Passive Components Blog
No Result
View All Result
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    Bourns Introduces Low-ohmic 2W Thick Film Resistors in Compact Package

    Samsung Releases 1uF 25V 0402 MLCC for AI Power Modules 

    TDK and NIPPON CHEMICAL to Establish Joint Venture for MLCC Material Development

    Passive Components for Next Gen Automotive Systems

    ROHM Expands Its High-Accuracy EROM Models for Shunt Resistors

    Samsung Presents Worlds First 100V 22nF Automotive MLCC in 0402 Size

    Circular Connectors Coding

    binder Presents Harsh Environment Connector for Outdoor Environments

    DigiKey Introduces Industry-First Power Supply Configuration Tool

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    Choosing the Right Capacitor: The Importance of Accurate Measurements

    RF Inductors: Selection and Design Challenges for High-Frequency Circuits

    Transformer Safety IEC 61558 Standard

    3-Phase EMI Filter Design, Simulation, Calculation and Test

    Transformer Design Optimization for Power Electronics Applications

    Common Mode Chokes Selection for RF Circuits in Next-Generation Communication Systems

    Capacitor Self-balancing in a Flying-Capacitor Buck Converter

    How to Select Ferrite Bead for Filtering in Buck Boost Converter

    Power Inductors Future: Minimal Losses and Compact Designs

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    Bourns Introduces Low-ohmic 2W Thick Film Resistors in Compact Package

    Samsung Releases 1uF 25V 0402 MLCC for AI Power Modules 

    TDK and NIPPON CHEMICAL to Establish Joint Venture for MLCC Material Development

    Passive Components for Next Gen Automotive Systems

    ROHM Expands Its High-Accuracy EROM Models for Shunt Resistors

    Samsung Presents Worlds First 100V 22nF Automotive MLCC in 0402 Size

    Circular Connectors Coding

    binder Presents Harsh Environment Connector for Outdoor Environments

    DigiKey Introduces Industry-First Power Supply Configuration Tool

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    Choosing the Right Capacitor: The Importance of Accurate Measurements

    RF Inductors: Selection and Design Challenges for High-Frequency Circuits

    Transformer Safety IEC 61558 Standard

    3-Phase EMI Filter Design, Simulation, Calculation and Test

    Transformer Design Optimization for Power Electronics Applications

    Common Mode Chokes Selection for RF Circuits in Next-Generation Communication Systems

    Capacitor Self-balancing in a Flying-Capacitor Buck Converter

    How to Select Ferrite Bead for Filtering in Buck Boost Converter

    Power Inductors Future: Minimal Losses and Compact Designs

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

2nd PCNS Attendees Valued Its High Professional and Networking Level

24.4.2020
Reading Time: 3 mins read
A A

Source: EPCI news

2nd PCNS Passive Components Networking Symposium held in Bucharest, Romania on September 10-13th, 2019 was a great opportunity to meet passive components professionals and discuss with them hot topics, technical challenges, market trends, material supplies etc. related to passive components.

PCNS symposium was attended by 63 participants from 13 European countries, USA and China and posed an ideal networking possibilities for designers, purchasers, application engineers etc. to meet together within the group of component manufacturer industry (~50%), academia (~ 20%) and end users (~ 20% mainly automotive). Space industry was represented by presence of ESA ESTEC and Jacobs Engineering Inc/NASA.

2nd PCNS was hosted by Politehnica University of Bucharest that showed their latest and greatest laboratory equipment ready for material and structure characterization, failure analysis and ready to support material science. Bite of Romanian culture surrounded Welcome Drink with wine testing of excellent local Romanian wines. Gala Dinner at country restaurant introduced national cuisine with a folk music that immersed everyone into a cosmopolitan networking atmosphere.

The professional program included mounting and advanced passives workshops, four keynote speeches, hot topic panel discussion and 18 technical papers.

The two hour Hot Panel Discussion covered challenging topic of DC BIAS Ageing effect of MLCC and its performance in automotive applications. The discussion focused on definition of the issue, capabilities of manufacturers to measure and support suitable tools for designers. Continental Automotive GmbH shared his valuable input on position of customers and its requirements.

Hot Panel Discussion about MLCC class II DC BIAS Ageing.
Left to right: Paul Le Nezet Würth Elektronik; Yuki Nagoshi Murata Electronics Europe; Ladislav Vindiš Continental Automotive GmbH; Benjamin Blume Samsung Electro-Mechanics; Wilson Hayworth Kemet Electronics; Ron Demcko AVX Corporation; Tomas Zednicek EPCI

The panel was very open with target to find the best way forward helping designers of not only automotive system utilize the best fit capacitor technologies. Open questions from audience engaged well the panelist with wide range of related technical and supply chain questions.

The panel discussion summary will be processed into an open letter to AECQ-200 committee to move the topic and further discussion to next level.
PCNS attendees, according to their feedback, rated high: open atmosphere, participants’ level of interest and professional competence and networking.

PCNS Mobile and Web Application allowed interactive way of communication. Attendees could easily navigate through the menu, information about program, sponsors or exhibitors as well as rate online individual papers. The best and two outstanding papers voted by participants are:

BEST PAPER AWARD

Title: Degradation of ESR in Polymer Tantalum Capacitors during High Temperature Storage

by: Dr. Alexander Teverovsky

Jacobs Engineering Inc. NASA GSFC

 

OUTSTANDING PAPER AWARD

Title: Integrated and discrete capacitors based on carbon nanostructures with capacitance densities in excess of 350nF/mm2

by: S.Krause Ph.D., R.Andersson, M.Bylund, A.M.Saleem and V.Desmaris;

SMOLTEK AB

 

 

 

OUTSTANDING PAPER AWARD

Title: Analysis of Multi-Layer Ceramic Capacitors used in Power Distribution Networks

by: Marcel Manofu1, Radu Voina2 and Cătălin Negrea1

1 Continental Automotive Romania, Timișoara;
2 Technical University of Cluj-Napoca

 

Big Thanks also to all the participants for great professional environment, open and friendly atmosphere and PCNS sponsors:

AVX Corporation, Itelcond, Kemet Corporation, Würth Elektronik and exhibitors that enabled this event to happen.

 

PCNS is a bi-annual Passive Components Networking Symposium organized by EPCI hosted by European univeristy.

! The next 3rd PCNS to be hosted by Politehnico di Milano in September 2021 !

! See you there !

 

RelatedPosts

Bourns Introduces Low-ohmic 2W Thick Film Resistors in Compact Package

Samsung Releases 1uF 25V 0402 MLCC for AI Power Modules 

Bourns Extends High Power Thick Film Resistors with Four New Series

Related

Recent Posts

Bourns Introduces Low-ohmic 2W Thick Film Resistors in Compact Package

28.11.2025
5

Samsung Releases 1uF 25V 0402 MLCC for AI Power Modules 

27.11.2025
22

TDK and NIPPON CHEMICAL to Establish Joint Venture for MLCC Material Development

27.11.2025
31

Passive Components for Next Gen Automotive Systems

26.11.2025
54

ROHM Expands Its High-Accuracy EROM Models for Shunt Resistors

26.11.2025
18

Samsung Presents Worlds First 100V 22nF Automotive MLCC in 0402 Size

26.11.2025
12

Bourns Releases High Precision Power Resistor for High-Energy Pulse Applications

26.11.2025
9

YAGEO Expands Aluminum Capacitors with 80V Ratings for 48V Automotive and Industrial Systems

25.11.2025
25

Knowles Doubles Capacitance of its Class I Ceramic C0G Capacitors

24.11.2025
32

Upcoming Events

Dec 2
December 2 @ 12:00 - December 4 @ 14:15 CET

Microwave Packaging Technology

Dec 3
17:00 - 18:00 CET

The Hidden Secret of the Magnetic Transformer and example of its use

Dec 9
December 9 @ 12:00 - December 11 @ 14:15 EST

Space and Military Standards for Hybrids and RF Microwave Modules

View Calendar

Popular Posts

  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • MLCC and Ceramic Capacitors

    0 shares
    Share 0 Tweet 0
  • Ripple Current and its Effects on the Performance of Capacitors

    3 shares
    Share 3 Tweet 0
  • Dual Active Bridge (DAB) Topology

    0 shares
    Share 0 Tweet 0
  • What Electronics Engineer Needs to Know About Passive Low Pass Filters

    0 shares
    Share 0 Tweet 0
  • What is a Dielectric Constant and DF of Plastic Materials?

    4 shares
    Share 4 Tweet 0
  • SEPIC Converter Design and Calculation

    0 shares
    Share 0 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© EPCI - Leading Passive Components Educational and Information Site

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • PCNS

© EPCI - Leading Passive Components Educational and Information Site

This website uses cookies. By continuing to use this website you are giving consent to cookies being used. Visit our Privacy and Cookie Policy.
Go to mobile version