Passive Components Blog
No Result
View All Result
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    Modelithics Releases COMPLETE v26.1 for Keysight ADS

    April 2026 Interconnect, Passives and Electromechanical Components Market Insights

    SPICE Simulation of Non-Linear Resistors: Vishay’s Thermistor and PPTC Modelling Ecosystem

    KYOCERA AVX Introduces Traction‑Grade DC Link Film Capacitors

    When More Capacitance Hurts Reliability: The Role of the Metallic Skeleton in Tantalum Anodes

    Why Power Inductors Use a Ferrite Core With an Air Gap

    Wk 16 Electronics Supply Chain Digest

    YAGEO Introduces High‑Current Y2/X1 Film Capacitors for Wide-bandgap Power Systems

    Amphenol Explanded Liquid Cooling Connectors for AI, ESS and EV Systems

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    Why Power Inductors Use a Ferrite Core With an Air Gap

    Transformer-Based Power-Line Harvester Magnetic Design

    Thermal Modeling of Magnetics

    Standard vs Planar LLC transformers Comparison for Battery Chargers

    How Modern Tools Model Magnetic Components for Power Electronics

    Advanced Loss Modeling for Planar Magnetics in the Frenetic Planar Tool

    2026 Power Magnetics Design Trends: Flyback, DAB and Planar

    Enabling Software‑Defined Vehicle Architectures: Automotive Ethernet and Zonal Smart Power

    Calculating Resistance Value of a Flyback RC Snubber 

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • DossiersNew
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    Modelithics Releases COMPLETE v26.1 for Keysight ADS

    April 2026 Interconnect, Passives and Electromechanical Components Market Insights

    SPICE Simulation of Non-Linear Resistors: Vishay’s Thermistor and PPTC Modelling Ecosystem

    KYOCERA AVX Introduces Traction‑Grade DC Link Film Capacitors

    When More Capacitance Hurts Reliability: The Role of the Metallic Skeleton in Tantalum Anodes

    Why Power Inductors Use a Ferrite Core With an Air Gap

    Wk 16 Electronics Supply Chain Digest

    YAGEO Introduces High‑Current Y2/X1 Film Capacitors for Wide-bandgap Power Systems

    Amphenol Explanded Liquid Cooling Connectors for AI, ESS and EV Systems

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    Why Power Inductors Use a Ferrite Core With an Air Gap

    Transformer-Based Power-Line Harvester Magnetic Design

    Thermal Modeling of Magnetics

    Standard vs Planar LLC transformers Comparison for Battery Chargers

    How Modern Tools Model Magnetic Components for Power Electronics

    Advanced Loss Modeling for Planar Magnetics in the Frenetic Planar Tool

    2026 Power Magnetics Design Trends: Flyback, DAB and Planar

    Enabling Software‑Defined Vehicle Architectures: Automotive Ethernet and Zonal Smart Power

    Calculating Resistance Value of a Flyback RC Snubber 

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • DossiersNew
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

MLCC Manufacturers Consider Price Increase as AI Demand Outpaces Supply

18.2.2026
Reading Time: 4 mins read
A A

AI server demand is rapidly absorbing high‑end MLCC capacity and manufacturers are considering price increase of the high end MLCC capacitors needed for these applications.

AI server demand: from forecast to capacity stress

The MLCC industry has been discussing the impact of AI servers on capacitor demand for several years, but 2025–2026 is when this demand is visibly stressing available high‑end capacity. Murata has highlighted that AI‑server‑related MLCC demand is on track for a strong double‑digit CAGR toward 2030, driven by the much higher MLCC counts per accelerator board and per rack compared with conventional servers.

RelatedPosts

Murata Automotive MLCCs Push Capacitance Limits for ADAS and Power Lines

Murata to Decouple China Rare Earth Supply in 3 Years

Murata New Vibration Sensor Targets High‑Frequency Predictive Maintenance

An AI accelerator board can easily integrate tens of thousands of MLCCs across point‑of‑load converters, decoupling networks and auxiliary circuits, and a fully populated AI rack multiplies this into the hundreds of thousands of units. This is not just a volume story: data‑center power‑delivery networks favor high‑CV, low‑ESR MLCCs with tight tolerances, which are precisely the segments where effective capacity is hardest to expand quickly.

In recent comments, Murata president Norio Nakajima confirmed that the company has started internal discussions about raising prices for its more advanced MLCCs used in AI servers. Demand from AI data centers is so strong that it is increasingly difficult to match it with existing capacity while also supporting other strategic markets.

At the same time, Murata emphasizes that it is still in the process of gauging the “true demand” profile for AI infrastructure. The company wants better visibility into whether current order momentum is sustainable, or whether there is a risk of a short‑term spike followed by digestion. As of mid‑February 2026, this means that a decision on specific price actions is pending, and there is no formal corporate notice detailing MLCC price revisions.

Spot MLCC prices already moving

Even without an official Murata list‑price change, the broader MLCC market is already showing the typical symptoms of a tightening cycle. Industry reports from Korea and other regions indicate that spot prices for certain MLCC categories have risen by up to roughly 20% in early 2026, led by high‑grade parts for AI, industrial and automotive applications.

Production line utilization for high‑end MLCCs at leading suppliers is reported to be running at very high levels, effectively close to full for some high‑CV and high‑reliability product segments. At the same time, major manufacturers have remained cautious about adding large new bricks‑and‑mortar capacity after the last boom–bust cycle. The result is a more measured capacity response, where incremental debottlenecking is favored over aggressive greenfield expansions, and where pricing has more room to firm when demand concentrates in specific, higher‑value niches.

What this means for MLCC users in AI and beyond

For OEMs, Tier‑1s and EMS providers, the combination of doubled inquiries, high utilization and rising spot prices suggests that contractual MLCC pricing for high‑end AI‑server parts is likely to come under upward pressure over the next few quarters. Designs that depend on advanced high‑CV MLCCs for GPU/accelerator power rails, VRMs and board‑level decoupling will be particularly exposed.

From a design‑in and supply‑chain perspective, several measures become advisable:

  • Review second‑source options and footprint flexibility for critical MLCC positions in AI and server platforms.
  • Engage early with distributors and manufacturers to secure allocations and forecast commitments for data‑center‑grade MLCCs.
  • Consider the total cost of ownership of power‑delivery architectures, as incremental improvements in layout or derating can sometimes reduce the absolute MLCC count in hot spots.

For other sectors—automotive, industrial, and consumer—the immediate impact will depend on product mix. Commodity, low‑capacitance MLCCs may remain relatively stable, while high‑CV and special‑construction parts (high temperature, high voltage, high reliability) can see knock‑on effects as capacity is prioritized toward AI‑server demand. The MLCC market is effectively splitting between high‑end segments with structural tightness and more commoditized ranges where pricing remains more competitive.

For the passive components community, AI servers are becoming a key structural driver that interacts with existing trends in automotive electrification and industrial digitalization. Even if Murata ultimately adopts a gradual approach to list‑price adjustments, the signal to the market is clear: high‑end MLCCs for AI infrastructure should be treated as strategic components, with corresponding attention to design, qualification and supply‑chain planning.

References

  1. Digitimes – “AI server MLCC orders double capacity; Murata considers price increase,” February 18, 2026.
  2. Bloomberg – “Murata Explores Raising Prices of Key AI Server Component,” February 17, 2026.
  3. Meyka – “Murata Manufacturing Stock Today, February 18: MLCC Price Hike Talks on AI Boom,” February 17, 2026.
  4. Investing.com – “Murata raises MLCC growth forecast for AI servers to 30% CAGR,” December 2, 2025.
  5. Biz Chosun – “AI server boom drives MLCC prices higher as Murata, Samsung split …,” February 7, 2026.
  6. Market and distributor commentary on MLCC spot price increases and supply tightness, early 2026

Related

Recent Posts

Modelithics Releases COMPLETE v26.1 for Keysight ADS

23.4.2026
2

April 2026 Interconnect, Passives and Electromechanical Components Market Insights

22.4.2026
7

KYOCERA AVX Introduces Traction‑Grade DC Link Film Capacitors

21.4.2026
17

When More Capacitance Hurts Reliability: The Role of the Metallic Skeleton in Tantalum Anodes

20.4.2026
23

YAGEO Introduces High‑Current Y2/X1 Film Capacitors for Wide-bandgap Power Systems

17.4.2026
20

YAGEO Introduces High Rel MLCCs Beyond MIL-Spec Limits

16.4.2026
48

Würth Elektronik Expanded Capacity for Validation and Services in Asia

16.4.2026
15

Samsung Introduces Ultra-High-Voltage 1500 V MLCCs for xEV Powertrains

16.4.2026
26

YAGEO Q1 2026 Results: AI Servers and Pricing Power Behind a Moderate Q2 Outlook

16.4.2026
68

Upcoming Events

Apr 27
15:00 - 16:00 CEST

Commercial Space Screening Approach for Agile, High-Reliability Payloads

Apr 29
10:00 - 11:00 CDT

SEPIC Design Done Right

Apr 30
10:00 - 11:00 CDT

Programming Embedded Systems

View Calendar

Popular Posts

  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • MLCC and Ceramic Capacitors

    0 shares
    Share 0 Tweet 0
  • Dual Active Bridge (DAB) Topology

    0 shares
    Share 0 Tweet 0
  • Capacitor Charging and Discharging

    0 shares
    Share 0 Tweet 0
  • Ripple Current and its Effects on the Performance of Capacitors

    3 shares
    Share 3 Tweet 0
  • What Electronics Engineer Needs to Know About Passive Low Pass Filters

    0 shares
    Share 0 Tweet 0
  • MLCC Case Sizes Standards Explained

    0 shares
    Share 0 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© EPCI - Leading Passive Components Educational and Information Site

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • PCNS

© EPCI - Leading Passive Components Educational and Information Site

This website uses cookies. By continuing to use this website you are giving consent to cookies being used. Visit our Privacy and Cookie Policy.
Go to mobile version