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a) Model of the specific capacitance and energy density for the MAL capacitors assuming a 20 nm dielectric thickness of either Al:HfO2 or Pb(Hf,Ti)O3 simulated on a range of specific areas corresponding to conventional, commercially available foams through the top values found in literature. b) The nominal fabrication scheme for the MAL capacitor. Source: Energy Technology Journal https://doi.org/10.1002/ente.202400956

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    Input Capacitance and Input Charge of MOSFET Gates

    TDK Introduces DC link Capacitor for xEV Traction Inverters

    Positive Market Sentiment Falls in September 2024 ECIA NA Electronic Components Survey

    Wk 41 Electronics Supply Chain Digest

    Smoltek’s New Zapping Method Accelerates CNF-MIM Capacitors Development

    a) Model of the specific capacitance and energy density for the MAL capacitors assuming a 20 nm dielectric thickness of either Al:HfO2 or Pb(Hf,Ti)O3 simulated on a range of specific areas corresponding to conventional, commercially available foams through the top values found in literature. b) The nominal fabrication scheme for the MAL capacitor. Source: Energy Technology Journal https://doi.org/10.1002/ente.202400956

    Researchers Demonstrated ALD-Based Antiferroelectric-Coated Metal Foam Infiltrated with Liquid Metal as a Dielectric Capacitor

    Supercapacitor Benefits in Backup Power and Load Management Applications

    TDK Expanded CeraLink MLCC Ceramic Capacitors to 900 V for EV Applications

    Bourns Unveils New High Current Gas Discharge Tube Circuit Protection

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    Input Capacitance and Input Charge of MOSFET Gates

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    Input Capacitance and Input Charge of MOSFET Gates

    TDK Introduces DC link Capacitor for xEV Traction Inverters

    Positive Market Sentiment Falls in September 2024 ECIA NA Electronic Components Survey

    Wk 41 Electronics Supply Chain Digest

    Smoltek’s New Zapping Method Accelerates CNF-MIM Capacitors Development

    a) Model of the specific capacitance and energy density for the MAL capacitors assuming a 20 nm dielectric thickness of either Al:HfO2 or Pb(Hf,Ti)O3 simulated on a range of specific areas corresponding to conventional, commercially available foams through the top values found in literature. b) The nominal fabrication scheme for the MAL capacitor. Source: Energy Technology Journal https://doi.org/10.1002/ente.202400956

    Researchers Demonstrated ALD-Based Antiferroelectric-Coated Metal Foam Infiltrated with Liquid Metal as a Dielectric Capacitor

    Supercapacitor Benefits in Backup Power and Load Management Applications

    TDK Expanded CeraLink MLCC Ceramic Capacitors to 900 V for EV Applications

    Bourns Unveils New High Current Gas Discharge Tube Circuit Protection

    Trending Tags

    • Ripple Current
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    • Leakage Current
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    Input Capacitance and Input Charge of MOSFET Gates

    Overvoltage Protection Selection Guidelines: TVS Diodes, MOVs, and ESD MOV Varistors

    DC BIAS Voltage Dependence of Ferroelectric Class 2 MLCC Multilayer Ceramic Capacitors

    EMI Explanation

    How to Implement Protection and Power Management ICs for Supercapacitors

    How to Improve Efficiency of Back Converter at Low Power Using Controlled Inductor.

    Aging of Molded Inductors; WE video

    Aging of Class II MLCC Ceramic Capacitors; Video Presentation

    Potential Benefits and Limitations of Amorphous Core for APFC inductors

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Coilcraft Magnetic Minutes – Inductors Selection for LEDs

5.12.2019
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