Passive Components Blog
No Result
View All Result
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    Exxelia to Exhibit at APEC 2026 in San Antonio, Texas

    Würth Elektronik Presents Differential Pressure Sensor for HVAC and Medical

    Thermal Modeling of Magnetics

    ESA SPCD 26 Call for Papers Extended to 30th March

    Wk 11 Electronics Supply Chain Digest

    Binder Extends NCC Circular Connectors for Harsh Environments

    Standard vs Planar LLC transformers Comparison for Battery Chargers

    Würth Elektronik and Grinn Launch Edge AI Cooperation

    Bourns Expanded Semi-Shielded Low Profile Automotive Power Inductor

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    Thermal Modeling of Magnetics

    Standard vs Planar LLC transformers Comparison for Battery Chargers

    How Modern Tools Model Magnetic Components for Power Electronics

    Advanced Loss Modeling for Planar Magnetics in the Frenetic Planar Tool

    2026 Power Magnetics Design Trends: Flyback, DAB and Planar

    Enabling Software‑Defined Vehicle Architectures: Automotive Ethernet and Zonal Smart Power

    Calculating Resistance Value of a Flyback RC Snubber 

    One‑Pulse Characterization of Nonlinear Power Inductors

    Thermistor Linearization Challenges

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • DossiersNew
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    Exxelia to Exhibit at APEC 2026 in San Antonio, Texas

    Würth Elektronik Presents Differential Pressure Sensor for HVAC and Medical

    Thermal Modeling of Magnetics

    ESA SPCD 26 Call for Papers Extended to 30th March

    Wk 11 Electronics Supply Chain Digest

    Binder Extends NCC Circular Connectors for Harsh Environments

    Standard vs Planar LLC transformers Comparison for Battery Chargers

    Würth Elektronik and Grinn Launch Edge AI Cooperation

    Bourns Expanded Semi-Shielded Low Profile Automotive Power Inductor

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    Thermal Modeling of Magnetics

    Standard vs Planar LLC transformers Comparison for Battery Chargers

    How Modern Tools Model Magnetic Components for Power Electronics

    Advanced Loss Modeling for Planar Magnetics in the Frenetic Planar Tool

    2026 Power Magnetics Design Trends: Flyback, DAB and Planar

    Enabling Software‑Defined Vehicle Architectures: Automotive Ethernet and Zonal Smart Power

    Calculating Resistance Value of a Flyback RC Snubber 

    One‑Pulse Characterization of Nonlinear Power Inductors

    Thermistor Linearization Challenges

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • DossiersNew
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

Samsung Electro-Mechanics Downsizes 220pF 50V Automotive C0G MLCCs into 0201 Size

25.10.2024
Reading Time: 2 mins read
A A

Samsung Electro-Mechanics has developed and commenced mass production of three new MLCC capacitors, including the CL03C221JB31PN#, which features a size of 0201 inch (0.6 × 0.3mm), a C0G (suitable for temperatures ranging from -55 to 125°C), and a rated voltage of 50V, providing capacitance values from 100 to 220 pF. These capacitors are ideal for applications such as automotive class D audio amplifiers.

Samples are also available upon request. 

RelatedPosts

Samsung Launches Worlds First Automotive 47uF 4V MLCC in 0805 Size

Samsung Three Pillars MLCC Strategy for AI Hardware Topology

Samsung Q4 2025 Results: MLCC focus for AI, Server and Automotive

As the trends of high integration, high density, and miniaturization gain momentum in ADAS, IVI, communication modules (such as Wi-Fi, Bluetooth, 5G, and NADs), and SiP modules, there is a corresponding rise in the demand for smaller multilayer ceramic capacitors.

In response to this demand, Samsung Electro-Mechanics has utilized its proprietary techniques for micronizing ceramic and electrode materials, along with advanced precision stacking methods, to reduce the size of C0G capacitors from the conventional 0402 inch (1.0 × 0.5mm) to 0201 inch (0.6 × 0.3mm).

This innovation allows for capacitance values of up to 220 pF, thereby meeting the requirements for miniaturization and higher capacitance in relevant applications. Additionally, Samsung Electro-Mechanics plans to further expand its product range to include capacitors with values between 1 and 100 pF through ongoing development efforts.

Application Example: Automotive class D audio amplifier

The automotive eCall and infotainment systems incorporate Class D audio amplifiers, renowned for their exceptional performance, high efficiency, and compact design. Nevertheless, as these amplifiers amplify signals in a digital format, they are inherently prone to the generation of switching noise. 

This application introduces Samsung Electro-Mechanics’ High-Precision C0G 0201 inch MLCC series, which is suitable for noise suppression purposes.

Related

Source: Samsung Electro-Mechanics

Recent Posts

Exxelia to Exhibit at APEC 2026 in San Antonio, Texas

17.3.2026
14

ESA SPCD 26 Call for Papers Extended to 30th March

16.3.2026
80

Bourns Expanded Semi-Shielded Low Profile Automotive Power Inductor

12.3.2026
15

Peak Nano to Develop Fusion Grade High Energy Film Capacitors

11.3.2026
30

Panasonic Expands Automotive PP Film Capacitors Voltage Range

9.3.2026
27

Panasonic Extends Automotive Power Inductor Line

9.3.2026
31

February 2026 Interconnect, Passives and Electromechanical Components Market Insights

9.3.2026
69

YAGEO Presents 3.6 kW LLC Transformer Platform

6.3.2026
59

Empower Extends Embedded Silicon Capacitors for AI

6.3.2026
46

Upcoming Events

Mar 19
13:00 - 14:00 CDT

Smart Consideration of Inductor Thermal Performance

Mar 21
All day

PSMA Capacitor Workshop 2026

Mar 24
9:00 - 10:00 CET

Power protection in the digital age – eFuse and hot-swap strategies for modern data center design

View Calendar

Popular Posts

  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • MLCC Manufacturers Consider Price Increase as AI Demand Outpaces Supply

    0 shares
    Share 0 Tweet 0
  • Dual Active Bridge (DAB) Topology

    0 shares
    Share 0 Tweet 0
  • MLCC and Ceramic Capacitors

    0 shares
    Share 0 Tweet 0
  • Ripple Current and its Effects on the Performance of Capacitors

    3 shares
    Share 3 Tweet 0
  • MLCC Case Sizes Standards Explained

    0 shares
    Share 0 Tweet 0
  • 3-Phase EMI Filter Design, Simulation, Calculation and Test

    0 shares
    Share 0 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© EPCI - Leading Passive Components Educational and Information Site

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • PCNS

© EPCI - Leading Passive Components Educational and Information Site

This website uses cookies. By continuing to use this website you are giving consent to cookies being used. Visit our Privacy and Cookie Policy.
Go to mobile version