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    Bourns Releases High Current Metal Alloy-based, Multilayer Power Chip Inductors

    Smiths Interconnect Extends Space-Qualified, High-Reliability Fixed Chip Attenuators 

    Samtec Expands Offering of Slim, High-Density HD Array Connectors

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ESD Protection Explained for Robust Electronic Systems Design

1.11.2021
Reading Time: 1 min read
A A

System Efficient ESD Design (SEED) address the protection of I/O against ESD using simulation. This allows to predict the robustness against damaging ESD and allows to reduce the likelihood of disturbances caused by ESD (soft-failure). Reduced design margin due to smaller, less current carrying metallization and contacts and thinner gate oxide has reduced the design window for ESD protection to a few V and currents of less than 2 A for high speed I/O such as USB 4.x.

This, and the need to use low capacitance devices inhibits a design by data sheet. In simulation based design models for the TVS, which include the transient turn-on and models for the IO of the IC are combined with all passive interconnect to create a model that predicts currents and voltage at the IC for different rise time and amplitude ESD pulses.

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