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    Exxelia PM film capacitor and passive-component technologies for BepiColombo space electronics

    Exxelia Passive Components Support BepiColombo Mission

    TT Electronics OPI1268T green through-hole phototransistor optocoupler used for optical isolation in power systems.

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Exxelia Releases Custom Smart Integrated Magnetics for Space Applications

5.1.2026
Reading Time: 2 mins read
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Exxelia introduces a custom Smart Integrated Magnetics solution for space power conversion applications.

Exxelia has developed a new Smart Integrated Magnetics solution designed for advanced power conditioning and distribution units (PCDUs) operating in constrained and demanding environments such as space systems.

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This solution is not a standard catalog product; it is the result of a custom development. It has been engineered to meet specific electrical, thermal and mechanical requirements defined at system level and can be adapted to meet any set of customer specifications.

Exxelia new Smart Integrated Magnetics solution combines the transformer and the inductor of a Dual Active Bridge (DAB) within a single, compact magnetic assembly. This integrated approach aims to reduce volume, mass and interconnection complexity while maintaining electrical performance at high switching frequencies. The targeted application is isolated DC-DC power conversion in space-grade PCDUs, where efficiency, reliability, and mechanical robustness are key design drivers. 

From a technical standpoint, this Smart Integrated Magnetic is designed for a power level of 1 to 2kW at a switching frequency of 100 to 200kHz (example). The associated inductor provides an inductance of few µH. The overall assembly reaches an efficiency level close to 99% under nominal operating conditions, reflecting careful optimization of core materials, winding architecture and magnetic coupling. Particular attention has been paid to losses and thermal behavior, which are critical in low-convection environments. 

Mechanical integration was a central aspect of the development. The complete magnetic solution fits into a low-profile / planar package measuring approximately 75 × 65 × 20 mm, with a total mass of around 250 g. This compact form factor is intended to facilitate integration into densely populated power electronics modules, while also supporting resistance to mechanical stresses typically encountered during launch and operation. 

The design was carried out to address severe environmental constraints, including thermal cycling and mechanical loads, which are characteristic of space applications. Material selection, impregnation processes and structural design were adapted accordingly to ensure long-term stability and compatibility with qualification requirements. 

This Smart Integrated Magnetics solution illustrates Exxelia’s capability to deliver fully customised magnetic components, developed in close interaction with system architects and power electronics engineers. While the solution presented here is specific to a given program and set of constraints, it reflects a broader approach that can be adapted to other high-reliability applications requiring compact, efficient and integrated magnetic designs.

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Source: Exxelia

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