Passive Components Blog
No Result
View All Result
  • Home
  • News
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Optoelectronics and Isolation
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest
    Siemens executives Markus Grabmeier and Barry Powell with Skeleton Technologies CEO Taavi Madiberk at the investment announcement

    Siemens Backs Skeleton’s US AI Power Manufacturing Expansion

    Concept illustration of an LTCC antenna module with multilayer ceramic substrate, antenna elements and an integrated beamforming IC

    Murata LTCC 6G Antenna Module Demonstrates 135 GHz Operation

    TDK X series surface-mount multilayer varistors with ceramic chip bodies and metal end terminations

    TDK X Series SMD Varistors for Industrial Transient Protection

    Littelfuse TP7.0SMD-XC automotive TVS diodes with black surface-mount bodies and silver end terminals.

    Littelfuse Introduces Extremely Low Clamping Voltage TVS Diodes for Automotive Protection

    Supercapacitor LSM production

    LS Materials Wins $51.5M AI Data Center Supercapacitor Order

    Features of BCZT and strontium titanate dielectric layers in a thin-film superlattice

    Relaxor superlattice capacitors approach 99% efficiency

    Stackpole RMAN thick-film chip resistors with rectangular bodies and metal end terminations

    Stackpole 2512 AlN Thick-Film Resistors Rated up to 3.5 W

    ECIA September 2026 Industry Pulse electronic component trends and sentiment report

    ECIA September 2026 Pulse: Growth Holds, Supply Pressure Persists

    Wk 39 Electronics Supply Chain Digest

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • Knowledge Blog
  • Dossiers
    • Aerospace and Defense Passive Components Dossier
    • AI Hardware Dossier
    • Automotive Dossier
    • Industrial Robotics Dossier
    • Power Converter Dossier
    • Capacitor Dossier
    • Circuit Protection Dossier
    • Inductor Dossier
    • Resistor Dossier
    • Silicon Capacitors and Integrated Passives Dossier
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
  • Home
  • News
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Optoelectronics and Isolation
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest
    Siemens executives Markus Grabmeier and Barry Powell with Skeleton Technologies CEO Taavi Madiberk at the investment announcement

    Siemens Backs Skeleton’s US AI Power Manufacturing Expansion

    Concept illustration of an LTCC antenna module with multilayer ceramic substrate, antenna elements and an integrated beamforming IC

    Murata LTCC 6G Antenna Module Demonstrates 135 GHz Operation

    TDK X series surface-mount multilayer varistors with ceramic chip bodies and metal end terminations

    TDK X Series SMD Varistors for Industrial Transient Protection

    Littelfuse TP7.0SMD-XC automotive TVS diodes with black surface-mount bodies and silver end terminals.

    Littelfuse Introduces Extremely Low Clamping Voltage TVS Diodes for Automotive Protection

    Supercapacitor LSM production

    LS Materials Wins $51.5M AI Data Center Supercapacitor Order

    Features of BCZT and strontium titanate dielectric layers in a thin-film superlattice

    Relaxor superlattice capacitors approach 99% efficiency

    Stackpole RMAN thick-film chip resistors with rectangular bodies and metal end terminations

    Stackpole 2512 AlN Thick-Film Resistors Rated up to 3.5 W

    ECIA September 2026 Industry Pulse electronic component trends and sentiment report

    ECIA September 2026 Pulse: Growth Holds, Supply Pressure Persists

    Wk 39 Electronics Supply Chain Digest

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • Knowledge Blog
  • Dossiers
    • Aerospace and Defense Passive Components Dossier
    • AI Hardware Dossier
    • Automotive Dossier
    • Industrial Robotics Dossier
    • Power Converter Dossier
    • Capacitor Dossier
    • Circuit Protection Dossier
    • Inductor Dossier
    • Resistor Dossier
    • Silicon Capacitors and Integrated Passives Dossier
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

Heraeus Electronics Expands Electronic Inks Portfolio Through Acquisition of PriElex

8.3.2024
Reading Time: 4 mins read
A A

Heraeus Electronics has announced the successful acquisition of the PriElex electronics inks business line from Kayaku Advanced Materials.

The acquisition, effective January 31, 2024, strengthens Heraeus Electronics’ Thick Film business and expands its portfolio of offerings for the electronics materials industry.

RelatedPosts

Can Copper Conductive Inks Displace Silver in Hybrid Electronics?

Advancements in Flexible End Terminations for Robust MLCCs in EV

Understanding The Power of Magnetic Fusion

PriElex has developed a strong reputation in the sector, by joining forces with Heraeus Electronics the acquisition enables Heraeus Electronics to enhance its position and provide customers with an even broader range of high-quality and innovative solutions for thick film applications.

“We are excited to welcome PriElex into the Heraeus family,” said Mark Challingsworth, Global Head of Business Line Thick Film Materials at Heraeus Electronics. “This acquisition reinforces our commitment to deliver exceptional product quality- tailor-made and in-time, technical support, and customer service to our valued customers. The integration of PriElex’s expertise and technology will enable us to offer a more comprehensive and tailored portfolio of solutions for thick film applications.”

Heraeus Electronics’ Thick Film business is globally recognised for its broad range of thick film materials. With our cutting-edge technologies and in-depth understanding of the industry, we have established ourselves as a reliable partner in enabling the success of various electronics applications across numerous sectors.

Partners and customers of both Heraeus Electronics and PriElex can expect a smooth transition and ongoing support throughout the integration process. Furthermore, customers can be assured of uninterrupted service and access to a broader portfolio of advanced solutions.

Polymer Thick Film (PTF) pastes, also known as electronic inks or low-temperature pastes, have revolutionized the way we think about designing and manufacturing electronic devices. With their unique properties and versatility, they offer countless opportunities for engineers and product developers to create cutting-edge solutions.

Benefits of PTF Pastes

  • Flexibility and adaptability: PTF pastes are designed to be applied onto flexible substrates, enabling the production of lightweight, bendable, and even stretchable electronic components. This opens up a world of possibilities for applications in wearable devices, smart textiles, flexible displays, and more.
  • Low-temperature curing: Unlike traditional thick film pastes, PTF pastes can be cured at relatively low temperatures, eliminating the need for high-temperature processing. This makes them compatible with heat-sensitive substrates like polymers, paper, and even fabrics, expanding the range of materials that can be used in printed electronics.
  • Cost-effectiveness: PTF pastes offer a cost-effective alternative to traditional manufacturing methods such as etching or sputtering. Their compatibility with large-scale printing processes, such as screen printing and inkjet printing, allows for high-volume production at a lower cost, making them ideal for mass-market applications.
  • Versatile material properties: PTF pastes can be formulated with a wide range of conductive, resistive, and dielectric materials, giving engineers the freedom to tailor their properties for specific application requirements. Whether you need high conductivity, low resistance, or insulation capabilities, PTF pastes can be customized to meet your exact needs.
  • Integration with conventional manufacturing processes: PTF pastes can seamlessly integrate with existing manufacturing processes, enabling the creation of hybrid circuits that combine the benefits of printed electronics with the reliability of conventional electronic components. This allows for a smooth transition from traditional PCB-based designs to advanced hybrid systems.
  • Environmental friendliness: PTF pastes are typically solvent-based, reducing the need for hazardous chemicals compared to other manufacturing techniques. Additionally, the compatibility with low-temperature processing reduces energy consumption, making PTF pastes a more environmentally friendly choice for electronic manufacturing.

The applications of PTF pastes are virtually endless. From smart packaging, medical devices, and novel heating technology to automotive electronics and IoT sensors, PTF pastes can be utilized in a wide range of industries. They offer engineers and product developers the freedom to explore new design concepts and bring innovative solutions to life.

Applications:

  • Medical devices and Biosensors
  • Circuits and Sensors
  • Low temperature Heaters – PTC and fixed resistance
  • Passive Components
  • RFID

Typical Products:

  • Ag Conductor inks: AG-500A, AG-510, AG-515-1, AG-800, AG-919, AG-1074, WB-1078, Z-904, LTC3602, LTC3650
  • Ag/AgCl inks: AGCL-675, AGCL-1134 (50/50), AGCL-1194 (65/35), LTC3701(65/35)
  • Carbon ink: C-250J
  • Conductive epoxy: EP-600 (2-part)
  • Potting compounds: EP-799 Potting
  • Dielectric inks: UV-2530, UV-2531, UV-3010, UVD5271
  • Radio Opaque inks: RO-593, RO-948

Related

Source: Heraeus Electronics

Recent Posts

Conceptual Toray heat-resistant film capacitor beside an inverter cooling structure.

Toray Film Capacitor Enables 150°C Inverter Operation

9.10.2026
56
Antiferroelectric hafnia crystal structure showing alternating polar layers and field-aligned polar state, University of Nebraska–Lincoln

Antiferroelectric Hafnia at the 2D Limit

29.9.2026
33

Can Copper Conductive Inks Displace Silver in Hybrid Electronics?

14.7.2026
127

YAGEO Presents NANOMET Soft Magnetic Cores for High‑Density Power Conversion

8.7.2026
249

High-Crystallinity Nanocrystalline Composites for MHz Chip Inductors

7.5.2026
219

Kyocera Developed Multilayer Ceramic Core Substrate for AI Packages

30.4.2026
309

Peak Nano to Develop Fusion Grade High Energy Film Capacitors

11.3.2026
113

Paumanok Unveils Aluminum Capacitor Foils World Markets Study 2025-2030

6.11.2025
86

Murata and QuantumScape Joint Development for Solid Batteries Ceramic Separators

14.10.2025
107

Upcoming Events

Oct 19
15:00 - 16:00 CEST

ESCC-qualified Pt Temperature Sensors for Space Applications

Oct 27
15:00 - 16:00 CET

Heraeus Electronics Webinar: What materials perform when failure is not an option?

Oct 27
16:00 - 17:00 CET

Power Inductor technologies

View Calendar

Popular Posts

  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Capacitor Charging and Discharging

    0 shares
    Share 0 Tweet 0
  • Audio Capacitors: Choosing Capacitors for Crossover Circuits

    0 shares
    Share 0 Tweet 0
  • MLCC and Ceramic Capacitors

    0 shares
    Share 0 Tweet 0
  • Thermistors Basics, NTC and PTC Thermistors

    0 shares
    Share 0 Tweet 0
  • Passive Low Pass Filters: Fundamentals and EMI Design

    0 shares
    Share 0 Tweet 0
  • Resistor Symbols

    0 shares
    Share 0 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© 2015–2026
All rights reserved

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • Dossiers
  • PCNS

© 2015–2026
All rights reserved