Passive Components Blog
No Result
View All Result
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    YAGEO Extends Automotive Tantalum Polymer Capacitors for AI and ADAS Controllers

    Knowles Introduces PP Film Capacitors for High‑Stress Power Electronics

    High‑Power Current Sensing with YAGEO PK Metal Current Sensors

    AI Data Centers Push Aluminium Capacitor Prices Higher

    Murata Releases 1210 Metal Terminal Common Mode Choke for 10Base‑T1S In‑Vehicle Ethernet

    DigiKey Ads 27,000 New In-Stock Parts and 104 Additional Suppliers in Q2 2026

    Würth Elektronik Coupled Inductors Harnessing Leakage Inductance in SEPIC, ZETA and Ćuk Converters

    Samsung Introduces Ultra‑compact, High‑Capacitance MLCCs for AI Edge and Wearable designs

    Knowles Presents Pulse Power Capacitors for Demanding MedTech, Industrial and Defense Applications

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    EMC Design Fundamentals: Safe Use of Varistors and Common Mode Chokes in Mains and Data-Line Filters

    Ferrite versus Nanocrystalline Power Inductor Cores: Turns, Gap and Size

    KYOCERA AVX Presents Antenna Integrator Studio Tutorial for Antenna Placement and RF Design

    Power Design Simulation Tools for Faster Inductor Selection and Loss Optimization

    EMC‑Compliant PCB and Connector Design Guidelines

    Why Isolated DC/DC Power Supplies Fail Late, Würth Elektronik Podcast

    Designing 800 V DC EMC Filters: Calculation, Simulation and Measurement

    Current Sense Transformer Datasheet and Design‑in Guide

    Designing a USB Type‑C Flyback Planar Transformer with Frenetic’s Planar Tool

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • Dossiers
    • AI Hardware Dossier
    • Power Converter Dossier
    • Automotive Dossier
    • Capacitor Dossier
    • Resistor Dossier
    • Inductor Dossier
    • Circuit Protection Dossier
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    YAGEO Extends Automotive Tantalum Polymer Capacitors for AI and ADAS Controllers

    Knowles Introduces PP Film Capacitors for High‑Stress Power Electronics

    High‑Power Current Sensing with YAGEO PK Metal Current Sensors

    AI Data Centers Push Aluminium Capacitor Prices Higher

    Murata Releases 1210 Metal Terminal Common Mode Choke for 10Base‑T1S In‑Vehicle Ethernet

    DigiKey Ads 27,000 New In-Stock Parts and 104 Additional Suppliers in Q2 2026

    Würth Elektronik Coupled Inductors Harnessing Leakage Inductance in SEPIC, ZETA and Ćuk Converters

    Samsung Introduces Ultra‑compact, High‑Capacitance MLCCs for AI Edge and Wearable designs

    Knowles Presents Pulse Power Capacitors for Demanding MedTech, Industrial and Defense Applications

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    EMC Design Fundamentals: Safe Use of Varistors and Common Mode Chokes in Mains and Data-Line Filters

    Ferrite versus Nanocrystalline Power Inductor Cores: Turns, Gap and Size

    KYOCERA AVX Presents Antenna Integrator Studio Tutorial for Antenna Placement and RF Design

    Power Design Simulation Tools for Faster Inductor Selection and Loss Optimization

    EMC‑Compliant PCB and Connector Design Guidelines

    Why Isolated DC/DC Power Supplies Fail Late, Würth Elektronik Podcast

    Designing 800 V DC EMC Filters: Calculation, Simulation and Measurement

    Current Sense Transformer Datasheet and Design‑in Guide

    Designing a USB Type‑C Flyback Planar Transformer with Frenetic’s Planar Tool

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • Dossiers
    • AI Hardware Dossier
    • Power Converter Dossier
    • Automotive Dossier
    • Capacitor Dossier
    • Resistor Dossier
    • Inductor Dossier
    • Circuit Protection Dossier
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

Molex Completes Acquisition of Smiths Interconnect, Expanding Portfolio of High-Reliability Connectivity Solutions

1.4.2026
Reading Time: 3 mins read
A A

Molex, a global electronics leader and connectivity innovator, has completed the acquisition of Smiths Interconnect, a subsidiary of United Kingdom-based Smiths Group plc.

This marks a major milestone in Molex’s vision to enable technology that is transforming the future and improving people’s lives.

RelatedPosts

Molex Unveils Automotive Ethernet Connectors for Next‑Gen SDV Architectures

Molex Expanded AirBorn SInergy Hybrid Connectors with 25 A Power Modules

Molex Extends Cardinal Multi‑Port Coax Assemblies to 145 GHz for AI and 6G Test

Smiths Interconnect brings a diverse portfolio of complementary products and advantaged capabilities in ruggedized custom connectors, contacts, RF components and optical transceivers for harsh environments. The company also brings leading semiconductor test capabilities that complement Molex’s data communications and data center solutions to support growth in AI, along with a strong medical interconnect capability to support Medtech customers.

Key Highlights

Broadened portfolio elevates support for diverse customer applications across aerospace and defense, medical and semiconductor test with industry-leading solutions

Combined expertise across 90 plants in 22 countries offers more localized design and engineering support across North America, Europe and Asia

Expanded manufacturing footprint increases supply chain stability and resiliency

Largest Acquisition in Molex History

As the largest acquisition in Molex’s history, the addition of Smiths Interconnect positions Molex to drive innovation across the high-reliability interconnect market—encompassing aerospace and defense, space exploration, industrial, medical and semiconductor test industries. The combination of Smiths Interconnect’s capabilities with Molex’s global footprint, engineering strength, culture and financial strength enables Molex to deliver increased value to customers around the world.

The Smiths Interconnect acquisition expands Molex’s global footprint to over 90 plants across 22 countries, and its global headcount to over 55,000 employees. The integration creates strong design and technical alignment to enhance innovation and solution capabilities to provide more value to customers. This news builds upon the November 2024 acquisition of AirBorn by Molex, a foundational milestone in serving customers in the aerospace and defense market.

Industry Statements

“We are excited to finalize the Smiths Interconnect acquisition, which expands our portfolio and engineering expertise worldwide,” said Joe Nelligan, CEO, Molex.

“This acquisition reinforces Molex’s position as a leader across every sector where high reliability is critical,” said Michael Cole, SVP and president, Aerospace and Defense Solutions Division, Molex.

“The integration of Smiths Interconnect into the Molex engineering ecosystem is a significant win for the global design engineering community,” said Lew LaFornara, SVP, Global Interconnect Business Strategy, TTI.

About Molex

Molex is a global electronics leader committed to making the world a better, more-connected place. With a presence in more than 38 countries, Molex enables transformative technology innovation in the consumer device, aerospace and defense, data center, cloud, telecommunications, transportation, industrial automation and healthcare industries.

Source: Molex Press Release, April 1, 2026

Related

Recent Posts

YAGEO Extends Automotive Tantalum Polymer Capacitors for AI and ADAS Controllers

31.7.2026
35

AI Data Centers Push Aluminium Capacitor Prices Higher

30.7.2026
91

DigiKey Ads 27,000 New In-Stock Parts and 104 Additional Suppliers in Q2 2026

30.7.2026
18

June 2026: AI Demand Pushes Japanese and Korean MLCC Makers to Five‑Year Shipment High

28.7.2026
120

July 2026 Interconnect, Passives and Electromechanical Components Market Insights

27.7.2026
86

TT Electronics: How Qualification Underpins Reliable Selection of Thick‑Film Resistors

27.7.2026
92

Exxelia Offers 1200V Capacitors and Magnetics for 800V Aerospace Platforms

22.7.2026
62

LeanBOM: Practical Cross‑Technology Capacitor Search by Real Working Conditions

14.7.2026
134

In the Age of AI, Every Watt Counts: Implications for Components

13.7.2026
141

Upcoming Events

Sep 29
16:00 - 17:00 CEST

Cybersecurity 2026

View Calendar

Popular Posts

  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • YAGEO Announces July 2026 Capacitor Price Increase

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • MLCCs in the Age of AI: Q2 2026 Market Tightness

    0 shares
    Share 0 Tweet 0
  • MLCC and Ceramic Capacitors

    0 shares
    Share 0 Tweet 0
  • Earthing Systems and IEC Classification Explained

    0 shares
    Share 0 Tweet 0
  • Dual Active Bridge (DAB) Topology

    0 shares
    Share 0 Tweet 0
  • Core Materials, Permeability and Their Losses

    0 shares
    Share 0 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© EPCI - Leading Passive Components Educational and Information Site

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • Dossiers
  • PCNS

© EPCI - Leading Passive Components Educational and Information Site