Passive Components Blog
No Result
View All Result
  • Home
  • News
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Optoelectronics and Isolation
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest
    Schematic of a titanium nitride thin-film inductor within a CMOS poly-resistor stack beside its integrated resonator circuit.

    TiN Superinductors Bring Compact Cryogenic Inductance to CMOS

    Close-up of reddish-brown metallic rocks illustrating TTI MarketEYE’s connector raw material cost analysis

    Connector Raw Material Costs Rise 20.9% in Q2 2026

    AI and Passive Components: Structural Growth Beyond Data Centers

    YAGEO PMT6397 push-pull transformer with a segmented toroidal winding and surface-mount terminals

    YAGEO Releases Push-Pull Transformers for Isolated 3 W Supplies

    Transformer Losses and Thermal Design: Modelling and Validation

    DMASS Europe Q3 2026 electronic component distribution market overview

    European Component Distribution Jumps 42.7% in Q3 2026

    Bourns MSF series four-terminal current-sense shunt resistor with radial PCB terminals

    Bourns Introduces Four-Terminal Shunt Resistors for Current Sensing

    Würth Elektronik WE-SLSP SMT common-mode choke with a square package and four terminals.

    Würth Elektronik Releases Common-Mode Chokes for 100 V Data and Power Lines

    Assorted electronic connectors for USB, audio, video and power interfaces

    Top 10 Connector Manufacturers 2025: Amphenol Takes the Lead

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • Knowledge Blog
  • Dossiers
    • Aerospace and Defense Passive Components Dossier
    • AI Hardware Dossier
    • Automotive Dossier
    • Industrial Robotics Dossier
    • Power Converter Dossier
    • Capacitor Dossier
    • Circuit Protection Dossier
    • Inductor Dossier
    • Resistor Dossier
    • Silicon Capacitors and Integrated Passives Dossier
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
  • Home
  • News
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Optoelectronics and Isolation
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest
    Schematic of a titanium nitride thin-film inductor within a CMOS poly-resistor stack beside its integrated resonator circuit.

    TiN Superinductors Bring Compact Cryogenic Inductance to CMOS

    Close-up of reddish-brown metallic rocks illustrating TTI MarketEYE’s connector raw material cost analysis

    Connector Raw Material Costs Rise 20.9% in Q2 2026

    AI and Passive Components: Structural Growth Beyond Data Centers

    YAGEO PMT6397 push-pull transformer with a segmented toroidal winding and surface-mount terminals

    YAGEO Releases Push-Pull Transformers for Isolated 3 W Supplies

    Transformer Losses and Thermal Design: Modelling and Validation

    DMASS Europe Q3 2026 electronic component distribution market overview

    European Component Distribution Jumps 42.7% in Q3 2026

    Bourns MSF series four-terminal current-sense shunt resistor with radial PCB terminals

    Bourns Introduces Four-Terminal Shunt Resistors for Current Sensing

    Würth Elektronik WE-SLSP SMT common-mode choke with a square package and four terminals.

    Würth Elektronik Releases Common-Mode Chokes for 100 V Data and Power Lines

    Assorted electronic connectors for USB, audio, video and power interfaces

    Top 10 Connector Manufacturers 2025: Amphenol Takes the Lead

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • Knowledge Blog
  • Dossiers
    • Aerospace and Defense Passive Components Dossier
    • AI Hardware Dossier
    • Automotive Dossier
    • Industrial Robotics Dossier
    • Power Converter Dossier
    • Capacitor Dossier
    • Circuit Protection Dossier
    • Inductor Dossier
    • Resistor Dossier
    • Silicon Capacitors and Integrated Passives Dossier
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

Detection of hidden delamination in plastic encapsulation packaging by SAM

29.7.2019
Reading Time: 2 mins read
A A

Source: Alter Technology article

Scanning acoustic microscopy (SAM) is used to locate the paths for water ingress in plastic encapsulated microelectronic systems. This is so thanks to the capability to analyze hidden delamination on surface-breaking parts.

RelatedPosts

TiN Superinductors Bring Compact Cryogenic Inductance to CMOS

Connector Raw Material Costs Rise 20.9% in Q2 2026

AI and Passive Components: Structural Growth Beyond Data Centers

Sample & Method
High-current low dropout regulator encapsulated in a TO-263 package is inspected by confocal scanning acoustic microscopy (C-SAM). Probe frequency and inspection procedure are adapted to the internal structure of this plastic encapsulated microelectronic part.

In this case the architecture of the system includes features at different depths within a thick package. Therefore, we perform multi-depth confocal analyses at the different focal planes of interest. Such analyses are only possible by combining low and high frequency transducers with suitable filters to improve the resolution. A-scan inspection is used to confirm deviation observed by scanning acoustic tomography.

Remarks
Thorough scanning acoustic inspection is used to confocally inspect features at different depths (C-mode SAM). The technique reveals the systemic delamination on all the lead fingers. Such a kind of delamination on surface breaking features represents an important risk of entrance of water and other contaminants from the outside environment. In fact, darker areas highlighted with blue arrows are ascribed delimitated areas partially filled with water, which reduces the intensity of the reflected beam.

Assessment as per different test methods
In Alter Technology scanning acoustic tomography inspection is conducted in accordance with different inspection methods as summarized in the following table. In this case the delaminated area does not reach the active zone, i.e. it does not extend over the full length of the surface breaking part. Therefore, the observed delamination is acceptable.

The observed water features are also an important issue to take into account, although they are not considered by the inspection methods in the table. In addition, there is a severe risk if the delaminated area increase, for instance, due to mechanical or thermomechanical stress. Thus, it is highly advisable to submit this specimen to thermomechanical stress (e.g. temperature cycling test) to study the evolution of the observed features.

Specification Partial delamination of a surface breaking part (lead)
1 J-STD-020E Compliant
4 ESCC 25200 Compliant
7 PEM-INST-001 Compliant
10 MIL-STD-1580 Compliant

 

Related

Recent Posts

Schematic of a titanium nitride thin-film inductor within a CMOS poly-resistor stack beside its integrated resonator circuit.

TiN Superinductors Bring Compact Cryogenic Inductance to CMOS

5.11.2026
6
YAGEO PMT6397 push-pull transformer with a segmented toroidal winding and surface-mount terminals

YAGEO Releases Push-Pull Transformers for Isolated 3 W Supplies

5.11.2026
7

Transformer Losses and Thermal Design: Modelling and Validation

4.11.2026
15
Bourns MSF series four-terminal current-sense shunt resistor with radial PCB terminals

Bourns Introduces Four-Terminal Shunt Resistors for Current Sensing

4.11.2026
16
Würth Elektronik WE-SLSP SMT common-mode choke with a square package and four terminals.

Würth Elektronik Releases Common-Mode Chokes for 100 V Data and Power Lines

4.11.2026
12
Schematic diagrams illustrating the physical model of the stripline microinductor.

Stripline Microinductors with Nickel–Iron Oxide Cores

4.11.2026
8
Würth Elektronik WE-LHMI and WE-HCI power inductor comparison slide showing current ratings and maximum operating temperatures

Power Inductor Selection: Ferrite vs Powder Core Trade-Offs, Würth Elektronik Webinar

3.11.2026
30
Bourns PWR163 DPAK-style surface-mount power resistor with moulded housing, metal backplate and terminals

Bourns Releases Power Resistor Adds Reverse-Pin Configuration

3.11.2026
5
Conceptual polypropylene DC-link film capacitor module with parallel cells and copper interconnections

DC-Link Film Capacitor Modules: Inductance and Thermal Design, Jianghai-Europe Tech Memo

3.11.2026
20

Upcoming Events

Nov 24
16:00 - 17:00 CET

Select the Correct Components for Your DC/DC Converter

Dec 1
16:00 - 17:00 CET

Developing low-noise mixed-signal systems

Dec 8
16:00 - 17:00 CET

WE-CCMF: Design Principles, Layout Guidelines and Measurement Results for High-Speed EMI Filtering

View Calendar

Popular Posts

  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • September 2026 Interconnect, Passives and Electromechanical Components Market Insights

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Capacitor Charging and Discharging

    0 shares
    Share 0 Tweet 0
  • RF Connector Types: How To Choose the Right One

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Passive Low Pass Filters: Fundamentals and EMI Design

    0 shares
    Share 0 Tweet 0
  • Audio Capacitors: Choosing Capacitors for Crossover Circuits

    0 shares
    Share 0 Tweet 0
  • MLCC and Ceramic Capacitors

    0 shares
    Share 0 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© 2015–2026
All rights reserved

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • Dossiers
  • PCNS

© 2015–2026
All rights reserved