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    Samsung Electro-Mechanics CL05Z106MS66PN automotive MLCC illustration with a rectangular ceramic body and metal end terminations

    Samsung Adds 0402 10 µF X7T MLCC for ADAS Power Rails

    Bourns PTVS03-450E-H power TVS diode in a surface-mount DFN package

    Bourns Releases 450 V Power TVS for DC Bus Clamping

    MLCC construction image

    Samsung Electro-Mechanics Patent Targets to Reduce Moisture and Cracks in High-Capacity MLCCs

    Samsung Electro-Mechanics MFC molded frame ceramic capacitor with epoxy encapsulation and external metal frame

    Samsung 100V Molded Frame MLCC Targets 48V AI Server PSUs

    SCHURTER EKO square-body DC fuse variants with ceramic bodies and different metal terminal arrangements

    SCHURTER EKO DC Fuses Extend to 1500 V and 2000 A

    illustration of packaged SMD power inductors on a four-wire cryogenic characterization board

    Cryogenic SMD Inductors at 4 K: Low DCR, Persistent AC Loss

    Wk 43 Electronics Supply Chain Digest

    TDK M704 and M705 NTC temperature sensors with a leaded plastic housing and metal-tag ring-lug assembly

    TDK M704 and M705 NTC Sensors for High-Voltage Power Systems

    Conceptual illustration for Modelithics COMPLETE 26.5 showing RF capacitors, inductors and resistors on a microwave PCB.

    Modelithics COMPLETE 26.5 Adds RF Passive Models for AWR

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    Samsung Electro-Mechanics CL05Z106MS66PN automotive MLCC illustration with a rectangular ceramic body and metal end terminations

    Samsung Adds 0402 10 µF X7T MLCC for ADAS Power Rails

    Bourns PTVS03-450E-H power TVS diode in a surface-mount DFN package

    Bourns Releases 450 V Power TVS for DC Bus Clamping

    MLCC construction image

    Samsung Electro-Mechanics Patent Targets to Reduce Moisture and Cracks in High-Capacity MLCCs

    Samsung Electro-Mechanics MFC molded frame ceramic capacitor with epoxy encapsulation and external metal frame

    Samsung 100V Molded Frame MLCC Targets 48V AI Server PSUs

    SCHURTER EKO square-body DC fuse variants with ceramic bodies and different metal terminal arrangements

    SCHURTER EKO DC Fuses Extend to 1500 V and 2000 A

    illustration of packaged SMD power inductors on a four-wire cryogenic characterization board

    Cryogenic SMD Inductors at 4 K: Low DCR, Persistent AC Loss

    Wk 43 Electronics Supply Chain Digest

    TDK M704 and M705 NTC temperature sensors with a leaded plastic housing and metal-tag ring-lug assembly

    TDK M704 and M705 NTC Sensors for High-Voltage Power Systems

    Conceptual illustration for Modelithics COMPLETE 26.5 showing RF capacitors, inductors and resistors on a microwave PCB.

    Modelithics COMPLETE 26.5 Adds RF Passive Models for AWR

    Trending Tags

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GaN based 300W Ultra High Power Density Adapter; EMC and Filter Design Considerations; Würth Elektronik Webinar with ON Semiconductor

22.3.2021
Reading Time: 1 min read
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The presented 300 W Ultra−high Power Density Adapter (UHPD) evaluation board demonstrates ON Semiconductor’s high performance controllers, drivers and discrete semiconductor content capabilities that enable efficient UHPD designs implementation. This reference design includes the Synchronous PFC boost converter which is operating in the Discontinuous Conduction or Critical Conduction Mode (DCM/ CrM) depends on loading and LLC power stage with secondary side synchronous rectification.

The PFC front stage is driven by NCP1616 controller, which assures unity power factor and low input current THD. Synchronization of the PFC boost SR switch is secured by the NCP4306 high performance SR controller. The LLC stage operates at 500 kHz switching frequency while nominal load is applied. Power stage is managed by the NCP13992 high performance current mode LLC controller. Thanks to the GaN High Electron Mobility Transistors (HEMT) implemented in both power stages at primary side, the high efficiency is easily maintained despite that system operates at high frequency.

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GaN Systems’ GS66504B are incorporated as primary side power switches. Synchronous rectifier (SR) stage used in the secondary side composes from NCP4306 and two paralleled 60V power MOSFETs for each branch. SR MOSFETs and controllers are implemented on the dedicated SR MODULE daughter card to ease main power board PCB design and to achieve maximum efficiency.

Ultra−high power density is achieved thanks to the modular design, used controllers/ drivers, GaN HEMT and dedicated power magnetics design: the main filter chokes of the board have been specifically designed in collaboration with Würth Elektronik.

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Source: Würth Elektronik

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