Passive Components Blog
No Result
View All Result
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    Amphenol Explanded Liquid Cooling Connectors for AI, ESS and EV Systems

    Hirose Introduced BGA connector for PCIe Gen6 for AI and Edge Computing

    YAGEO Introduces High Rel MLCCs Beyond MIL-Spec Limits

    Würth Elektronik Expanded Capacity for Validation and Services in Asia

    Samsung Introduces Ultra-High-Voltage 1500 V MLCCs for xEV Powertrains

    YAGEO Q1 2026 Results: AI Servers and Pricing Power Behind a Moderate Q2 Outlook

    TDK Introduces High‑Voltage Common‑Mode Chokes for Compact 1250 V DC Converters

    Vishay Extends Power Inductors for DC/DC with 1212 Compact Case

    Modeling Planar Magnetics Temperature: Practical Guidelines for Power Electronics Engineers

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    Transformer-Based Power-Line Harvester Magnetic Design

    Thermal Modeling of Magnetics

    Standard vs Planar LLC transformers Comparison for Battery Chargers

    How Modern Tools Model Magnetic Components for Power Electronics

    Advanced Loss Modeling for Planar Magnetics in the Frenetic Planar Tool

    2026 Power Magnetics Design Trends: Flyback, DAB and Planar

    Enabling Software‑Defined Vehicle Architectures: Automotive Ethernet and Zonal Smart Power

    Calculating Resistance Value of a Flyback RC Snubber 

    One‑Pulse Characterization of Nonlinear Power Inductors

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • DossiersNew
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    Amphenol Explanded Liquid Cooling Connectors for AI, ESS and EV Systems

    Hirose Introduced BGA connector for PCIe Gen6 for AI and Edge Computing

    YAGEO Introduces High Rel MLCCs Beyond MIL-Spec Limits

    Würth Elektronik Expanded Capacity for Validation and Services in Asia

    Samsung Introduces Ultra-High-Voltage 1500 V MLCCs for xEV Powertrains

    YAGEO Q1 2026 Results: AI Servers and Pricing Power Behind a Moderate Q2 Outlook

    TDK Introduces High‑Voltage Common‑Mode Chokes for Compact 1250 V DC Converters

    Vishay Extends Power Inductors for DC/DC with 1212 Compact Case

    Modeling Planar Magnetics Temperature: Practical Guidelines for Power Electronics Engineers

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    Transformer-Based Power-Line Harvester Magnetic Design

    Thermal Modeling of Magnetics

    Standard vs Planar LLC transformers Comparison for Battery Chargers

    How Modern Tools Model Magnetic Components for Power Electronics

    Advanced Loss Modeling for Planar Magnetics in the Frenetic Planar Tool

    2026 Power Magnetics Design Trends: Flyback, DAB and Planar

    Enabling Software‑Defined Vehicle Architectures: Automotive Ethernet and Zonal Smart Power

    Calculating Resistance Value of a Flyback RC Snubber 

    One‑Pulse Characterization of Nonlinear Power Inductors

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • DossiersNew
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

Carbon films can give microchips energy storage capability

15.2.2016
Reading Time: 3 mins read
A A

source: Energy Harvesting Journal article

After more than half a decade of speculation, fabrication, modeling and testing, an international team of researchers led by Drexel University’s Yury Gogotsi, PhD, and Patrice Simon, PhD, of Paul Sabatier University in Toulouse, France, have confirmed that their process for making carbon films and micro-supercapacitors will allow microchips and their power sources to become one and the same.

RelatedPosts

Amphenol Explanded Liquid Cooling Connectors for AI, ESS and EV Systems

Hirose Introduced BGA connector for PCIe Gen6 for AI and Edge Computing

YAGEO Introduces High Rel MLCCs Beyond MIL-Spec Limits

The discovery, which was reported in a recent edition of the journal Science, is the culmination of years of collaborative research by the team who initially created the carbide-derived carbon film material for microsupercapacitors and published the concept paper in Science in 2010. Since then, their goal has been to show that it’s possible to physically couple the processing center of an electronic device — the microchip — with its energy source.

“This has taken us quite some time, but we set a lofty goal of not just making an energy storage device as small as a microchip — but actually making an energy storage device that is part of the microchip and to do it in a way that is easily integrated into current silicon chip manufacturing processes,” said Simon, who led the research under the aegis of the French research network on electrochemical energy storage (RS2E), a spin-off of Le Centre National de la Recherche Scientifique (CNRS) and France’s Ministry of Research. “With this achievement, the future is now wide open for chip and personal electronics manufacturers.”

It confirms a belief that the group has held since the materials were first fabricated — that these films are versatile enough to be seamlessly integrated into the systems that power silicon-based microchips that run devices from your laptop to your smart watch. The challenges that the group faced in the development of the material were questions about its compatibility, its mechanical stability and durability for use on flexible substrates. With these answered, it opens up a myriad of possibilities for carbon films to work their way into silicon chips — including building microscale batteries on a chip.

“The place where most people will eventually notice the impact of this development is in the size of their personal electronic devices, their smart phones, fitbits89 and watches,” said Gogotsi, Distinguished University and Trustee Chair Professor in the Department of Materials Science Engineering who directs the A.J. Drexel Nanomaterials Institute in Drexel’s College of Engineering. “Even more importantly,” Gogotsi adds, “on-chip energy storage is needed to create the Internet of Things – the network of all kinds of physical objects ranging from vehicles and buildings to our clothes embedded with electronics, sensors, and network connectivity, which enables these objects to collect and exchange data. This work is an important step toward that future.”

The researchers’ method for depositing carbon onto a silicon wafer is consistent with microchip fabrication procedures currently in use, thus easing the challenges of integration of energy storage devices into electronic device architecture. As part of the research, the group showed how it could deposit the carbon films on silicon wafers in a variety of shapes and configurations to create dozens of supercapacitors on a single silicon wafer. Supercapacitors have been desirable devices to use in microelectronics because they can store a great deal of energy for their size, they can be charged and discharged their energy extremely quickly and their lifespan is nearly limitless. With this discovery, the path is clear for microchip manufacturers to take a big step forward in the way they design their products. Beyond the energy storage applications, these carbon films offer good prospects for the development of elastic coatings with a low coefficient of friction that can be used in lubricant-free sliding parts, such as dynamic seals. They may also be used in production of membranes for gas filtration, water desalination or purification, because their pore size is in the range of single molecules. The carbon films produced by this method are quite versatile and may find applications in many areas.

Source and top image: Drexel University

Related

Recent Posts

Amphenol Explanded Liquid Cooling Connectors for AI, ESS and EV Systems

17.4.2026
1

Hirose Introduced BGA connector for PCIe Gen6 for AI and Edge Computing

17.4.2026
3

YAGEO Introduces High Rel MLCCs Beyond MIL-Spec Limits

16.4.2026
18

Samsung Introduces Ultra-High-Voltage 1500 V MLCCs for xEV Powertrains

16.4.2026
9

YAGEO Q1 2026 Results: AI Servers and Pricing Power Behind a Moderate Q2 Outlook

16.4.2026
31

TDK Introduces High‑Voltage Common‑Mode Chokes for Compact 1250 V DC Converters

16.4.2026
9

Vishay Extends Power Inductors for DC/DC with 1212 Compact Case

16.4.2026
9

YAGEO Releases Ferrite Shielded Power Inductors for High‑Density Designs

15.4.2026
12

Samsung Presents MLCC Selection Guide for Humanoids and Robotic Applications

15.4.2026
16

Upcoming Events

Apr 21
16:00 - 17:00 CEST

Heatsink Solutions: Thermal Management in electronic devices

Apr 22
17:00 - 17:30 CEST

Magnetics in a high frequency GaN era

Apr 22
17:00 - 18:00 CEST

Derating Tantalum, Film, and Ceramic Capacitors

View Calendar

Popular Posts

  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • MLCC and Ceramic Capacitors

    0 shares
    Share 0 Tweet 0
  • Dual Active Bridge (DAB) Topology

    0 shares
    Share 0 Tweet 0
  • Capacitor Charging and Discharging

    0 shares
    Share 0 Tweet 0
  • Plastic Materials Dielectric Constant and DF

    4 shares
    Share 4 Tweet 0
  • MLCC Case Sizes Standards Explained

    0 shares
    Share 0 Tweet 0
  • Ripple Current and its Effects on the Performance of Capacitors

    3 shares
    Share 3 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© EPCI - Leading Passive Components Educational and Information Site

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • PCNS

© EPCI - Leading Passive Components Educational and Information Site

This website uses cookies. By continuing to use this website you are giving consent to cookies being used. Visit our Privacy and Cookie Policy.
Go to mobile version