Passive Components Blog
No Result
View All Result
  • Home
  • News
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    August 2026 Interconnect, Passives and Electromechanical Components Market Insights

    AEM Introduced High-Power Fuses for Compact Automotive and Industrial Overcurrent Protection

    Knowles Cornell Dubilier 105C Flatpack Aluminum Electrolytic Capacitors Target Low-Profile High-Density Power Designs

    Vishay Thin Film Chip Resistors Combine up to 50 GHz Operation with High Power Density

    Samsung Electro-Mechanics Secures KRW 1.0722 Trillion AI Server MLCC Supply Contract

    KYOCERA AVX Adds 0201 C0G RF MLCCs to KGU Ultra-Low-ESR Capacitor Series

    Vishay Extends High-Current Common-Mode Chokes with 30 A EMI Filtering up to 150 °C

    Bourns Copper-Electrode MOV Series Targets High-Energy Line Surge Protection

    Bourns Expands 12 mm SMD Incremental Encoder with Shaft-Length Options for Compact HMI Controls

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • Knowledge Blog
  • Dossiers
    • AI Hardware Dossier
    • Automotive Dossier
    • Industrial Robotics Dossier
    • Power Converter Dossier
    • Capacitor Dossier
    • Resistor Dossier
    • Inductor Dossier
    • Circuit Protection Dossier
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
  • Home
  • News
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    August 2026 Interconnect, Passives and Electromechanical Components Market Insights

    AEM Introduced High-Power Fuses for Compact Automotive and Industrial Overcurrent Protection

    Knowles Cornell Dubilier 105C Flatpack Aluminum Electrolytic Capacitors Target Low-Profile High-Density Power Designs

    Vishay Thin Film Chip Resistors Combine up to 50 GHz Operation with High Power Density

    Samsung Electro-Mechanics Secures KRW 1.0722 Trillion AI Server MLCC Supply Contract

    KYOCERA AVX Adds 0201 C0G RF MLCCs to KGU Ultra-Low-ESR Capacitor Series

    Vishay Extends High-Current Common-Mode Chokes with 30 A EMI Filtering up to 150 °C

    Bourns Copper-Electrode MOV Series Targets High-Energy Line Surge Protection

    Bourns Expands 12 mm SMD Incremental Encoder with Shaft-Length Options for Compact HMI Controls

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • Knowledge Blog
  • Dossiers
    • AI Hardware Dossier
    • Automotive Dossier
    • Industrial Robotics Dossier
    • Power Converter Dossier
    • Capacitor Dossier
    • Resistor Dossier
    • Inductor Dossier
    • Circuit Protection Dossier
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

COTS in space: realist navigators wanted, part I

1.3.2018
Reading Time: 3 mins read
A A

Source: Intelligent Aerospace article

MIL-SPEC, military specifications, started some 50 years ago, for well-justified reasons. At that time, the use of integrated circuits (ICs) was in the infancy stage, the personal computer had not yet been built, the Internet had not yet been born. The system proved itself successful, although the relations between the government and industry have not always been harmonized. After decades of “faithfully” following MIL-SPEC system rules, a series of EEE component manufacturers have left the above regime due to global developments. Business decisions led them to a more profitable market: the commercial one.

RelatedPosts

August 2026 Interconnect, Passives and Electromechanical Components Market Insights

AEM Introduced High-Power Fuses for Compact Automotive and Industrial Overcurrent Protection

Knowles Cornell Dubilier 105C Flatpack Aluminum Electrolytic Capacitors Target Low-Profile High-Density Power Designs

The relevant EEE component manufacturers proved that business decisions are stronger than politics. The military has always emphasized quality over price. It was not until the massive budget cutbacks and the shrinking military EEE components availability that the U.S. Department of Defense (DOD) was forced to change its policy. The 1994 MIL-SPEC reform turned down numerous barriers between industry and government. The policy makers realized that striving to overcome the global developments is a lost case. The DOD has realized its goal of increased access to commercial technology.

The general reform idea was: Don’t tell a person how you want them to do something, but rather tell them what you want.

The space industry has been exempted from the above reform. However, the same factors, leading to the above reform, apply also to the space industry and the relevant policy makers. Unfortunately, grosso modo, 50 years after creation, more than 20 years after the 1994 reform, the traditional MIL-SPEC testing/screening concept still dominates the official space EEE components policy.

Space/military EEE components are preferred over the commercial off-the-shelf (COTS) alternative. Nobody argues about the space/military EEE components suitability for space applications, providing their availability is secured. Today, the most certain thing about the military/space EEE components availability is its uncertainty. It has been proved in the past that the power of EEE components manufacturers is the one shaping the future of the relevant market.

“Study the past if you would define the future.” ― Confucius

It is a mystery what could be the basis for the space policy makers (governmental NASA, intergovernmental ESA) to predict the space/military EEE components future availability?!

“The only way to predict the future is to have power to shape the future.” ― Eric Hoffer

The present space EEE components policy is based on first priority selection of space/military grade and last resort selection of COTS with post procurement testing/screening requirements. The policy makers overestimate their capability to secure or forecast the future availability of the space/military-grade EEE components and underestimate the potential of using EEE COTS components in space applications.

At this point we urgently need realist navigators, who can look at things as they are and deal with it in a practical manner. This article attempts to outline the uncertain situation the users are dealing with it, looking for guidance.

Global EEE components market
As stated above, nobody argues about the space/military EEE components suitability for space applications, providing their availability is secured.

Saying that, also it has to be restated that most certain thing about the military/space EEE components availability is its uncertainty. Just looking at the global EEE component market structure (less than 0.3 percent military in dollars), the critical availability security issue is easily identified. It is easy to identify the problem, but it has to be also addressed as soon as possible in order to find a way to secure the future.

The above is a good example of forecasting versus predicting. The goal of forecasting is not to predict the future but to tell you what you need to know to take meaningful action in the present.

Commercial EEE components market growth strengthens the interest of manufacturer in the commercial market share and consequently weakens the interest in the space/military share.

Stronger‑than‑forecast global demand for components has followed an extended period of low capital investment by the companies that make them. There are ongoing capacity concerns. The growing demand is causing a build‑up of extended lead times, with a small number of products now understood to be subject to lead times of as much as a year, meaning they are effectively on allocation.
Positive growth of the commercial market is expected to continue, following, interalia, the infancy stage of Internet of Things (IoT).

Read part II here

Author biography
The author, Dan Friedlander, graduated Engineering School/Tel Aviv University with a degree in physics (1965-1969). He has 44 years of experience in Component Engineering at MBT/Israeli Aerospace Industries (1969 to 2013), as Head of Components Engineering. As such, he was responsible for all aspects of EEE components – including policymaking, standardization at corporate level, approval, etc. – for military and space applications. Now retired, Friedlander is an industry consultancy (2013 to present).

Related

Recent Posts

August 2026 Interconnect, Passives and Electromechanical Components Market Insights

4.9.2026
11

Knowles Cornell Dubilier 105C Flatpack Aluminum Electrolytic Capacitors Target Low-Profile High-Density Power Designs

4.9.2026
6

Vishay Thin Film Chip Resistors Combine up to 50 GHz Operation with High Power Density

3.9.2026
9

Samsung Electro-Mechanics Secures KRW 1.0722 Trillion AI Server MLCC Supply Contract

3.9.2026
34

KYOCERA AVX Adds 0201 C0G RF MLCCs to KGU Ultra-Low-ESR Capacitor Series

3.9.2026
17

Vishay Extends High-Current Common-Mode Chokes with 30 A EMI Filtering up to 150 °C

3.9.2026
15

Bourns Expands 12 mm SMD Incremental Encoder with Shaft-Length Options for Compact HMI Controls

1.9.2026
8

KEMET HRA X7R High-Reliability MLCCs Target Higher Capacitance in Defense and Aerospace Electronics

1.9.2026
37

B–H Curve-Based Inductor Modelling in LTspice: A Current-Dependent Magnetic Model

31.8.2026
36

Upcoming Events

Sep 10
11:00 - 12:00 CEST

Equipment models and model strategies for Space Missions

Sep 16
17:00 - 18:00 CEST

Designing a 5 kW, 800 V-to-50 V PSFB Converter for Next-Generation Data Centers

Sep 29
16:00 - 17:00 CEST

Cybersecurity 2026

View Calendar

Popular Posts

  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Earthing Systems and IEC Classification Explained

    0 shares
    Share 0 Tweet 0
  • MLCC and Ceramic Capacitors

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Capacitor Charging and Discharging

    0 shares
    Share 0 Tweet 0
  • Audio Capacitors: Choosing Capacitors for Crossover Circuits

    0 shares
    Share 0 Tweet 0
  • Resistor Symbols

    0 shares
    Share 0 Tweet 0
  • Thermistors Basics, NTC and PTC Thermistors

    0 shares
    Share 0 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© 2015–2026
All rights reserved

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • Dossiers
  • PCNS

© 2015–2026
All rights reserved