Passive Components Blog
No Result
View All Result
  • Home
  • News
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Optoelectronics and Isolation
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest
    Vishay Sfernice D2TO and DTO thick-film SMD power resistor sample kits with TO-263 D2PAK and TO-252 DPAK devices

    Vishay SMD Power Resistor Sample Kits for High-Power Design

    schurter-tcsv4-side-actuated-smt-tactile-switch

    SCHURTER Introduces Side-Actuated SMT Tactile Switch

    TLVR multiphase coupled inductors, auxiliary ballast inductor

    TLVR Coupled Inductors: Fast Load-Step Response and Current-Dependent Ballast-Inductor Optimisation

    Bourns CRH2512 2512 surface-mount metal-alloy current-sense resistor for high-current low-ohmic measurement

    Bourns CRH2512 5 W Current-Sense Resistors

    Littelfuse AK-FL FlatSuppressX axial-leaded bidirectional TVS diodes for high-voltage aviation DC power protection

    Littelfuse AK-FL TVS Diodes for Aviation DC Power Rails

    Rheinmetall Pierburg Pump Technology NanoLam DC-link capacitors for high-power electric vehicle traction inverter applications

    Rheinmetall Funds NanoLam Capacitor Production Scale-Up

    Bourns CSS4C-1216 four-terminal metal-strip current sense resistor for high-current Kelvin measurement

    Bourns Extends 1216 Kelvin Current Sense Resistors

    Modelithics COMPLETE+3D Library v26.3 for Ansys HFSS with RF passive component and 3D electromagnetic simulation models

    Modelithics COMPLETE+3D v26.3 Expands HFSS RF Models

    Samsung Electro-Mechanics low-profile and embedded MLCCs for compact PCB and power-delivery applications

    Samsung Low-Profile and Embedded MLCCs for Compact Devices

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • Knowledge Blog
  • Dossiers
    • AI Hardware Dossier
    • Automotive Dossier
    • Industrial Robotics Dossier
    • Power Converter Dossier
    • Capacitor Dossier
    • Resistor Dossier
    • Inductor Dossier
    • Circuit Protection Dossier
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
  • Home
  • News
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Optoelectronics and Isolation
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest
    Vishay Sfernice D2TO and DTO thick-film SMD power resistor sample kits with TO-263 D2PAK and TO-252 DPAK devices

    Vishay SMD Power Resistor Sample Kits for High-Power Design

    schurter-tcsv4-side-actuated-smt-tactile-switch

    SCHURTER Introduces Side-Actuated SMT Tactile Switch

    TLVR multiphase coupled inductors, auxiliary ballast inductor

    TLVR Coupled Inductors: Fast Load-Step Response and Current-Dependent Ballast-Inductor Optimisation

    Bourns CRH2512 2512 surface-mount metal-alloy current-sense resistor for high-current low-ohmic measurement

    Bourns CRH2512 5 W Current-Sense Resistors

    Littelfuse AK-FL FlatSuppressX axial-leaded bidirectional TVS diodes for high-voltage aviation DC power protection

    Littelfuse AK-FL TVS Diodes for Aviation DC Power Rails

    Rheinmetall Pierburg Pump Technology NanoLam DC-link capacitors for high-power electric vehicle traction inverter applications

    Rheinmetall Funds NanoLam Capacitor Production Scale-Up

    Bourns CSS4C-1216 four-terminal metal-strip current sense resistor for high-current Kelvin measurement

    Bourns Extends 1216 Kelvin Current Sense Resistors

    Modelithics COMPLETE+3D Library v26.3 for Ansys HFSS with RF passive component and 3D electromagnetic simulation models

    Modelithics COMPLETE+3D v26.3 Expands HFSS RF Models

    Samsung Electro-Mechanics low-profile and embedded MLCCs for compact PCB and power-delivery applications

    Samsung Low-Profile and Embedded MLCCs for Compact Devices

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • Knowledge Blog
  • Dossiers
    • AI Hardware Dossier
    • Automotive Dossier
    • Industrial Robotics Dossier
    • Power Converter Dossier
    • Capacitor Dossier
    • Resistor Dossier
    • Inductor Dossier
    • Circuit Protection Dossier
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

Reinventing the inductor

1.3.2018
Reading Time: 3 mins read
A A

source: Phys.org article

A basic building block of modern technology, inductors are everywhere: cellphones, laptops, radios, televisions, cars. And surprisingly, they are essentially the same today as in 1831, when they were first created by English scientist Michael Faraday.

RelatedPosts

Vishay SMD Power Resistor Sample Kits for High-Power Design

SCHURTER Introduces Side-Actuated SMT Tactile Switch

TLVR Coupled Inductors: Fast Load-Step Response and Current-Dependent Ballast-Inductor Optimisation

The particularly large size of inductors made according to Faraday’s design are a limiting factor in delivering the miniaturized devices that will help realize the potential of the Internet of Things, which promises to connect people to some 50 billion objects by 2020. That lofty goal is expected to have an estimated economic impact between $2.7 and $6.2 trillion annually by 2025.

Now, a team at UC Santa Barbara, led by Kaustav Banerjee, a professor in the Department of Electrical and Computer Engineering, has taken a materials-based approach to reinventing this fundamental component of modern electronics. The findings appear in the journal Nature Electronics.

Banerjee and his UCSB team—lead author Jiahao Kang, Junkai Jiang, Xuejun Xie, Jae Hwan Chu and Wei Liu, all members of his Nanoelectronics Research Lab—worked with colleagues from Shibaura Institute of Technology in Japan and Shanghai Jiao Tong University in China to exploit the phenomenon of kinetic inductance to demonstrate a fundamentally different kind of inductor.

All inductors generate both magnetic and kinetic inductance, but in typical metal conductors, the kinetic inductance is so small as to be unnoticeable. “The theory of kinetic inductance has long been known in condensed-matter physics, but nobody ever used it for inductors, because in conventional metallic conductors, kinetic inductance is negligible,” Banerjee explained.

Unlike magnetic inductance, kinetic inductance does not depend on the surface area of the inductor. Rather, kinetic inductance resists current fluctuations that alter the velocity of the electrons, and the electrons resist such change according to Newton’s law of inertia.

Historically, as the technology of transistors and interconnects that link them has advanced, the elements have become smaller. But the inductor, which in its simplest form is a metallic coil wound around a core material, has been the exception.

“On-chip inductors based on magnetic inductance cannot be made smaller in the same way transistors or interconnects scale, because you need a certain amount of surface area to get a certain magnetic flux or inductance value,” explained lead author Kang, who recently completed his Ph.D. under Banerjee’s supervision.

The UCSB team designed a new kind of spiral inductor comprised of multiple layers of graphene. Single-layer graphene exhibits a linear electronic band structure and a correspondingly large momentum relaxation time (MRT)—a few picoseconds or higher compared to that of conventional metallic conductors (like copper used in traditional on-chip inductors), which ranges from 1/1000 to 1/100 of a picosecond. But single-layer graphene has too much resistance for application on an inductor.

However, multilayer graphene offers a partial solution by providing lower resistance, but interlayer couplings cause its MRT to be insufficiently small. The researchers overcame that dilemma with a unique solution: They chemically inserted bromine atoms between the graphene layers—a process called intercalation—that not only further reduced resistance but also separated the graphene layers just enough to essentially decouple them, extending the MRT and thereby increasing kinetic inductance.

The revolutionary inductor, which works in the 10-50 GHz range, offers one-and-a-half times the inductance density of a traditional inductor, leading to a one-third reduction in area while also providing extremely high efficiency. Previously, high inductance and reduced size had been an elusive combination.

“There is plenty of room to increase the inductance density further by increasing the efficiency of the intercalation process, which we are now exploring,” said co-author Jiang.

“We essentially engineered a new nanomaterial to bring forward the previously ‘hidden physics’ of kinetic inductance at room temperature and in a range of operating frequencies targeted for next-generation wireless communications,” Banerjee added.

More information: Jiahao Kang et al. On-chip intercalated-graphene inductors for next-generation radio frequency electronics, Nature Electronics (2018). DOI: 10.1038/s41928-017-0010-z

Featured image: Artist’s depiction of the intercalated multilayer-graphene inductor (center blue spiral). Background images show its predecessors. Credit: Peter Allen

 

Related

Recent Posts

Vishay Sfernice D2TO and DTO thick-film SMD power resistor sample kits with TO-263 D2PAK and TO-252 DPAK devices

Vishay SMD Power Resistor Sample Kits for High-Power Design

25.9.2026
5
TLVR multiphase coupled inductors, auxiliary ballast inductor

TLVR Coupled Inductors: Fast Load-Step Response and Current-Dependent Ballast-Inductor Optimisation

24.9.2026
18
Bourns CRH2512 2512 surface-mount metal-alloy current-sense resistor for high-current low-ohmic measurement

Bourns CRH2512 5 W Current-Sense Resistors

24.9.2026
3
Littelfuse AK-FL FlatSuppressX axial-leaded bidirectional TVS diodes for high-voltage aviation DC power protection

Littelfuse AK-FL TVS Diodes for Aviation DC Power Rails

24.9.2026
11
Rheinmetall Pierburg Pump Technology NanoLam DC-link capacitors for high-power electric vehicle traction inverter applications

Rheinmetall Funds NanoLam Capacitor Production Scale-Up

22.9.2026
45
Bourns CSS4C-1216 four-terminal metal-strip current sense resistor for high-current Kelvin measurement

Bourns Extends 1216 Kelvin Current Sense Resistors

22.9.2026
20

Bourns Adds ACXX57SQ Air Coil Inductors for RF Design

18.9.2026
16
Samsung Electro-Mechanics MLCC capacitor solutions for high-voltage converter snubbing and GPU power delivery

Samsung MLCC Options for 1 MW AI Rack Power

18.9.2026
32
Frenetic planar ER transformer simulation for a 5 kW 800 V-to-50 V PSFB converter, showing low-profile core geometry and high-current planar winding arrangement

5 kW 800 V-to-50 V PSFB Transformer Design for Data Centers

18.9.2026
46

Upcoming Events

Sep 29
16:00 - 17:00 CEST

Cybersecurity 2026

Sep 30
15:00 - 16:00 CEST

Positronic Space and Military Connectors

Oct 14
17:00 - 18:00 CEST

Live Demo! Discover KYOCERA AVX Antenna Integrator Studio (AIS)

View Calendar

Popular Posts

  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Capacitor Charging and Discharging

    0 shares
    Share 0 Tweet 0
  • Resistor Symbols

    0 shares
    Share 0 Tweet 0
  • Thermistors Basics, NTC and PTC Thermistors

    0 shares
    Share 0 Tweet 0
  • Audio Capacitors: Choosing Capacitors for Crossover Circuits

    0 shares
    Share 0 Tweet 0
  • Capacitor Symbols

    0 shares
    Share 0 Tweet 0
  • MLCC and Ceramic Capacitors

    0 shares
    Share 0 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© 2015–2026
All rights reserved

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • Dossiers
  • PCNS

© 2015–2026
All rights reserved