AI server demand is rapidly absorbing high‑end MLCC capacity and manufacturers are considering price increase of the high end MLCC...
Read moreDetailsYAGEO Group has introduced three new antennas that target high‑reliability wireless connectivity and precision positioning: a compact 2×2 MiMo Wi‑Fi...
Read moreDetailsSCHURTER’s USE 2410 is a quick-acting, wire-in-air surface‑mount fuse in the compact 2410 footprint, designed for both AC and DC...
Read moreDetailsTDK has extended its NTCSP chip thermistor family with new automotive‑grade parts qualified up to 175 °C for conductive‑glue mounting...
Read moreDetailsResearchers at TU Wien have developed a high‑aspect‑ratio superconducting vacuum gap capacitor NEMS structure with plate distances down to just...
Read moreDetailsPower electronics teams entering 2026 face tighter space, efficiency and time‑to‑market constraints, while magnetics must still behave predictably across thermal...
Read moreDetailsVishay’s new RCA‑SR e3 series are AEC‑Q200 qualified thick film chip resistors designed for sulfur‑rich and thermally demanding environments in...
Read moreDetailsWürth Elektronik has reworked its SMT spacer portfolio to use lead‑free alloys and added new assembly options targeted at high‑volume...
Read moreDetailsSchurter’s EKO series is a new family of square‑body high‑voltage fuses designed for DC and AC power systems up to...
Read moreDetailsEmpower Semiconductor has introduced a new generation of embedded silicon capacitors (ECAPs) aimed at improving power delivery networks in high‑current...
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© EPCI - Leading Passive Components Educational and Information Site