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    Bourns Extends Multilayer Chip Inductors Offer for RF and Wireless Designs

    Researchers developed a polymer capacitor by combining two cheap, commercially available plastics. The new polymer capacitor makes use of the transparent material — pictured here, with vintage Penn State athletic marks visible through it — to store four times the energy and withstand significantly more heat.  Credit: Penn State

    Penn State Demonstrated Polymer Alloy Capacitor Film with 4× Energy Density up to 250C

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    Bourns Extends Multilayer Chip Inductors Offer for RF and Wireless Designs

    Researchers developed a polymer capacitor by combining two cheap, commercially available plastics. The new polymer capacitor makes use of the transparent material — pictured here, with vintage Penn State athletic marks visible through it — to store four times the energy and withstand significantly more heat.  Credit: Penn State

    Penn State Demonstrated Polymer Alloy Capacitor Film with 4× Energy Density up to 250C

    ECIA January 2026 Reports Strong Sales Confidence

    Vishay Unveils Ultra-Compact 0201 Thick Film Chip Resistors

    Würth Elektronik Component Data Live in Accuris

    Coilcraft Releases Automotive Common Mode Chokes

    MLCC Manufacturers Consider Price Increase as AI Demand Outpaces Supply

    YAGEO Extends Antenna Portfolio with Wi‑Fi 6E/7 and Tri‑band GNSS Solutions

    SCHURTER Introduces 2410 SMD Fuse for Robust AC/DC Protection

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
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    • Derating
    • Dielectric Constant
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    2026 Power Magnetics Design Trends: Flyback, DAB and Planar

    Enabling Software‑Defined Vehicle Architectures: Automotive Ethernet and Zonal Smart Power

    Calculating Resistance Value of a Flyback RC Snubber 

    One‑Pulse Characterization of Nonlinear Power Inductors

    Thermistor Linearization Challenges

    Coaxial Connectors and How to Connect with PCB

    PCB Manufacturing, Test Methods, Quality and Reliability

    Transformer Behavior – Current Transfer and Hidden Feedback

    Choosing the Right Capacitor: The Importance of Accurate Measurements

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Passive Components Shipments Affected by IC shortages

31.5.2021
Reading Time: 1 min read
A A
Fantasy circuit board. Top view. 3d illustration

Fantasy circuit board. Top view. 3d illustration

Passive components makers are closely monitoring the impact of IC shortages on their actual shipments for notebook, server and automotive segments, so as to work out optimal materials procurement and inventory policies, according to Taiwan industry sources.

Some EMS and ODM clients have fluctuated notably in pulling in shipments of passive components due mainly to unstable supply of display driver ICs, power management ICs and other peripheral ICs, which remain in severe shortage, the sources said.

RelatedPosts

Bourns Extends Multilayer Chip Inductors Offer for RF and Wireless Designs

Penn State Demonstrated Polymer Alloy Capacitor Film with 4× Energy Density up to 250C

ECIA January 2026 Reports Strong Sales Confidence

Despite more or less overbooking at downstream assemblers of notebooks and servers, passive components makers are more concerned about whether shortages of ICs and other components will hit the worst point by the end of second-quarter 2021 and then gradually ease in the second half of the year, the sources said.

The makers expect their shipments for automotive applications to register double-digit on-year increases of 20-40% in 2021 thanks to hot demand from the EV and automotive electronics sector, but actual growth will hinge on to what extent the automotive chips shortages can ease in the months ahead, the sources said.

Related

Source: DigiTimes

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