Samtec Expands Offering of Slim, High-Density AcceleRate® HD Array Connectors. The AcceleRate® HD slim, high-density array connectors now available with 16 mm stack heights and up to 400 total positions.
Samtec, Inc., the service leader in the connector industry, announces expanded stack heights and pin counts of its AcceleRate® HD product line. The ADM6 and ADF6 slim, high-density 0.635 mm pitch array connectors are now available with 5 mm to 16 mm stack heights and 40 to 400 total positions in support of datacom, HPC server and storage, industrial, and military applications.
Stack heights match those of many popular Samtec interconnects, enabling mixed signal digital, RF, and power applications where sensing, processing, and power delivery coexist.
In addition to density and mechanical versatility, AcceleRate HD board-to-board connectors offer optimized signal integrity and achieve data rates up to 64 Gbps PAM4 (PCIe® 6.0/CXL® 3.2 capable), enabled by the robust Edge Rate® contact system. Edge Rate contacts are designed with a smooth, milled mating surface, which reduces wear and increases durability for high-cycle applications. The narrow edge of the contacts is aligned within the connector body to reduce broadside coupling and crosstalk.
The open pin field design, with contacts in a grid pattern within the connector housing, maximizes signal routing and grounding flexibility. Designers can choose the single-ended, differential pair, and power configuration best suited for their application.
The ADM6 and ADF6 connectors make use of Samtec’s IPC Class 3 compliant solder column board termination technique. The solder column board termination method is ideal for dense, high-speed interconnects and offers superior solder joint reliability and excellent insertion loss and return loss performance.
