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    Advances in the Environmental Performance of Polymer Capacitors

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    Connector PCB Design Challenges

    Efficient Power Converters: Duty Cycle vs Conduction Losses

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    Coupled Inductors in SEPIC versus Flyback Converters

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    Percolation Phenomenon and Reliability of Molded Power Inductors in DC/DC converters

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    How to Calculate the Output Capacitor for a Switching Power Supply

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    Advances in the Environmental Performance of Polymer Capacitors

    Vishay Releases DLA Tantalum Polymer Capacitors for Military and Aerospace

    Vishay Expanded Inductor Portfolio With More Than 2000 Stock Items 

    Paumanok Releases Capacitor Foils Market Report 2025-2030

    Modelithics Welcomes CapV as a Sponsoring MVP

    Wk 40 Electronics Supply Chain Digest

    Benefits of Tantalum Powder Stress–Strain Curve Evaluation vs Conventional Wet Test

    Electrolyte Selection and Performance in Supercapacitors

    Connector PCB Design Challenges

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    • RF
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    • Tantalum vs Ceramic
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    Efficient Power Converters: Duty Cycle vs Conduction Losses

    Ripple Steering in Coupled Inductors: SEPIC Case

    SEPIC Converter with Coupled and Uncoupled Inductors

    Coupled Inductors in SEPIC versus Flyback Converters

    Non-Linear MLCC Class II Capacitor Measurements Challenges

    Percolation Phenomenon and Reliability of Molded Power Inductors in DC/DC converters

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    How to Calculate the Output Capacitor for a Switching Power Supply

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Bourns Unveils ChipGuard® ESD Suppressors

4.10.2023
Reading Time: 2 mins read
A A

Bourns is pleased to announce the release of the Model CG0201MLU Series ChipGuard® ESD Suppressor.

The Model CG0201MLU Series ChipGuard® ESD Suppressor is an ultra-low capacitance single channel ESD protector designed to safeguard sensitive electronics from damage caused by electrostatic discharges.

RelatedPosts

Bourns Releases Semi-Shielded Power Inductor with Polarity Control

Bourns Introduced 15A Compact Common Mode Choke

Bourns Adds New Common Mode Automotive Chip Inductors

The new protector has been designed to protect to IEC 61000-4-2, Level 4 (±8 kV contact/ ±15 kV air discharge) ESD specifications targeted for high speed USB 3.2, HDMI 1.4/2.0 and antenna circuit applications.

The industry standard 0201 package provides an extremely small footprint, making it an ideal space-saving protection solution for wearables, handheld devices and mobile phones.

Features

  • ESD protection to IEC 61000-4-2 Level 4
  • Extremely quick response time (<1 ns)
  • Low capacitance (0.05 pF typical)
  • Miniature 0201 package
  • Bidirectional protection
  • Low clamping voltage
  • Low leakage current
  • RoHS compliant

Applications

  • Antenna circuits
  • USB 3.2 Gen 1 and Gen 2
  • HDMI 1.3/1.4/2.0
  • SATA and eSATA Interfaces
  • SIM card ports
  • Memory protection

Related

Source: Bourns

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