Passive Components Blog
No Result
View All Result
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    Overvoltage and Transient Protection for DC/DC Power Modules

    Choosing the Right Capacitor: The Importance of Accurate Measurements

    Littelfuse Releases TMR Switches with Ultra-Low Power Magnetic Sensing

    Skeleton Opens SuperBattery Factory in Finland 

    Kyocera Releases Ultra-Compact Low Voltage Clock Oscillators

    Murata Expands High Rel NTC Thermistors in Compact 0603M Size

    RF Inductors: Selection and Design Challenges for High-Frequency Circuits

    Wk 45 Electronics Supply Chain Digest

    Transformer Safety IEC 61558 Standard

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    Choosing the Right Capacitor: The Importance of Accurate Measurements

    RF Inductors: Selection and Design Challenges for High-Frequency Circuits

    Transformer Safety IEC 61558 Standard

    3-Phase EMI Filter Design, Simulation, Calculation and Test

    Transformer Design Optimization for Power Electronics Applications

    Common Mode Chokes Selection for RF Circuits in Next-Generation Communication Systems

    Capacitor Self-balancing in a Flying-Capacitor Buck Converter

    How to Select Ferrite Bead for Filtering in Buck Boost Converter

    Power Inductors Future: Minimal Losses and Compact Designs

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    Overvoltage and Transient Protection for DC/DC Power Modules

    Choosing the Right Capacitor: The Importance of Accurate Measurements

    Littelfuse Releases TMR Switches with Ultra-Low Power Magnetic Sensing

    Skeleton Opens SuperBattery Factory in Finland 

    Kyocera Releases Ultra-Compact Low Voltage Clock Oscillators

    Murata Expands High Rel NTC Thermistors in Compact 0603M Size

    RF Inductors: Selection and Design Challenges for High-Frequency Circuits

    Wk 45 Electronics Supply Chain Digest

    Transformer Safety IEC 61558 Standard

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    Choosing the Right Capacitor: The Importance of Accurate Measurements

    RF Inductors: Selection and Design Challenges for High-Frequency Circuits

    Transformer Safety IEC 61558 Standard

    3-Phase EMI Filter Design, Simulation, Calculation and Test

    Transformer Design Optimization for Power Electronics Applications

    Common Mode Chokes Selection for RF Circuits in Next-Generation Communication Systems

    Capacitor Self-balancing in a Flying-Capacitor Buck Converter

    How to Select Ferrite Bead for Filtering in Buck Boost Converter

    Power Inductors Future: Minimal Losses and Compact Designs

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

TI’s EMI-optimized integrated transformer technology miniaturizes isolated power transfer into IC-sized packaging

24.4.2020
Reading Time: 2 mins read
A A

Engineers can shrink their power solution by as much as 80% and maximize efficiency in high-voltage industrial applications with a new high-density, isolated DC/DC bias power supply

Texas Instruments (TI) introduced the first integrated circuit (IC) developed with a new proprietary integrated transformer technology: a 500-mW high-efficiency isolated DC/DC converter with the industry’s lowest electromagnetic interference (EMI), the UCC12050.

RelatedPosts

Overvoltage and Transient Protection for DC/DC Power Modules

Choosing the Right Capacitor: The Importance of Accurate Measurements

Littelfuse Releases TMR Switches with Ultra-Low Power Magnetic Sensing

Its 2.65-mm height enables designers to reduce their solution volume by as much as 80% compared to discrete solutions and 60% compared to power modules – with twice the efficiency of competing devices. Built for industrial performance, the UCC12050’s 5-kVrms reinforced isolation and 1.2-kVrms working voltage protect against high-voltage spikes in systems such as industrial transport, grid infrastructure and medical equipment.

TI’s breakthrough integrated transformer technology enables high-density isolated DC/DC power conversion, while maintaining low EMI. The single-package, surface-mount architecture gives designers an easy-to-use, low-profile IC that reduces the bill of materials (BOM), and efficiently operates across a wide temperature range. An EMI-optimized, low capacitance transformer and quiet control scheme streamline EMI compliance while providing a reliable solution with options for reinforced or basic isolation.

Key features and benefits of the UCC12050

  • Small size, increased power density: Available in a 16-pin small-outline integrated circuit (SOIC) package measuring 10.3 mm by 10.3 mm by 2.65 mm, the UCC12050 offers 60% efficiency – twice that of competing devices of similar size – and twice the power density of comparative isolated power modules. Delivering 0.5 W in the new architecture improves reliability, enables a small BOM and simplifies board layout.
  • Ultra-low EMI: The UCC12050’s integrated transformer with very low primary-to-secondary capacitance is optimized for EMI performance, and its quiet control scheme makes it easier for engineers to have their designs pass Comité International Spécial des Perturbations Radioélectriques (CISPR) 32 Class B EMI tests, with margin, on a two-layer printed circuit board. The solution also eliminates external filter components such as low-dropout regulators and ferrite beads normally required to meet EMI certification, which significantly reduces component selection and design time.
  • Reinforced isolation, wide temperature range: The UCC12050’s reinforced isolation with 8-mm creepage and clearance is used for protection and robustness against ground potential differences. Its high efficiency and extended -40°C to 125°C operating temperature range deliver more power in extreme conditions.

This new high-density isolated power converter, the latest industry-leading device in TI’s power-management portfolio, offers small size and ease of use for any industrial application requiring isolation. Additionally, the new UCC12040 provides all of the same benefits with 3-kVrms basic isolation.

Package, availability and pricing
The UCC12050 and UCC12040 are available in volume production from TI and authorized distributors in a 16-pin, 10.3-mm-by-10.3-mm-by-2.65-mm SOIC package. Pricing starts at US$3.90and US$3.15, respectively, in 1,000-unit quantities. Engineers can evaluate this product with the UCC12050EVM-022 evaluation module, available on TI.com for US$99.

Related

Source: Texas Instruments

Recent Posts

RF Inductors: Selection and Design Challenges for High-Frequency Circuits

10.11.2025
52

Transformer Safety IEC 61558 Standard

7.11.2025
27

3-Phase EMI Filter Design, Simulation, Calculation and Test

6.11.2025
77

Coilcraft Introduces Ultra-Low Loss Shielded Power Inductors

6.11.2025
26

Exxelia Presents Smart Integrated Magnetics Solution at Space Tech Expo 2025 

5.11.2025
20

Murata Expands High Cutoff Frequency Chip Common Mode Chokes

5.11.2025
16

Transformer Design Optimization for Power Electronics Applications

4.11.2025
26

Bourns Releases High Current Metal Alloy-based, Multilayer Power Chip Inductors

31.10.2025
42

Common Mode Chokes Selection for RF Circuits in Next-Generation Communication Systems

30.10.2025
22

Upcoming Events

Dec 2
December 2 @ 12:00 - December 4 @ 14:15 CET

Microwave Packaging Technology

Dec 9
December 9 @ 12:00 - December 11 @ 14:15 EST

Space and Military Standards for Hybrids and RF Microwave Modules

Dec 10
16:00 - 17:00 CET

Designing Qi2 Wireless Power Systems: Practical Development and EMC Optimization

View Calendar

Popular Posts

  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Ripple Current and its Effects on the Performance of Capacitors

    3 shares
    Share 3 Tweet 0
  • Dual Active Bridge (DAB) Topology

    0 shares
    Share 0 Tweet 0
  • MLCC and Ceramic Capacitors

    0 shares
    Share 0 Tweet 0
  • What is a Dielectric Constant and DF of Plastic Materials?

    4 shares
    Share 4 Tweet 0
  • SEPIC Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • What Electronics Engineer Needs to Know About Passive Low Pass Filters

    0 shares
    Share 0 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© EPCI - Leading Passive Components Educational and Information Site

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • PCNS

© EPCI - Leading Passive Components Educational and Information Site

This website uses cookies. By continuing to use this website you are giving consent to cookies being used. Visit our Privacy and Cookie Policy.
Go to mobile version