Passive Components Blog
No Result
View All Result
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    Researchers Enhanced 2D Ferromagnets Performance

    Bourns Releases Two High Current Common Mode Choke Models

    Electronics Weekly Announcing Finalists for Elektra Awards 2025

    Exxelia Exhibit at Electronica India September 17–19, 2025

    Würth Elektronik Announces 2025 Digital WE Days Virtual Conference

    VINATech Unveils Hybrid Energy Storage System to Revolutionize Grid Stability and Power Delivery

    SCHURTER Releases High Performance EV-Fuse

    Panasonic Industry to Double Production of MEGTRON PCB Materials

    5th PCNS Awards Outstanding Passive Component Papers

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    Ripple Steering in Coupled Inductors: SEPIC Case

    SEPIC Converter with Coupled and Uncoupled Inductors

    Coupled Inductors in SEPIC versus Flyback Converters

    Non-Linear MLCC Class II Capacitor Measurements Challenges

    Percolation Phenomenon and Reliability of Molded Power Inductors in DC/DC converters

    Root Causes and Effects of DC Bias and AC in Ceramic Capacitors

    How to Calculate the Output Capacitor for a Switching Power Supply

    Switched Capacitor Converter Explained

    Understanding Inductor Dot Markings and Their Application in LTspice

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • Suppliers
    • Who is Who
  • Events
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    Researchers Enhanced 2D Ferromagnets Performance

    Bourns Releases Two High Current Common Mode Choke Models

    Electronics Weekly Announcing Finalists for Elektra Awards 2025

    Exxelia Exhibit at Electronica India September 17–19, 2025

    Würth Elektronik Announces 2025 Digital WE Days Virtual Conference

    VINATech Unveils Hybrid Energy Storage System to Revolutionize Grid Stability and Power Delivery

    SCHURTER Releases High Performance EV-Fuse

    Panasonic Industry to Double Production of MEGTRON PCB Materials

    5th PCNS Awards Outstanding Passive Component Papers

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    Ripple Steering in Coupled Inductors: SEPIC Case

    SEPIC Converter with Coupled and Uncoupled Inductors

    Coupled Inductors in SEPIC versus Flyback Converters

    Non-Linear MLCC Class II Capacitor Measurements Challenges

    Percolation Phenomenon and Reliability of Molded Power Inductors in DC/DC converters

    Root Causes and Effects of DC Bias and AC in Ceramic Capacitors

    How to Calculate the Output Capacitor for a Switching Power Supply

    Switched Capacitor Converter Explained

    Understanding Inductor Dot Markings and Their Application in LTspice

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • Suppliers
    • Who is Who
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

Thermoreflectance Thermal Imaging as thermal characterization technique for components

21.9.2018
Reading Time: 5 mins read
A A

Source: Alter Technologies article

Thermal image of components and its temperature map can be used for failure analyses, thermal process transients, or study of new materials. See more details in technical article published by Alter Technologies.

RelatedPosts

Researchers Enhanced 2D Ferromagnets Performance

Bourns Releases Two High Current Common Mode Choke Models

Electronics Weekly Announcing Finalists for Elektra Awards 2025

Temperature gradient in integrated circuits

Submicrometric-nanometric objects nowadays present in the design of integrated circuits induce singular heat transport phenomena leading to the formation of hot-spots or strong temperature gradients at specific local points, which compromises the suitable operation and reliability of microelectronic systems, and can potentially decrease the lifetime. The typical length of such singularities can reach the micro and submicronic scale. Hence temperature gradient over such systems has to characterized by advanced thermography instruments with high spatial resolution.

Why TTI?

Thermoreflectance Thermal Imaging (TTI) is a microscopy technique that provides temperature gradient contrast by analyzing the optical reflectance of the inspected surfaces. Amongst others TTI is employed to:

  • 2D thermal mapping.
  • Failure analyses and testing of microelectronic devices
  • The visualization of high-speed thermal transients
  • to study the implementation of innovative materials.

Main characteristics and advantages of the technique are:

  • Non-contact character.
  • High spatial resolution (micron and submicrometric), limited by the diffraction limit.
  • Temporal resolutions ~ 100µs.
  • Wide range temperature detection.

How it works?

TTI exploits of the linear effect that the temperature has on the surface reflectivity (Eq. 1).

Thermoreflectance Thermal Imaging

Change of the intensity (reflectivity) due to the temperature

As illustrated is the figure, when the sample is irradiated the intensity of the reflected beam depends on the local temperature of the irradiated zone. Thus hot spots, as the red square in the figure, increase the intensity of the reflected beam. Therefore, the accurate analysis of the reflected beam at the selected areas provides a thermal map of the device surface.

Practical Applications:

This mapping technique provides useful information about the power dissipation profile and hot spots related to the design of microelectronics devices. Besides it is also used for the early detection of design, manufacturing or material defects in microelectronics systems.

Thermoreflectance Thermal Imaging

Appl Phys., 2006; 39: 4153-4166

Optical and thermal image of heating resistor

The figure illustrates the compare an optical and a thermal image of a five broad polysilicon resistive stripes (heaters). Thanks to this technique it is possible to obtain the temperature map placed at the right of the image. This image results from an accumulation over 200 heating periods and a total acquisition time of 1 min in practice.

To illustrate the high spatial resolution and the detection of micrometric hot spots the following image also shows the thermal analysis of high power semiconductor laser bars. In this case it is clearly observed a micrometric hot spot at the face of one emitter (x = 225µm). This permitted the early detection of the ongoing mirror degradation, which eventually leads to catastrophic optical mirror damage failure.

Thermoreflectance Thermal Imaging

Appl Phys., 2018; 51: 013001

Thermal imaging of an emitter laser bar

The spatial and temperature resolutions and sensitivity reached by thermoreflectance techniques are excellent, however the accuracy of the absolute temperature readings is more difficult to evaluate due to the lack of comparable thermal techniques with submicrometric spatial resolution. Therefore, major applications of the technique on the microelectronics field, involves analyzing the relative temperature gradients on the surface devices and similar studies such as thermal mapping applications, thermal transport studies and hot spots analyses.

On the other hand, thanks to the high time resolution, ITT is also used for transient thermal imaging in switching devices or other systems under pulsed operation. This character is normally used to identify buried defects or help to extract the thermal resistance/capacitance network in the device, surrounding regions in the substrate and the package.

Thermoreflectance Thermal Imaging

Proceeding 26th IEEE SEMI-THERM Symposium 978-1-4244-6460-9/10

Time domain thermoreflectance imaging of a gold heater

The figure show quick heat diffusion in the device metal on short and long time scale thermal imaging of a 100 micron integrated gold heater using pulsed boxcar averaging. The figure also illustrates how the technique is used to study the transitory heat transmission from the sample to other adjacent components.

Related

Recent Posts

Researchers Enhanced 2D Ferromagnets Performance

16.9.2025
1

Bourns Releases Two High Current Common Mode Choke Models

16.9.2025
1

Electronics Weekly Announcing Finalists for Elektra Awards 2025

16.9.2025
2

Exxelia Exhibit at Electronica India September 17–19, 2025

15.9.2025
19

Würth Elektronik Announces 2025 Digital WE Days Virtual Conference

15.9.2025
9

VINATech Unveils Hybrid Energy Storage System to Revolutionize Grid Stability and Power Delivery

15.9.2025
8

5th PCNS Awards Outstanding Passive Component Papers

14.9.2025
31

TDK Releases Ultra-small PFC Capacitors

10.9.2025
31

KYOCERA AVX Releases Novel Mini BME Stacked Ceramic Capacitors

10.9.2025
25

Vishay Releases Class 1 Leaded High Voltage Ceramic Disc Capacitors

10.9.2025
17

Upcoming Events

Sep 16
17:00 - 18:00 CEST

EMI Shielding Challenges

Sep 16
20:00 - 21:00 CEST

Reduce SMT Parasitic Design Failures with Innovative Filter Topologies

Sep 22
September 22 @ 13:00 - September 25 @ 15:15 EDT

Pre Cap Visual Inspection per Mil-Std-883 (TM 2017)

Sep 30
September 30 @ 12:00 - October 2 @ 14:00 EDT

MIL-Std-883 TM 2010

Oct 17
12:00 - 14:00 EDT

External Visual Inspection per MIL-STD-883 TM 2009

View Calendar

Popular Posts

  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Dual Active Bridge (DAB) Topology Explained

    0 shares
    Share 0 Tweet 0
  • Ripple Current and its Effects on the Performance of Capacitors

    3 shares
    Share 3 Tweet 0
  • What is a Dielectric Constant and DF of Plastic Materials?

    4 shares
    Share 4 Tweet 0
  • SEPIC Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • How to Design an Inductor

    0 shares
    Share 0 Tweet 0
  • Core Materials, Permeability and Their Losses

    0 shares
    Share 0 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© EPCI - Leading Passive Components Educational and Information Site

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • Premium Suppliers

© EPCI - Leading Passive Components Educational and Information Site

This website uses cookies. By continuing to use this website you are giving consent to cookies being used. Visit our Privacy and Cookie Policy.
Go to mobile version