Passive Components Blog
No Result
View All Result
  • Home
  • News
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Optoelectronics and Isolation
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest
    SCHURTER TCS6F IP67 sealed SMD tactile switch with white silicone actuator on dark background

    SCHURTER Unveils IP67 Tactile Switch in 6.2 × 6.2 mm Package

    YAGEO SMD 0603 ST Pt1000 chip sensor shown in front of rooftop HVAC equipment

    YAGEO SMD 0603 ST Pt1000 Sensor with Standard SMD Termination

    Power line EMI filter on a copper ground-plane fixture connected to a vector network analyzer with a toroidal balun

    How to Measure Filter Performance: Insertion Loss, VNA Fixtures and CM/DM Separation

    Assorted EMI and RF filter components: common mode choke, ferrite beads, feedthrough filter, X2 capacitor, cavity filter, ceramic coaxial resonators, thin-film filter and SAW/BAW packages

    Passive Filter Technologies Compared: LC, Ferrite, Feedthrough, Ceramic, Cavity, Microstrip, SAW and BAW

    Illustration of a thin-film capacitor stack with TiN electrodes and an ultrathin hafnium zirconium oxide ferroelectric layer on silicon

    Sub-Volt Ferroelectric HZO Capacitor Pairs Speed and Endurance

    Cut-open lithium-ion capacitor pouch cell showing stacked carbon electrodes and separators, with vials of carbon powder

    Lithium-Ion Capacitor Review Backs Hard Carbon//AC Pairing

    Rack power shelf in an AI data center with film DC-link capacitors, a supercapacitor bank and a converter board

    800 VDC AI Data Centers Reshape Capacitor Demand for 2027

    Schematic of a titanium nitride thin-film inductor within a CMOS poly-resistor stack beside its integrated resonator circuit.

    TiN Superinductors Bring Compact Cryogenic Inductance to CMOS

    Close-up of reddish-brown metallic rocks illustrating TTI MarketEYE’s connector raw material cost analysis

    Connector Raw Material Costs Rise 20.9% in Q2 2026

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • Knowledge Blog
  • Dossiers
    • Aerospace and Defense Passive Components Dossier
    • AI Hardware Dossier
    • Automotive Dossier
    • Industrial Robotics Dossier
    • Power Converter Dossier
    • Capacitor Dossier
    • Circuit Protection Dossier
    • Inductor Dossier
    • Resistor Dossier
    • Silicon Capacitors and Integrated Passives Dossier
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
  • Home
  • News
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Optoelectronics and Isolation
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest
    SCHURTER TCS6F IP67 sealed SMD tactile switch with white silicone actuator on dark background

    SCHURTER Unveils IP67 Tactile Switch in 6.2 × 6.2 mm Package

    YAGEO SMD 0603 ST Pt1000 chip sensor shown in front of rooftop HVAC equipment

    YAGEO SMD 0603 ST Pt1000 Sensor with Standard SMD Termination

    Power line EMI filter on a copper ground-plane fixture connected to a vector network analyzer with a toroidal balun

    How to Measure Filter Performance: Insertion Loss, VNA Fixtures and CM/DM Separation

    Assorted EMI and RF filter components: common mode choke, ferrite beads, feedthrough filter, X2 capacitor, cavity filter, ceramic coaxial resonators, thin-film filter and SAW/BAW packages

    Passive Filter Technologies Compared: LC, Ferrite, Feedthrough, Ceramic, Cavity, Microstrip, SAW and BAW

    Illustration of a thin-film capacitor stack with TiN electrodes and an ultrathin hafnium zirconium oxide ferroelectric layer on silicon

    Sub-Volt Ferroelectric HZO Capacitor Pairs Speed and Endurance

    Cut-open lithium-ion capacitor pouch cell showing stacked carbon electrodes and separators, with vials of carbon powder

    Lithium-Ion Capacitor Review Backs Hard Carbon//AC Pairing

    Rack power shelf in an AI data center with film DC-link capacitors, a supercapacitor bank and a converter board

    800 VDC AI Data Centers Reshape Capacitor Demand for 2027

    Schematic of a titanium nitride thin-film inductor within a CMOS poly-resistor stack beside its integrated resonator circuit.

    TiN Superinductors Bring Compact Cryogenic Inductance to CMOS

    Close-up of reddish-brown metallic rocks illustrating TTI MarketEYE’s connector raw material cost analysis

    Connector Raw Material Costs Rise 20.9% in Q2 2026

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • Knowledge Blog
  • Dossiers
    • Aerospace and Defense Passive Components Dossier
    • AI Hardware Dossier
    • Automotive Dossier
    • Industrial Robotics Dossier
    • Power Converter Dossier
    • Capacitor Dossier
    • Circuit Protection Dossier
    • Inductor Dossier
    • Resistor Dossier
    • Silicon Capacitors and Integrated Passives Dossier
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

AVX to Exhibit & Deliver Five Presentations at CMSE 2021, Continuing its Longstanding Support for the Annual Conference

15.3.2021
Reading Time: 6 mins read
A A
This year’s virtual event marks 10 years of AVX participation in the Components for Military & Space Electronics Conference, as well as the eighth consecutive year that AVX engineers have been invited to share their unique expertise with the high-level military and space components supply chain personnel in attendance.

AVX Corporation, a leading manufacturer and supplier of advanced electronic components and interconnect, sensor, control, and antenna solutions, is delivering three technical presentations, teaching two training seminars, and showcasing its extensive portfolio of high-reliability MIL-spec components at the 24th annual Components for Military & Space Electronics Conference (CMSE 2021), which, due to continued global concerns regarding the COVID-19 pandemic, will be held virtually Monday through Friday, April 19–23.

Widely recognized as the premier conference dedicated to the design, reliability, and application of both MIL-spec and commercial off-the-shelf (COTS) components engineered for military and commercial avionics, aerospace, and space systems, CMSE welcomes high-level military and space components supply chain personnel, addresses topics including electronic components, testing, reliability, and supply chain, and places a special emphasis on new technology and design practices. This year’s virtual five-day conference will feature three keynotes, four in-depth tutorial sessions, six technical sessions, three interactive student sessions, two panel discussions, and an intimate, extremely well-focused exhibition and also marks AVX’s 10th consecutive year of enthusiastic support for this unique annual event.

RelatedPosts

SCHURTER Unveils IP67 Tactile Switch in 6.2 × 6.2 mm Package

YAGEO SMD 0603 ST Pt1000 Sensor with Standard SMD Termination

How to Measure Filter Performance: Insertion Loss, VNA Fixtures and CM/DM Separation

The first day of CMSE 2021 will consist of two in-depth tutorial sessions, one of which — the afternoon session, “Overview of Microelectronic Components Specs for Military and Space Electronics” — will be co-taught by AVX Fellow and Technical Sales Group Manager, Ron Demcko, who has served as a member of the CMSE Program Committee since 2010. This session will provide electronics engineers with better insight into the myriad specifications that govern the quality and reliability of military- and space-grade components, and will feature presentations from Lawrence (Larry) Harzstark, aerospace technical fellow, Electronics Engineering Subdivision, Peter Majewicz, manager of the NASA Electronics Parts and Packaging (NEPP) Program, and Demcko, who will provide a high-level overview of military, ESA, COTS, and automotive-grade specifications applicable to capacitors, resistors, filters, and inductors.

Two of the three AVX contributions to the technical sessions will be presented during Sessions 1A and 1B on Tuesday, April 20, and the third will be presented during the Vendor Application Session on Thursday, April 22.

In Session 1A, AVX Field Applications Engineer Daniel West will present “A Comparison of Commercial, Automotive, and Aerospace Capacitors,” which will provide attendees with a comparison of the mechanical, electrical, and reliability characteristics of commercial, automotive, and military- and aerospace-grade ceramic and tantalum capacitors; explore the various design and testing protocols involved in qualifying ceramic and tantalum capacitors to commercial, automotive, and aerospace reliability levels; address source drawings and COTS+ components; and share guidelines for matching appropriate component grades to specific applications. In addition to presenting, West will also chair Session 1A on “Passive Components for Military and Hi-Rel Space Systems.”

In Session 1B, AVX Ceramics Technical Manager John Marshall will present “Low-Inductance MLCC Capacitors for High-Speed Processor Circuits,” which will provide attendees with an overview of the technology used to manufacture and supply existing versions of commercial-grade and high-reliability low-ESL components, including low-inductance ceramic capacitors (LICCs) and interdigitated capacitors (IDCs) specifically targeted at addressing growing demand for high-speed processing capabilities, as well as the material, design, manufacturing, and screening modifications this product group underwent in order to satisfy stringent MIL-spec requirements. Marshall with also chart the range of products and the timeline to full QPL, providing insights into manufacturing operations, process cycle times, and future capacity plans through 2021.

On Thursday, AVX Assistant Quality and Reliability Manager Brian Brunette will present a concise introduction to the characteristics of hermetically packaged tantalum polymer capacitors during the Vendor Application Session.

The fifth and final day of the CMSE virtual event will feature two tutorial sessions, the second of which will also be co-taught by Ron Demcko. Divided into two sections, the Capacitor Reliability Seminar will feature presentations from both Demcko — who will cover the construction, electrical performance, and reliability of ceramic and film capacitors, stacked modules, and supercapacitors — and Dr. Yuri Freeman, director of Advanced Research at KEMET Electronics Corporation, who will focus on tantalum and electrolytic capacitors.

As part of the CMSE 2021 virtual exhibition, AVX will showcase its extensive portfolio of passive components for high-reliability mil-spec applications, including military- and space-level surface-mount ceramic capacitors, high-reliability surface-mount tantalum capacitors, and selections from its innovative range of compact, lightweight, and cost-effective high-CV, surface-mount base metal electrode solutions approved to MIL-PRF-32535, NASA, ESA, and CECC specifications. Exhibit highlights include AVX’s new Low-Inductance, Space-Level BME Ceramic Capacitors, its ESCC QPL-approved TCS Series COTS-Plus Ultra-Low-ESR Polymer Electrolytic Multianode Chip Capacitors, its TCH Series Hermetically Sealed Tantalum Polymer Capacitors, and its TCB Series COTS-Plus Conductive Tantalum Polymer Capacitors.

“CMSE is the leading technical conference for engineers primarily focused on reliability and technological advances in the passive component industry,” said CMSE Program Chair Tom Green. “These advanced products are critical enablers of various applications, ranging from the myriad capacitors employed in modern-day hybrid electric vehicles to the RF microwave modules designed into military and space systems and leveraged for national security. AVX’s continued presence at CMSE is a true testament to the company’s dedication to the design and development of advanced military and space applications, and in spite of the challenges posed by the global coronavirus pandemic, we are grateful to have the AVX team share its knowledge and expertise with our registered conference attendees for the eighth consecutive year.”

“CMSE is such an important, industry-shaping event because it brings leading members of and key professionals working within the military and space components supply chain together to share new knowledge, proven techniques, and best practices in an intensely focused setting that allows participants to effectively address the unique challenges facing these critical components,” said AVX Fellow and Technical Sales Group Manager, Ron Demcko. “At CMSE, everyone from design engineers to product managers, quality assurance personnel, and procurement executives works collaboratively to develop solutions that are vital to the advancement of military and space applications. All of us at AVX are extremely proud to be contributing to this uniquely collaborative industry event once again and look forward to continuing our participation and support of the conference in future years as well.”

2021 Components for Military & Space Electronics Virtual Conference (CMSE), please visit https://www.tjgreenllc.com/cmse/, click here to access the advance program, and follow them on Twitter and LinkedIn.

Related

Source: AVX Corporation

Recent Posts

Illustration of a thin-film capacitor stack with TiN electrodes and an ultrathin hafnium zirconium oxide ferroelectric layer on silicon

Sub-Volt Ferroelectric HZO Capacitor Pairs Speed and Endurance

6.11.2026
7
Cut-open lithium-ion capacitor pouch cell showing stacked carbon electrodes and separators, with vials of carbon powder

Lithium-Ion Capacitor Review Backs Hard Carbon//AC Pairing

6.11.2026
6
Rack power shelf in an AI data center with film DC-link capacitors, a supercapacitor bank and a converter board

800 VDC AI Data Centers Reshape Capacitor Demand for 2027

6.11.2026
12
Schematic of a titanium nitride thin-film inductor within a CMOS poly-resistor stack beside its integrated resonator circuit.

TiN Superinductors Bring Compact Cryogenic Inductance to CMOS

5.11.2026
19
YAGEO PMT6397 push-pull transformer with a segmented toroidal winding and surface-mount terminals

YAGEO Releases Push-Pull Transformers for Isolated 3 W Supplies

5.11.2026
8
Würth Elektronik WE-SLSP SMT common-mode choke with a square package and four terminals.

Würth Elektronik Releases Common-Mode Chokes for 100 V Data and Power Lines

4.11.2026
26
Würth Elektronik ICS PowerBusbar PF vertical PCB busbars with flat metal bodies and press-fit pins.

Würth PowerBusbar PF: Vertical Press-Fit Busbars for PCBs

4.11.2026
26
Bourns PWR163 DPAK-style surface-mount power resistor with moulded housing, metal backplate and terminals

Bourns Releases Power Resistor Adds Reverse-Pin Configuration

3.11.2026
6
Conceptual polypropylene DC-link film capacitor module with parallel cells and copper interconnections

DC-Link Film Capacitor Modules: Inductance and Thermal Design, Jianghai-Europe Tech Memo

3.11.2026
31

Upcoming Events

Nov 24
16:00 - 17:00 CET

Select the Correct Components for Your DC/DC Converter

Dec 1
16:00 - 17:00 CET

Developing low-noise mixed-signal systems

Dec 8
16:00 - 17:00 CET

WE-CCMF: Design Principles, Layout Guidelines and Measurement Results for High-Speed EMI Filtering

View Calendar

Popular Posts

  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • September 2026 Interconnect, Passives and Electromechanical Components Market Insights

    0 shares
    Share 0 Tweet 0
  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Capacitor Charging and Discharging

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • RF Connector Types: How To Choose the Right One

    0 shares
    Share 0 Tweet 0
  • Passive Low Pass Filters: Fundamentals and EMI Design

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Audio Capacitors: Choosing Capacitors for Crossover Circuits

    0 shares
    Share 0 Tweet 0
  • MLCC and Ceramic Capacitors

    0 shares
    Share 0 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© 2015–2026
All rights reserved

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • Dossiers
  • PCNS

© 2015–2026
All rights reserved