Passive Components Blog
No Result
View All Result
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    Modeling Planar Magnetics Temperature: Practical Guidelines for Power Electronics Engineers

    YAGEO Releases Ferrite Shielded Power Inductors for High‑Density Designs

    Samsung Presents MLCC Selection Guide for Humanoids and Robotic Applications

    AI-Assisted Structural Diagnostics and Physics-Based Reliability Interpretation of Tantalum Capacitor Anodes

    YAGEO Introduces EMI Suppression High‑Current 3‑phase Common Mode Chokes

    KYOCERA AVX MIL-PRF-32535 BME NP0 MLCCs Approved to the DLA QPD

    ECIA March 2026 Industry Pulse Points to Best Sales Climate in Five Years

    Vishay Releases 2-Way Wilkinson Divider / Combiner for 15–20 GHz RF Front Ends

    Wk 15 Electronics Supply Chain Digest

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    Transformer-Based Power-Line Harvester Magnetic Design

    Thermal Modeling of Magnetics

    Standard vs Planar LLC transformers Comparison for Battery Chargers

    How Modern Tools Model Magnetic Components for Power Electronics

    Advanced Loss Modeling for Planar Magnetics in the Frenetic Planar Tool

    2026 Power Magnetics Design Trends: Flyback, DAB and Planar

    Enabling Software‑Defined Vehicle Architectures: Automotive Ethernet and Zonal Smart Power

    Calculating Resistance Value of a Flyback RC Snubber 

    One‑Pulse Characterization of Nonlinear Power Inductors

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • DossiersNew
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    Modeling Planar Magnetics Temperature: Practical Guidelines for Power Electronics Engineers

    YAGEO Releases Ferrite Shielded Power Inductors for High‑Density Designs

    Samsung Presents MLCC Selection Guide for Humanoids and Robotic Applications

    AI-Assisted Structural Diagnostics and Physics-Based Reliability Interpretation of Tantalum Capacitor Anodes

    YAGEO Introduces EMI Suppression High‑Current 3‑phase Common Mode Chokes

    KYOCERA AVX MIL-PRF-32535 BME NP0 MLCCs Approved to the DLA QPD

    ECIA March 2026 Industry Pulse Points to Best Sales Climate in Five Years

    Vishay Releases 2-Way Wilkinson Divider / Combiner for 15–20 GHz RF Front Ends

    Wk 15 Electronics Supply Chain Digest

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    Transformer-Based Power-Line Harvester Magnetic Design

    Thermal Modeling of Magnetics

    Standard vs Planar LLC transformers Comparison for Battery Chargers

    How Modern Tools Model Magnetic Components for Power Electronics

    Advanced Loss Modeling for Planar Magnetics in the Frenetic Planar Tool

    2026 Power Magnetics Design Trends: Flyback, DAB and Planar

    Enabling Software‑Defined Vehicle Architectures: Automotive Ethernet and Zonal Smart Power

    Calculating Resistance Value of a Flyback RC Snubber 

    One‑Pulse Characterization of Nonlinear Power Inductors

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • DossiersNew
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

TI’s EMI-optimized integrated transformer technology miniaturizes isolated power transfer into IC-sized packaging

24.4.2020
Reading Time: 2 mins read
A A

Engineers can shrink their power solution by as much as 80% and maximize efficiency in high-voltage industrial applications with a new high-density, isolated DC/DC bias power supply

Texas Instruments (TI) introduced the first integrated circuit (IC) developed with a new proprietary integrated transformer technology: a 500-mW high-efficiency isolated DC/DC converter with the industry’s lowest electromagnetic interference (EMI), the UCC12050.

RelatedPosts

Modeling Planar Magnetics Temperature: Practical Guidelines for Power Electronics Engineers

YAGEO Releases Ferrite Shielded Power Inductors for High‑Density Designs

Samsung Presents MLCC Selection Guide for Humanoids and Robotic Applications

Its 2.65-mm height enables designers to reduce their solution volume by as much as 80% compared to discrete solutions and 60% compared to power modules – with twice the efficiency of competing devices. Built for industrial performance, the UCC12050’s 5-kVrms reinforced isolation and 1.2-kVrms working voltage protect against high-voltage spikes in systems such as industrial transport, grid infrastructure and medical equipment.

TI’s breakthrough integrated transformer technology enables high-density isolated DC/DC power conversion, while maintaining low EMI. The single-package, surface-mount architecture gives designers an easy-to-use, low-profile IC that reduces the bill of materials (BOM), and efficiently operates across a wide temperature range. An EMI-optimized, low capacitance transformer and quiet control scheme streamline EMI compliance while providing a reliable solution with options for reinforced or basic isolation.

Key features and benefits of the UCC12050

  • Small size, increased power density: Available in a 16-pin small-outline integrated circuit (SOIC) package measuring 10.3 mm by 10.3 mm by 2.65 mm, the UCC12050 offers 60% efficiency – twice that of competing devices of similar size – and twice the power density of comparative isolated power modules. Delivering 0.5 W in the new architecture improves reliability, enables a small BOM and simplifies board layout.
  • Ultra-low EMI: The UCC12050’s integrated transformer with very low primary-to-secondary capacitance is optimized for EMI performance, and its quiet control scheme makes it easier for engineers to have their designs pass Comité International Spécial des Perturbations Radioélectriques (CISPR) 32 Class B EMI tests, with margin, on a two-layer printed circuit board. The solution also eliminates external filter components such as low-dropout regulators and ferrite beads normally required to meet EMI certification, which significantly reduces component selection and design time.
  • Reinforced isolation, wide temperature range: The UCC12050’s reinforced isolation with 8-mm creepage and clearance is used for protection and robustness against ground potential differences. Its high efficiency and extended -40°C to 125°C operating temperature range deliver more power in extreme conditions.

This new high-density isolated power converter, the latest industry-leading device in TI’s power-management portfolio, offers small size and ease of use for any industrial application requiring isolation. Additionally, the new UCC12040 provides all of the same benefits with 3-kVrms basic isolation.

Package, availability and pricing
The UCC12050 and UCC12040 are available in volume production from TI and authorized distributors in a 16-pin, 10.3-mm-by-10.3-mm-by-2.65-mm SOIC package. Pricing starts at US$3.90and US$3.15, respectively, in 1,000-unit quantities. Engineers can evaluate this product with the UCC12050EVM-022 evaluation module, available on TI.com for US$99.

Related

Source: Texas Instruments

Recent Posts

Modeling Planar Magnetics Temperature: Practical Guidelines for Power Electronics Engineers

15.4.2026
2

YAGEO Releases Ferrite Shielded Power Inductors for High‑Density Designs

15.4.2026
2

YAGEO Introduces EMI Suppression High‑Current 3‑phase Common Mode Chokes

14.4.2026
15

ECIA March 2026 Industry Pulse Points to Best Sales Climate in Five Years

13.4.2026
27

Coilcraft Unveils Molded Power Inductors for High‑Current VRMs

8.4.2026
38

Bourns Releases Compact High Current Shielded Power Inductors

2.4.2026
28

March 2026 Interconnect, Passives and Electromechanical Components Market Insights

2.4.2026
94

APEC 2026 Power Electronics Trends and Implications for Passive Components

1.4.2026
110

Indias ECMS Wave Brings New Capacity For Passive Components Manufacturing in India

31.3.2026
56

Upcoming Events

Apr 21
16:00 - 17:00 CEST

Heatsink Solutions: Thermal Management in electronic devices

May 5
16:00 - 17:00 CEST

Understanding and Selecting Capacitors – Fundamentals, Technologies and Latest Trends

May 19
16:00 - 17:00 CEST

Designing Qi2 Wireless Power Systems: Practical Development and EMC Optimization

View Calendar

Popular Posts

  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • MLCC and Ceramic Capacitors

    0 shares
    Share 0 Tweet 0
  • Dual Active Bridge (DAB) Topology

    0 shares
    Share 0 Tweet 0
  • Capacitor Charging and Discharging

    0 shares
    Share 0 Tweet 0
  • Plastic Materials Dielectric Constant and DF

    4 shares
    Share 4 Tweet 0
  • MLCC Case Sizes Standards Explained

    0 shares
    Share 0 Tweet 0
  • Ripple Current and its Effects on the Performance of Capacitors

    3 shares
    Share 3 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© EPCI - Leading Passive Components Educational and Information Site

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • PCNS

© EPCI - Leading Passive Components Educational and Information Site

This website uses cookies. By continuing to use this website you are giving consent to cookies being used. Visit our Privacy and Cookie Policy.
Go to mobile version