Passive Components Blog
No Result
View All Result
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    When More Capacitance Hurts Reliability: The Role of the Metallic Skeleton in Tantalum Anodes

    Why Power Inductors Use a Ferrite Core With an Air Gap

    Wk 16 Electronics Supply Chain Digest

    YAGEO Introduces High‑Current Y2/X1 Film Capacitors for Wide-bandgap Power Systems

    Amphenol Explanded Liquid Cooling Connectors for AI, ESS and EV Systems

    Hirose Introduced BGA connector for PCIe Gen6 for AI and Edge Computing

    YAGEO Introduces High Rel MLCCs Beyond MIL-Spec Limits

    Würth Elektronik Expanded Capacity for Validation and Services in Asia

    Samsung Introduces Ultra-High-Voltage 1500 V MLCCs for xEV Powertrains

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    Why Power Inductors Use a Ferrite Core With an Air Gap

    Transformer-Based Power-Line Harvester Magnetic Design

    Thermal Modeling of Magnetics

    Standard vs Planar LLC transformers Comparison for Battery Chargers

    How Modern Tools Model Magnetic Components for Power Electronics

    Advanced Loss Modeling for Planar Magnetics in the Frenetic Planar Tool

    2026 Power Magnetics Design Trends: Flyback, DAB and Planar

    Enabling Software‑Defined Vehicle Architectures: Automotive Ethernet and Zonal Smart Power

    Calculating Resistance Value of a Flyback RC Snubber 

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • DossiersNew
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    When More Capacitance Hurts Reliability: The Role of the Metallic Skeleton in Tantalum Anodes

    Why Power Inductors Use a Ferrite Core With an Air Gap

    Wk 16 Electronics Supply Chain Digest

    YAGEO Introduces High‑Current Y2/X1 Film Capacitors for Wide-bandgap Power Systems

    Amphenol Explanded Liquid Cooling Connectors for AI, ESS and EV Systems

    Hirose Introduced BGA connector for PCIe Gen6 for AI and Edge Computing

    YAGEO Introduces High Rel MLCCs Beyond MIL-Spec Limits

    Würth Elektronik Expanded Capacity for Validation and Services in Asia

    Samsung Introduces Ultra-High-Voltage 1500 V MLCCs for xEV Powertrains

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    Why Power Inductors Use a Ferrite Core With an Air Gap

    Transformer-Based Power-Line Harvester Magnetic Design

    Thermal Modeling of Magnetics

    Standard vs Planar LLC transformers Comparison for Battery Chargers

    How Modern Tools Model Magnetic Components for Power Electronics

    Advanced Loss Modeling for Planar Magnetics in the Frenetic Planar Tool

    2026 Power Magnetics Design Trends: Flyback, DAB and Planar

    Enabling Software‑Defined Vehicle Architectures: Automotive Ethernet and Zonal Smart Power

    Calculating Resistance Value of a Flyback RC Snubber 

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • DossiersNew
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

Detection of hidden delamination in plastic encapsulation packaging by SAM

29.7.2019
Reading Time: 2 mins read
A A

Source: Alter Technology article

Scanning acoustic microscopy (SAM) is used to locate the paths for water ingress in plastic encapsulated microelectronic systems. This is so thanks to the capability to analyze hidden delamination on surface-breaking parts.

RelatedPosts

When More Capacitance Hurts Reliability: The Role of the Metallic Skeleton in Tantalum Anodes

Why Power Inductors Use a Ferrite Core With an Air Gap

Wk 16 Electronics Supply Chain Digest

Sample & Method
High-current low dropout regulator encapsulated in a TO-263 package is inspected by confocal scanning acoustic microscopy (C-SAM). Probe frequency and inspection procedure are adapted to the internal structure of this plastic encapsulated microelectronic part.

In this case the architecture of the system includes features at different depths within a thick package. Therefore, we perform multi-depth confocal analyses at the different focal planes of interest. Such analyses are only possible by combining low and high frequency transducers with suitable filters to improve the resolution. A-scan inspection is used to confirm deviation observed by scanning acoustic tomography.

Remarks
Thorough scanning acoustic inspection is used to confocally inspect features at different depths (C-mode SAM). The technique reveals the systemic delamination on all the lead fingers. Such a kind of delamination on surface breaking features represents an important risk of entrance of water and other contaminants from the outside environment. In fact, darker areas highlighted with blue arrows are ascribed delimitated areas partially filled with water, which reduces the intensity of the reflected beam.

Assessment as per different test methods
In Alter Technology scanning acoustic tomography inspection is conducted in accordance with different inspection methods as summarized in the following table. In this case the delaminated area does not reach the active zone, i.e. it does not extend over the full length of the surface breaking part. Therefore, the observed delamination is acceptable.

The observed water features are also an important issue to take into account, although they are not considered by the inspection methods in the table. In addition, there is a severe risk if the delaminated area increase, for instance, due to mechanical or thermomechanical stress. Thus, it is highly advisable to submit this specimen to thermomechanical stress (e.g. temperature cycling test) to study the evolution of the observed features.

Specification Partial delamination of a surface breaking part (lead)
1 J-STD-020E Compliant
4 ESCC 25200 Compliant
7 PEM-INST-001 Compliant
10 MIL-STD-1580 Compliant

 

Related

Recent Posts

When More Capacitance Hurts Reliability: The Role of the Metallic Skeleton in Tantalum Anodes

20.4.2026
5

Why Power Inductors Use a Ferrite Core With an Air Gap

20.4.2026
3

YAGEO Introduces High‑Current Y2/X1 Film Capacitors for Wide-bandgap Power Systems

17.4.2026
10

YAGEO Introduces High Rel MLCCs Beyond MIL-Spec Limits

16.4.2026
36

Samsung Introduces Ultra-High-Voltage 1500 V MLCCs for xEV Powertrains

16.4.2026
18

YAGEO Q1 2026 Results: AI Servers and Pricing Power Behind a Moderate Q2 Outlook

16.4.2026
53

TDK Introduces High‑Voltage Common‑Mode Chokes for Compact 1250 V DC Converters

16.4.2026
19

Vishay Extends Power Inductors for DC/DC with 1212 Compact Case

16.4.2026
16

Modeling Planar Magnetics Temperature: Practical Guidelines for Power Electronics Engineers

15.4.2026
19

Upcoming Events

Apr 21
16:00 - 17:00 CEST

Heatsink Solutions: Thermal Management in electronic devices

Apr 22
17:00 - 17:30 CEST

Magnetics in a high frequency GaN era

Apr 22
17:00 - 18:00 CEST

Derating Tantalum, Film, and Ceramic Capacitors

View Calendar

Popular Posts

  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Dual Active Bridge (DAB) Topology

    0 shares
    Share 0 Tweet 0
  • MLCC and Ceramic Capacitors

    0 shares
    Share 0 Tweet 0
  • Capacitor Charging and Discharging

    0 shares
    Share 0 Tweet 0
  • Plastic Materials Dielectric Constant and DF

    4 shares
    Share 4 Tweet 0
  • Ripple Current and its Effects on the Performance of Capacitors

    3 shares
    Share 3 Tweet 0
  • MLCC Case Sizes Standards Explained

    0 shares
    Share 0 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© EPCI - Leading Passive Components Educational and Information Site

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • PCNS

© EPCI - Leading Passive Components Educational and Information Site

This website uses cookies. By continuing to use this website you are giving consent to cookies being used. Visit our Privacy and Cookie Policy.
Go to mobile version