models for ESD Products

21.5.2025
Reading Time: 2 mins read
A A

Würth Elektronik, in cooperation with the Institute of Electronics (IFE) at Graz University of Technology, now offers an LTspice model for its TVS diodes and ESD suppressors for ESD protection, based on real measurement data using TLP (Transmission Line Pulsing).

This enables the actual behavior of the components to be measured under electrostatic discharge (ESD) conditions.

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The ready-to-use simulation files facilitate integration into SPICE-based analyses and help shorten design cycles and time-to-market.

Conventional models of components for ESD protection typically rely on simplified approximations. The new models developed by Würth Elektronik and the IFE at Graz University of Technology, based on measurement data, however, reflect the actual transient properties, including snapback behavior.

The snapback effect allows the voltage to be clamped to a lower level after a transient overvoltage than is possible with standard PN diodes. This is a key aspect of ESD protection, as it reduces both the overvoltage and the resulting thermal stress on sensitive electronic components, so the ability to simulate it is a critical improvement to the development process.

Ensuring robust ESD protection

Simulating real transient behavior offers assurance in testing circuits under realistic conditions. Reliable simulations shorten testing and development cycles, and also reduce the risk of product recalls resulting from ESD vulnerabilities.

At the same time, they provide insights into component behavior, enabling design optimization to ensure consistent ESD robustness across all applications, from consumer electronics to industrial equipment.

LTspice models for realistic modelling of real component behavior during ESD events for products from the WE-TVS and WE-VE product series are now available in Würth Elektronik’s online catalog to download.

Related

Source: Würth Elektronik

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