News

Hirose Electric has introduced the IT18 series, a COM‑HPC compliant BGA mezzanine connector designed for high‑speed, high‑density embedded computing modules...

The YAGEO KEMET HRA Z‑Level series extends high‑reliability multilayer ceramic capacitors (MLCCs) beyond traditional MIL‑SPEC capacitance limits, while aligning its...

Würth Elektronik has significantly expanded its Asia Quality Design Center (QDC Asia) in Shenzhen, China, officially inaugurating Laboratory Phase II...

Samsung Electro-Mechanics has introduced a new range of ultra-high-voltage MLCCs in 1210 (3.2 × 2.5 mm) size for xEV high-voltage...

YAGEO, one of the world’s top three MLCC suppliers, is entering Q2 2026 with stronger fundamentals than in previous passive‑component...

TDK has introduced the B82722V6*B040 series of high‑voltage, current‑compensated ring‑core double chokes for DC bus voltages up to 1250 V...

Vishay’s new IHLP1212‑EZ‑1Z power inductors bring the well‑known IHLP low‑profile, high‑current technology into a very compact 1212 case size (3.0...

Planar magnetics are an attractive option for high‑density power converters thanks to their low profile, excellent repeatability and large surface...

The new released APCA7045 ferrite shielded power inductors from YAGEO Group target modern high‑current DC‑DC converters and embedded power rails...

Robots and humanoid robotic systems are rapidly transforming into sophisticated electromechanical systems. These systems often integrate high-performance AI computing, powerful...