Passive Components Blog
No Result
View All Result
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    Nvidia Vera Rubin: Why One AI Rack Needs So Many More MLCC Capacitors

    Stackpole Introduces 1400A Busbar Shunt Resistors

    Tecate Unveils High‑temp 105C Supercapacitors for Harsh‑Environment Designs

    Bourns Expands 1000V High‑Power Fuses for Semiconductor and Battery Protection

    Passive Components in 2026: From Invisible Commodity to Design Parameter

    Bourns Introduces High Current Chip Ferrite Beads for Dense Power Rails

    Wk 22 Electronics Supply Chain Digest

    Vishay Releases High‑Current Radial Inductors up to 209 A

    May 2026 Interconnect, Passives and Electromechanical Components Market Insights

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    Current Sense Transformer Datasheet and Design‑in Guide

    Designing a USB Type‑C Flyback Planar Transformer with Frenetic’s Planar Tool

    Magnetics Design in High‑Frequency GaN Converters

    Qi2 Wireless Charging: Inductors, Capacitors and EMC Filters

    Two‑capacitor paradox explained for engineers

    Capacitances of Nonlinear MLCCs: What Datasheets Don’t Tell You

    Tapped Inductor Buck Converter Fundamentals

    Planar vs Conventional Transformer: When it Make Sense

    Modeling Fringing Field Losses in Inductors & Transformers

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • DossiersNew
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    Nvidia Vera Rubin: Why One AI Rack Needs So Many More MLCC Capacitors

    Stackpole Introduces 1400A Busbar Shunt Resistors

    Tecate Unveils High‑temp 105C Supercapacitors for Harsh‑Environment Designs

    Bourns Expands 1000V High‑Power Fuses for Semiconductor and Battery Protection

    Passive Components in 2026: From Invisible Commodity to Design Parameter

    Bourns Introduces High Current Chip Ferrite Beads for Dense Power Rails

    Wk 22 Electronics Supply Chain Digest

    Vishay Releases High‑Current Radial Inductors up to 209 A

    May 2026 Interconnect, Passives and Electromechanical Components Market Insights

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    Current Sense Transformer Datasheet and Design‑in Guide

    Designing a USB Type‑C Flyback Planar Transformer with Frenetic’s Planar Tool

    Magnetics Design in High‑Frequency GaN Converters

    Qi2 Wireless Charging: Inductors, Capacitors and EMC Filters

    Two‑capacitor paradox explained for engineers

    Capacitances of Nonlinear MLCCs: What Datasheets Don’t Tell You

    Tapped Inductor Buck Converter Fundamentals

    Planar vs Conventional Transformer: When it Make Sense

    Modeling Fringing Field Losses in Inductors & Transformers

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • DossiersNew
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

Würth Elektronik’s CTO Alexander Gerfer stressed the importance of an innovative hardware partnership for the success of digital companies

25.9.2019
Reading Time: 2 mins read
A A

Source: Würth Elektronik news

Waldenburg (Germany), 25 September 2019 – Alexander Gerfer, CTO of the Würth Elektronik eiSos Group, at one of the most important digital future conferences worldwide, the DLD Tel Aviv, emphasized in his opening speech “when technology meets customer” design support of hardware and the availability of components can decide on the failure or success of innovation.

RelatedPosts

Nvidia Vera Rubin: Why One AI Rack Needs So Many More MLCC Capacitors

Stackpole Introduces 1400A Busbar Shunt Resistors

Tecate Unveils High‑temp 105C Supercapacitors for Harsh‑Environment Designs

In his speech, Gerfer stressed the importance of an innovative hardware partner for the success of digital companies:

“Würth Elektronik is not just a hardware supplier, we rather see ourselves as our customers’ real partner.”

We know them and their needs thoroughly and focus our product development on them. ‘Can’t’ is not part of our vocabulary. If there is still no solution to a particular challenge, then we’ll invent one. This is the reason why Würth Elektronik, as an innovative technology company, is behind many successes, albeit invisibly … the ‘secret ingredient of industry’ as it were. There are plenty of examples of customer-driven innovations from Würth Elektronik, including REDEXPERT, an online platform developed in-house that has become known worldwide as the most precise option for AC loss calculation in switch mode power supplies.

Another area to improve the CO2 footprint is ‘Horticulture Farming’. Through its cooperation with the Technical University of Munich, Würth Elektronik supports users with practice-relevant data for the selection of the best Horticulture LEDs, adapted to the respective plant species. But that’s not all: There’s another promising project already in the pipeline from the company. “We can’t say too much here yet,” says Gerfer, “only that it’s about the development of very specific components for intelligent clothing of the future.”

Panel discussion with participants from renowned companies

Following his opening speech, Alexander Gerfer participated in the panel discussion moderated by Raz Bachar, Managing Director of Microsoft For Startups. Leaders of prestigious companies, such as Deutsche Telekom, Sage and Panorama Software, discussed the question of how companies can ensure they develop the right technologies for the future. Here, Gerfer convincingly explained why software and digital companies need strong partners to provide them with hardware solutions completely tailored to their needs: “Many start-up companies have the right ideas, but cannot realize them because the hardware needed for prototypes, for example, is not available in small quantities. This is where Würth Elektronik comes into play as a technology enabler. Not only do we supply young companies and developers with the required components, but we also support them with our comprehensive expertise.”

About DLD as a worldwide network for digitization

DLD’s aim is to create a global conference network on digitization covering the fields of business, society, education and culture. Today it is one of the most important innovation conferences in the world. Since its inception in 2005, outstanding speakers such as Mark Zuckerberg, Eric Schmidt and Paolo Coelho have spoken at the conferences in Munich, New York, Beijing, London, Moscow, Hong Kong, Tel Aviv and Singapore.

featured image source: Würth Elektronik

Related

Recent Posts

Nvidia Vera Rubin: Why One AI Rack Needs So Many More MLCC Capacitors

2.6.2026
22

Passive Components in 2026: From Invisible Commodity to Design Parameter

2.6.2026
15

May 2026 Interconnect, Passives and Electromechanical Components Market Insights

29.5.2026
87

ECIA Industry Pulse April 2026: Sentiment Cools but Stays Strong

21.5.2026
70

Industrial Passive Components Markets and Technologies 2026

21.5.2026
151

Automotive Passive Components Technology Dossier

21.5.2026
84

Samsung Electro-Mechanics Signs 1.5T KRW Silicon Capacitor AI Contract

21.5.2026
122

Murata Expands Thermistor Production Capacity at Yokaichi Plant

21.5.2026
49

Würth Elektronik Presents New Bidirectional Digital Isolators

20.5.2026
46

Upcoming Events

Jun 16
16:00 - 17:00 CEST

EMC with EMC – EMC‑compliant design with electromechanical connectors

View Calendar

Popular Posts

  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • MLCC and Ceramic Capacitors

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Capacitor Charging and Discharging

    0 shares
    Share 0 Tweet 0
  • What Electronics Engineer Needs to Know About Passive Low Pass Filters

    0 shares
    Share 0 Tweet 0
  • Dual Active Bridge (DAB) Topology

    0 shares
    Share 0 Tweet 0
  • Ripple Current and its Effects on the Performance of Capacitors

    3 shares
    Share 3 Tweet 0
  • SEPIC Converter Design and Calculation

    0 shares
    Share 0 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© EPCI - Leading Passive Components Educational and Information Site

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • Dossiers
  • PCNS

© EPCI - Leading Passive Components Educational and Information Site

This website uses cookies. By continuing to use this website you are giving consent to cookies being used. Visit our Privacy and Cookie Policy.
Go to mobile version