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    Stackpole RNAN aluminium nitride thin-film chip resistors in 0603, 0805, 1206 and 2512 package sizes for precision high-power electronics

    Stackpole RNAN AlN Thin-Film Resistors Reach 6 W

    binder angled M12-A midmount panel-mount PCB connector for centric board mounting, showing compact front-facing industrial connector geometry

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    Bourns PST065 and PST10 Series compact incremental potentiometers with hollow shafts for rotary position feedback

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Molex Completes Acquisition of Smiths Interconnect, Expanding Portfolio of High-Reliability Connectivity Solutions

1.4.2026
Reading Time: 3 mins read
A A

Molex, a global electronics leader and connectivity innovator, has completed the acquisition of Smiths Interconnect, a subsidiary of United Kingdom-based Smiths Group plc.

This marks a major milestone in Molex’s vision to enable technology that is transforming the future and improving people’s lives.

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Smiths Interconnect brings a diverse portfolio of complementary products and advantaged capabilities in ruggedized custom connectors, contacts, RF components and optical transceivers for harsh environments. The company also brings leading semiconductor test capabilities that complement Molex’s data communications and data center solutions to support growth in AI, along with a strong medical interconnect capability to support Medtech customers.

Key Highlights

Broadened portfolio elevates support for diverse customer applications across aerospace and defense, medical and semiconductor test with industry-leading solutions

Combined expertise across 90 plants in 22 countries offers more localized design and engineering support across North America, Europe and Asia

Expanded manufacturing footprint increases supply chain stability and resiliency

Largest Acquisition in Molex History

As the largest acquisition in Molex’s history, the addition of Smiths Interconnect positions Molex to drive innovation across the high-reliability interconnect market—encompassing aerospace and defense, space exploration, industrial, medical and semiconductor test industries. The combination of Smiths Interconnect’s capabilities with Molex’s global footprint, engineering strength, culture and financial strength enables Molex to deliver increased value to customers around the world.

The Smiths Interconnect acquisition expands Molex’s global footprint to over 90 plants across 22 countries, and its global headcount to over 55,000 employees. The integration creates strong design and technical alignment to enhance innovation and solution capabilities to provide more value to customers. This news builds upon the November 2024 acquisition of AirBorn by Molex, a foundational milestone in serving customers in the aerospace and defense market.

Industry Statements

“We are excited to finalize the Smiths Interconnect acquisition, which expands our portfolio and engineering expertise worldwide,” said Joe Nelligan, CEO, Molex.

“This acquisition reinforces Molex’s position as a leader across every sector where high reliability is critical,” said Michael Cole, SVP and president, Aerospace and Defense Solutions Division, Molex.

“The integration of Smiths Interconnect into the Molex engineering ecosystem is a significant win for the global design engineering community,” said Lew LaFornara, SVP, Global Interconnect Business Strategy, TTI.

About Molex

Molex is a global electronics leader committed to making the world a better, more-connected place. With a presence in more than 38 countries, Molex enables transformative technology innovation in the consumer device, aerospace and defense, data center, cloud, telecommunications, transportation, industrial automation and healthcare industries.

Source: Molex Press Release, April 1, 2026

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