Passive Components Blog
No Result
View All Result
  • Home
  • News
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest
    ECIA Industry Pulse Q3 2026 chart showing passive components, semiconductors and electro-mechanical component market sentiment and lead-time pressure

    ECIA Industry Pulse Moderates as Passive Lead Times Tighten

    LG Innotek Demonstrates FC-BGA Substrates With Embedded Silicon Capacitors for AI Power Delivery

    On-Chip 3D-Printed Copper Microinductors: A New Route to Compact RF Electronics

    Emerging Capacitor Markets in Fusion Energy

    Murata DLW32SH_MF 1210 surface-mount common mode choke coil with metal terminals for automotive CAN FD signal-line noise suppression

    Murata Introduces Common Mode Chokes for Automotive CAN FD up to 150°C

    onsemi solid-state transformer concept for 800 V HVDC AI data center power conversion with SiC modules, DC-link capacitors and high-frequency magnetics

    Solid-State Transformers for 800 V AI Data Centers: Passive Component Design Considerations

    Littelfuse TX00AT314AMA omnipolar TMR magnetic switch sensor in a leaded TO-92-3 through-hole package

    Littelfuse Expands Omnipolar TMR Switch with Leaded TO-92 Package Option

    SCHURTER THT DIP Switches Support Hardware-Level Configuration

    TDK CN series 10 µF 100 V X7R soft-termination multilayer ceramic capacitor in 3225 EIA 1210 package

    TDK Releases 100 V Soft-Termination X7R MLCCs 10 uF in 3225 Package

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • Knowledge Blog
  • Dossiers
    • AI Hardware Dossier
    • Automotive Dossier
    • Industrial Robotics Dossier
    • Power Converter Dossier
    • Capacitor Dossier
    • Resistor Dossier
    • Inductor Dossier
    • Circuit Protection Dossier
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
  • Home
  • News
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest
    ECIA Industry Pulse Q3 2026 chart showing passive components, semiconductors and electro-mechanical component market sentiment and lead-time pressure

    ECIA Industry Pulse Moderates as Passive Lead Times Tighten

    LG Innotek Demonstrates FC-BGA Substrates With Embedded Silicon Capacitors for AI Power Delivery

    On-Chip 3D-Printed Copper Microinductors: A New Route to Compact RF Electronics

    Emerging Capacitor Markets in Fusion Energy

    Murata DLW32SH_MF 1210 surface-mount common mode choke coil with metal terminals for automotive CAN FD signal-line noise suppression

    Murata Introduces Common Mode Chokes for Automotive CAN FD up to 150°C

    onsemi solid-state transformer concept for 800 V HVDC AI data center power conversion with SiC modules, DC-link capacitors and high-frequency magnetics

    Solid-State Transformers for 800 V AI Data Centers: Passive Component Design Considerations

    Littelfuse TX00AT314AMA omnipolar TMR magnetic switch sensor in a leaded TO-92-3 through-hole package

    Littelfuse Expands Omnipolar TMR Switch with Leaded TO-92 Package Option

    SCHURTER THT DIP Switches Support Hardware-Level Configuration

    TDK CN series 10 µF 100 V X7R soft-termination multilayer ceramic capacitor in 3225 EIA 1210 package

    TDK Releases 100 V Soft-Termination X7R MLCCs 10 uF in 3225 Package

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • Knowledge Blog
  • Dossiers
    • AI Hardware Dossier
    • Automotive Dossier
    • Industrial Robotics Dossier
    • Power Converter Dossier
    • Capacitor Dossier
    • Resistor Dossier
    • Inductor Dossier
    • Circuit Protection Dossier
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

Reinventing the inductor

1.3.2018
Reading Time: 3 mins read
A A

source: Phys.org article

A basic building block of modern technology, inductors are everywhere: cellphones, laptops, radios, televisions, cars. And surprisingly, they are essentially the same today as in 1831, when they were first created by English scientist Michael Faraday.

RelatedPosts

ECIA Industry Pulse Moderates as Passive Lead Times Tighten

LG Innotek Demonstrates FC-BGA Substrates With Embedded Silicon Capacitors for AI Power Delivery

On-Chip 3D-Printed Copper Microinductors: A New Route to Compact RF Electronics

The particularly large size of inductors made according to Faraday’s design are a limiting factor in delivering the miniaturized devices that will help realize the potential of the Internet of Things, which promises to connect people to some 50 billion objects by 2020. That lofty goal is expected to have an estimated economic impact between $2.7 and $6.2 trillion annually by 2025.

Now, a team at UC Santa Barbara, led by Kaustav Banerjee, a professor in the Department of Electrical and Computer Engineering, has taken a materials-based approach to reinventing this fundamental component of modern electronics. The findings appear in the journal Nature Electronics.

Banerjee and his UCSB team—lead author Jiahao Kang, Junkai Jiang, Xuejun Xie, Jae Hwan Chu and Wei Liu, all members of his Nanoelectronics Research Lab—worked with colleagues from Shibaura Institute of Technology in Japan and Shanghai Jiao Tong University in China to exploit the phenomenon of kinetic inductance to demonstrate a fundamentally different kind of inductor.

All inductors generate both magnetic and kinetic inductance, but in typical metal conductors, the kinetic inductance is so small as to be unnoticeable. “The theory of kinetic inductance has long been known in condensed-matter physics, but nobody ever used it for inductors, because in conventional metallic conductors, kinetic inductance is negligible,” Banerjee explained.

Unlike magnetic inductance, kinetic inductance does not depend on the surface area of the inductor. Rather, kinetic inductance resists current fluctuations that alter the velocity of the electrons, and the electrons resist such change according to Newton’s law of inertia.

Historically, as the technology of transistors and interconnects that link them has advanced, the elements have become smaller. But the inductor, which in its simplest form is a metallic coil wound around a core material, has been the exception.

“On-chip inductors based on magnetic inductance cannot be made smaller in the same way transistors or interconnects scale, because you need a certain amount of surface area to get a certain magnetic flux or inductance value,” explained lead author Kang, who recently completed his Ph.D. under Banerjee’s supervision.

The UCSB team designed a new kind of spiral inductor comprised of multiple layers of graphene. Single-layer graphene exhibits a linear electronic band structure and a correspondingly large momentum relaxation time (MRT)—a few picoseconds or higher compared to that of conventional metallic conductors (like copper used in traditional on-chip inductors), which ranges from 1/1000 to 1/100 of a picosecond. But single-layer graphene has too much resistance for application on an inductor.

However, multilayer graphene offers a partial solution by providing lower resistance, but interlayer couplings cause its MRT to be insufficiently small. The researchers overcame that dilemma with a unique solution: They chemically inserted bromine atoms between the graphene layers—a process called intercalation—that not only further reduced resistance but also separated the graphene layers just enough to essentially decouple them, extending the MRT and thereby increasing kinetic inductance.

The revolutionary inductor, which works in the 10-50 GHz range, offers one-and-a-half times the inductance density of a traditional inductor, leading to a one-third reduction in area while also providing extremely high efficiency. Previously, high inductance and reduced size had been an elusive combination.

“There is plenty of room to increase the inductance density further by increasing the efficiency of the intercalation process, which we are now exploring,” said co-author Jiang.

“We essentially engineered a new nanomaterial to bring forward the previously ‘hidden physics’ of kinetic inductance at room temperature and in a range of operating frequencies targeted for next-generation wireless communications,” Banerjee added.

More information: Jiahao Kang et al. On-chip intercalated-graphene inductors for next-generation radio frequency electronics, Nature Electronics (2018). DOI: 10.1038/s41928-017-0010-z

Featured image: Artist’s depiction of the intercalated multilayer-graphene inductor (center blue spiral). Background images show its predecessors. Credit: Peter Allen

 

Related

Recent Posts

On-Chip 3D-Printed Copper Microinductors: A New Route to Compact RF Electronics

10.9.2026
4
Murata DLW32SH_MF 1210 surface-mount common mode choke coil with metal terminals for automotive CAN FD signal-line noise suppression

Murata Introduces Common Mode Chokes for Automotive CAN FD up to 150°C

10.9.2026
7
onsemi solid-state transformer concept for 800 V HVDC AI data center power conversion with SiC modules, DC-link capacitors and high-frequency magnetics

Solid-State Transformers for 800 V AI Data Centers: Passive Component Design Considerations

9.9.2026
39
Littelfuse TX00AT314AMA omnipolar TMR magnetic switch sensor in a leaded TO-92-3 through-hole package

Littelfuse Expands Omnipolar TMR Switch with Leaded TO-92 Package Option

9.9.2026
8

SCHURTER THT DIP Switches Support Hardware-Level Configuration

9.9.2026
2
TDK CN series 10 µF 100 V X7R soft-termination multilayer ceramic capacitor in 3225 EIA 1210 package

TDK Releases 100 V Soft-Termination X7R MLCCs 10 uF in 3225 Package

9.9.2026
6
Compact inductive rotary position encoder sensor near a motor shaft, representing the Vishay RAIK045I MP encoder category

Vishay Introduces 16-Bit Inductive Encoder for Motor-Adjacent Position Sensing

9.9.2026
10
Hirose FH51 automotive FPC/FFC connector with low-profile receptacle construction and top-and-bottom contact arrangement

Hirose Automotive FPC/FFC Connector Adds One-Action Mating up to 125°C

8.9.2026
3
Overview of fabricated ferroelectric capacitors improving hyperdimensional computing task learning accuracy. a The experimental work reported in this study comprises ferroelectric capacitor (FeCAP) device fabrication, structural and electrical characterization, analog state identification and their reliability study. b The computational part of the work explores the benefits of using characteristics from the fabricated devices in a hyperdimensional computing scheme; source: authors

High-Precision Hyperdimensional Computing with Multi-Level Ferroelectric HZO Capacitors

7.9.2026
19

Upcoming Events

Sep 16
17:00 - 18:00 CEST

Designing a 5 kW, 800 V-to-50 V PSFB Converter for Next-Generation Data Centers

Sep 29
16:00 - 17:00 CEST

Cybersecurity 2026

Nov 24
16:00 - 17:00 CET

Component selection with the WE REDEXPERT® DC-DC Converter Designer Tool

View Calendar

Popular Posts

  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Earthing Systems and IEC Classification Explained

    0 shares
    Share 0 Tweet 0
  • MLCC and Ceramic Capacitors

    0 shares
    Share 0 Tweet 0
  • Capacitor Charging and Discharging

    0 shares
    Share 0 Tweet 0
  • Resistor Symbols

    0 shares
    Share 0 Tweet 0
  • Audio Capacitors: Choosing Capacitors for Crossover Circuits

    0 shares
    Share 0 Tweet 0
  • Thermistors Basics, NTC and PTC Thermistors

    0 shares
    Share 0 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© 2015–2026
All rights reserved

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • Dossiers
  • PCNS

© 2015–2026
All rights reserved