Passive Components Blog
No Result
View All Result
  • Home
  • News
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Optoelectronics and Isolation
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest
    TDK HVC28 and HVC29 high-voltage DC contactors with black housings and main power terminals

    TDK Introduces Gas-Filled High-Voltage DC Contactors up to 600 A

    Murata SWL RF coaxial switch connector measurement diagram and SWL-to-SWJ board-area comparison.

    Murata RF Switch Connectors Cut PCB Test-Point Area

    Elektra Awards 2026: Passive Components and Interconnect Finalists Showcase Advances in Power Integrity, Precision and Reliability

    Mathematical state-space illustration of a series-connected memcapacitor oscillator with two constrained memory coordinates

    Memcapacitor chaos in a six-state series-connected model

    Exxelia capacitor and magnetics innovations for Electronica 2026, including CM-HVLP and CF-PP140 capacitors

    Exxelia Brings High-Temperature Passives to Electronica 2026

    IP&E Market Outlook: AI Demand Tightens Supply and Supports Higher Pricing into 2027

    Samsung Electro-Mechanics CL05Z106MS66PN automotive MLCC illustration with a rectangular ceramic body and metal end terminations

    Samsung Adds 0402 10 µF X7T MLCC for ADAS Power Rails

    Bourns PTVS03-450E-H power TVS diode in a surface-mount DFN package

    Bourns Releases 450 V Power TVS for DC Bus Clamping

    MLCC construction image

    Samsung Electro-Mechanics Patent Targets to Reduce Moisture and Cracks in High-Capacity MLCCs

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • Knowledge Blog
  • Dossiers
    • Aerospace and Defense Passive Components Dossier
    • AI Hardware Dossier
    • Automotive Dossier
    • Industrial Robotics Dossier
    • Power Converter Dossier
    • Capacitor Dossier
    • Circuit Protection Dossier
    • Inductor Dossier
    • Resistor Dossier
    • Silicon Capacitors and Integrated Passives Dossier
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
  • Home
  • News
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Optoelectronics and Isolation
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest
    TDK HVC28 and HVC29 high-voltage DC contactors with black housings and main power terminals

    TDK Introduces Gas-Filled High-Voltage DC Contactors up to 600 A

    Murata SWL RF coaxial switch connector measurement diagram and SWL-to-SWJ board-area comparison.

    Murata RF Switch Connectors Cut PCB Test-Point Area

    Elektra Awards 2026: Passive Components and Interconnect Finalists Showcase Advances in Power Integrity, Precision and Reliability

    Mathematical state-space illustration of a series-connected memcapacitor oscillator with two constrained memory coordinates

    Memcapacitor chaos in a six-state series-connected model

    Exxelia capacitor and magnetics innovations for Electronica 2026, including CM-HVLP and CF-PP140 capacitors

    Exxelia Brings High-Temperature Passives to Electronica 2026

    IP&E Market Outlook: AI Demand Tightens Supply and Supports Higher Pricing into 2027

    Samsung Electro-Mechanics CL05Z106MS66PN automotive MLCC illustration with a rectangular ceramic body and metal end terminations

    Samsung Adds 0402 10 µF X7T MLCC for ADAS Power Rails

    Bourns PTVS03-450E-H power TVS diode in a surface-mount DFN package

    Bourns Releases 450 V Power TVS for DC Bus Clamping

    MLCC construction image

    Samsung Electro-Mechanics Patent Targets to Reduce Moisture and Cracks in High-Capacity MLCCs

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • Knowledge Blog
  • Dossiers
    • Aerospace and Defense Passive Components Dossier
    • AI Hardware Dossier
    • Automotive Dossier
    • Industrial Robotics Dossier
    • Power Converter Dossier
    • Capacitor Dossier
    • Circuit Protection Dossier
    • Inductor Dossier
    • Resistor Dossier
    • Silicon Capacitors and Integrated Passives Dossier
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

Coilcraft Releases TLVR Inductors for High Density VRMs and PoL Converters

19.3.2026
Reading Time: 6 mins read
A A

Coilcraft has introduced a new family of Trans‑Inductor Voltage Regulator (TLVR) power inductors optimized for modern multi‑phase voltage regulator modules (VRMs) and point‑of‑load (PoL) converters.

These power inductor devices are aimed at high‑current rails in next‑generation CPUs, GPUs, ASICs and SoCs, where very fast transient response and high power density are critical.

RelatedPosts

Coilcraft Extends Current Sense Transformers with 1.8 kVrms Isolation

Coilcraft Introduces Automotive Common Mode Chokes Target CISPR 25 Class 5 EMC Compliance

Coilcraft Releases High-Current Ferrite Beads for CISPR 25 EMC compliance

Key features and benefits

The TLVR inductors are designed specifically for multi‑phase VRM and PoL topologies where several phases operate in parallel to supply low‑voltage, high‑current loads. In such architectures, inductor performance directly impacts transient response, efficiency and board area.

Key characteristics highlighted by Coilcraft include:

  • Designed for VRMs and PoL converters using the latest multi‑phase topologies
  • Low DC resistance (DCR) to reduce conduction losses and improve efficiency, especially at high currents
  • Tight magnetic coupling, which supports TLVR operation and helps improve transient response in multi‑phase designs
  • Excellent thermal performance, important for maintaining inductance and reliability at elevated temperatures and high currents
  • Compact footprints enabling high power density around the processor or controller
  • Specific SLV series options with high saturation currents up to 120 A and 152 A, supporting demanding core and memory rails

For power designers, low DCR and high saturation current mean that the inductor can carry the required ripple and transient currents with manageable temperature rise and without significant loss of inductance. Tight coupling within the TLVR structure is particularly useful in high‑speed digital systems where rapid load steps are common.

Typical applications

The TLVR power inductors are intended for power stages serving advanced digital ICs where supply stability and transient performance are critical. Typical target applications include:

  • Core and auxiliary rails for next‑generation CPUs and server‑class processors
  • High‑current power rails for GPUs used in AI accelerators, graphics, and data center workloads
  • Power delivery for custom ASICs and SoCs in networking, storage, and communication equipment
  • Server and data center VRMs, especially in space‑constrained motherboard and accelerator card designs
  • Other high‑current point‑of‑load converters in computing and industrial power systems

In these systems, fast load transients—such as a CPU switching between low‑power and turbo modes—require inductors that support rapid current slew while keeping voltage deviations within tight limits. The combination of low DCR, tight coupling and high saturation current directly addresses this requirement.

Technical highlights

Within the TLVR offering, Coilcraft highlights two shielded inductor series optimized for different current and size points.

The SLV9080 series is a compact TLVR inductor option with automotive‑qualified variants:

  • High saturation current up to 120 A
  • Seven inductance values from 50 nH to 200 nH
  • Compact footprint of 9.15 × 6.4 mm, supporting dense VRM layouts
  • AEC‑Q200 qualified, making it suitable for automotive power applications where extended temperature range and reliability testing are required

Inductance values in the 50–200 nH range are typical for modern multi‑phase VRMs where high switching frequencies and large phase counts are used to deliver hundreds of amperes with low output ripple. AEC‑Q200 qualification indicates that the series has been tested against a standardized set of stress tests for passive components in automotive environments.

The SLV1211 series addresses even higher current rails while maintaining a compact form factor:

  • High saturation current up to 152 A
  • Six inductance values from 70 nH to 200 nH
  • Compact 12 × 6 mm footprint

By providing higher saturation current in a slightly larger footprint, this series is positioned for the most demanding rails in processors, GPUs or custom accelerators. Designers can choose inductance values to balance transient response, ripple current and efficiency according to the converter’s switching frequency and control strategy.

Design‑in notes for engineers

When designing multi‑phase VRMs or PoL converters with TLVR inductors, several practical considerations can help ensure robust performance:

  • Match inductance to control strategy: For a given switching frequency and number of phases, lower inductance values from the 50–200 nH range will typically improve transient response but increase ripple current, while higher inductance values reduce ripple at the cost of slower current slew. Selection should be made based on the allowable ripple and transient undershoot/overshoot.
  • Verify current ratings against worst‑case conditions: Use both saturation and thermal ratings from the datasheet to ensure the chosen inductor can handle peak transient currents and steady‑state RMS currents, including margin for elevated ambient temperatures and restricted airflow.
  • Layout around hot spots: The compact footprints of 9.15 × 6.4 mm and 12 × 6 mm allow careful placement close to the IC power pins, minimizing parasitic inductance in the current paths. Designers should keep loop areas small and use wide copper pours to reduce losses and improve thermal spreading.
  • Consider automotive requirements early: If the end application targets automotive or transportation markets, selecting AEC‑Q200 qualified devices such as the SLV9080 series from the outset can avoid later redesigns. Also verify operating temperature range and any specific OEM or Tier‑1 qualification needs.
  • Thermal management: Excellent thermal performance is highlighted for the TLVR family, but real‑world behavior still depends on PCB copper, airflow and neighboring hot components. Use manufacturer‑provided thermal derating curves along with system‑level thermal simulations or measurements to validate margin.
  • EMI and shielding: Shielded TLVR inductors can help reduce radiated emissions compared to open‑frame designs. In dense VRM areas, consider overall EMI strategy, including filter placement, ground referencing, and where necessary additional input and output filtering to meet regulatory limits.

By combining low DCR, tight coupling and high saturation currents in compact shielded packages, the SLV TLVR series offers a practical option for engineers looking to optimize power density and transient performance in current‑generation and upcoming platforms.

Source

This article is based on information provided by Coilcraft in their product announcement and associated online TLVR inductor family pages, complemented with general power electronics design considerations.

References

  1. Coilcraft press release – TLVR Power Inductors
  2. Coilcraft TLVR inductors – family overview
  3. Coilcraft SLV9080 series TLVR inductors
  4. Coilcraft SLV1211 series TLVR inductors

Related

Recent Posts

TDK HVC28 and HVC29 high-voltage DC contactors with black housings and main power terminals

TDK Introduces Gas-Filled High-Voltage DC Contactors up to 600 A

29.10.2026
9

Elektra Awards 2026: Passive Components and Interconnect Finalists Showcase Advances in Power Integrity, Precision and Reliability

28.10.2026
28
Exxelia capacitor and magnetics innovations for Electronica 2026, including CM-HVLP and CF-PP140 capacitors

Exxelia Brings High-Temperature Passives to Electronica 2026

29.10.2026
26

IP&E Market Outlook: AI Demand Tightens Supply and Supports Higher Pricing into 2027

28.10.2026
37
Samsung Electro-Mechanics CL05Z106MS66PN automotive MLCC illustration with a rectangular ceramic body and metal end terminations

Samsung Adds 0402 10 µF X7T MLCC for ADAS Power Rails

27.10.2026
18
Bourns PTVS03-450E-H power TVS diode in a surface-mount DFN package

Bourns Releases 450 V Power TVS for DC Bus Clamping

27.10.2026
17
MLCC construction image

Samsung Electro-Mechanics Patent Targets to Reduce Moisture and Cracks in High-Capacity MLCCs

26.10.2026
52
Samsung Electro-Mechanics MFC molded frame ceramic capacitor with epoxy encapsulation and external metal frame

Samsung 100V Molded Frame MLCC Targets 48V AI Server PSUs

26.10.2026
30
SCHURTER EKO square-body DC fuse variants with ceramic bodies and different metal terminal arrangements

SCHURTER EKO DC Fuses Extend to 1500 V and 2000 A

26.10.2026
9

Upcoming Events

Nov 24
16:00 - 17:00 CET

Select the Correct Components for Your DC/DC Converter

Dec 1
16:00 - 17:00 CET

Developing low-noise mixed-signal systems

Dec 8
16:00 - 17:00 CET

WE-CCMF: Design Principles, Layout Guidelines and Measurement Results for High-Speed EMI Filtering

View Calendar

Popular Posts

  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • September 2026 Interconnect, Passives and Electromechanical Components Market Insights

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Capacitor Charging and Discharging

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • RF Connector Types: How To Choose the Right One

    0 shares
    Share 0 Tweet 0
  • Passive Low Pass Filters: Fundamentals and EMI Design

    0 shares
    Share 0 Tweet 0
  • Audio Capacitors: Choosing Capacitors for Crossover Circuits

    0 shares
    Share 0 Tweet 0
  • MLCC and Ceramic Capacitors

    0 shares
    Share 0 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© 2015–2026
All rights reserved

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • Dossiers
  • PCNS

© 2015–2026
All rights reserved