Passive Components Blog
No Result
View All Result
  • Home
  • News
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Optoelectronics and Isolation
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest
    Features of BCZT and strontium titanate dielectric layers in a thin-film superlattice

    Relaxor superlattice capacitors approach 99% efficiency

    Stackpole RMAN thick-film chip resistors with rectangular bodies and metal end terminations

    Stackpole 2512 AlN Thick-Film Resistors Rated up to 3.5 W

    ECIA September 2026 Industry Pulse electronic component trends and sentiment report

    ECIA September 2026 Pulse: Growth Holds, Supply Pressure Persists

    Wk 39 Electronics Supply Chain Digest

    Concept illustration of TT Electronics resistor and sensing technologies with chip resistors, a shaft potentiometer and a slotted optical sensor

    TT Electronics: Resistor and Sensing Trends at electronica 2026

    Conceptual Toray heat-resistant film capacitor beside an inverter cooling structure.

    Toray Film Capacitor Enables 150°C Inverter Operation

    Silicon capacitors and integrated passives dossier cover

    Silicon Capacitors and Integrated Passives Dossier Report 10/26

    Samtec automotive interconnect technologies for software-defined vehicle electronics

    Samtec Links Automotive Connector Demands to Software-Defined Cars

    Panasonic Industry PGS graphite heat-spreading technology and passive components for spacecraft thermal management

    Panasonic Targets Space Thermal Design at SPCD 2026

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • Knowledge Blog
  • Dossiers
    • Aerospace and Defense Passive Components Dossier
    • AI Hardware Dossier
    • Automotive Dossier
    • Industrial Robotics Dossier
    • Power Converter Dossier
    • Capacitor Dossier
    • Circuit Protection Dossier
    • Inductor Dossier
    • Resistor Dossier
    • Silicon Capacitors and Integrated Passives Dossier
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
  • Home
  • News
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Optoelectronics and Isolation
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest
    Features of BCZT and strontium titanate dielectric layers in a thin-film superlattice

    Relaxor superlattice capacitors approach 99% efficiency

    Stackpole RMAN thick-film chip resistors with rectangular bodies and metal end terminations

    Stackpole 2512 AlN Thick-Film Resistors Rated up to 3.5 W

    ECIA September 2026 Industry Pulse electronic component trends and sentiment report

    ECIA September 2026 Pulse: Growth Holds, Supply Pressure Persists

    Wk 39 Electronics Supply Chain Digest

    Concept illustration of TT Electronics resistor and sensing technologies with chip resistors, a shaft potentiometer and a slotted optical sensor

    TT Electronics: Resistor and Sensing Trends at electronica 2026

    Conceptual Toray heat-resistant film capacitor beside an inverter cooling structure.

    Toray Film Capacitor Enables 150°C Inverter Operation

    Silicon capacitors and integrated passives dossier cover

    Silicon Capacitors and Integrated Passives Dossier Report 10/26

    Samtec automotive interconnect technologies for software-defined vehicle electronics

    Samtec Links Automotive Connector Demands to Software-Defined Cars

    Panasonic Industry PGS graphite heat-spreading technology and passive components for spacecraft thermal management

    Panasonic Targets Space Thermal Design at SPCD 2026

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • Knowledge Blog
  • Dossiers
    • Aerospace and Defense Passive Components Dossier
    • AI Hardware Dossier
    • Automotive Dossier
    • Industrial Robotics Dossier
    • Power Converter Dossier
    • Capacitor Dossier
    • Circuit Protection Dossier
    • Inductor Dossier
    • Resistor Dossier
    • Silicon Capacitors and Integrated Passives Dossier
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

Carbon films can give microchips energy storage capability

15.2.2016
Reading Time: 3 mins read
A A

source: Energy Harvesting Journal article

After more than half a decade of speculation, fabrication, modeling and testing, an international team of researchers led by Drexel University’s Yury Gogotsi, PhD, and Patrice Simon, PhD, of Paul Sabatier University in Toulouse, France, have confirmed that their process for making carbon films and micro-supercapacitors will allow microchips and their power sources to become one and the same.

RelatedPosts

Relaxor superlattice capacitors approach 99% efficiency

Stackpole 2512 AlN Thick-Film Resistors Rated up to 3.5 W

ECIA September 2026 Pulse: Growth Holds, Supply Pressure Persists

The discovery, which was reported in a recent edition of the journal Science, is the culmination of years of collaborative research by the team who initially created the carbide-derived carbon film material for microsupercapacitors and published the concept paper in Science in 2010. Since then, their goal has been to show that it’s possible to physically couple the processing center of an electronic device — the microchip — with its energy source.

“This has taken us quite some time, but we set a lofty goal of not just making an energy storage device as small as a microchip — but actually making an energy storage device that is part of the microchip and to do it in a way that is easily integrated into current silicon chip manufacturing processes,” said Simon, who led the research under the aegis of the French research network on electrochemical energy storage (RS2E), a spin-off of Le Centre National de la Recherche Scientifique (CNRS) and France’s Ministry of Research. “With this achievement, the future is now wide open for chip and personal electronics manufacturers.”

It confirms a belief that the group has held since the materials were first fabricated — that these films are versatile enough to be seamlessly integrated into the systems that power silicon-based microchips that run devices from your laptop to your smart watch. The challenges that the group faced in the development of the material were questions about its compatibility, its mechanical stability and durability for use on flexible substrates. With these answered, it opens up a myriad of possibilities for carbon films to work their way into silicon chips — including building microscale batteries on a chip.

“The place where most people will eventually notice the impact of this development is in the size of their personal electronic devices, their smart phones, fitbits89 and watches,” said Gogotsi, Distinguished University and Trustee Chair Professor in the Department of Materials Science Engineering who directs the A.J. Drexel Nanomaterials Institute in Drexel’s College of Engineering. “Even more importantly,” Gogotsi adds, “on-chip energy storage is needed to create the Internet of Things – the network of all kinds of physical objects ranging from vehicles and buildings to our clothes embedded with electronics, sensors, and network connectivity, which enables these objects to collect and exchange data. This work is an important step toward that future.”

The researchers’ method for depositing carbon onto a silicon wafer is consistent with microchip fabrication procedures currently in use, thus easing the challenges of integration of energy storage devices into electronic device architecture. As part of the research, the group showed how it could deposit the carbon films on silicon wafers in a variety of shapes and configurations to create dozens of supercapacitors on a single silicon wafer. Supercapacitors have been desirable devices to use in microelectronics because they can store a great deal of energy for their size, they can be charged and discharged their energy extremely quickly and their lifespan is nearly limitless. With this discovery, the path is clear for microchip manufacturers to take a big step forward in the way they design their products. Beyond the energy storage applications, these carbon films offer good prospects for the development of elastic coatings with a low coefficient of friction that can be used in lubricant-free sliding parts, such as dynamic seals. They may also be used in production of membranes for gas filtration, water desalination or purification, because their pore size is in the range of single molecules. The carbon films produced by this method are quite versatile and may find applications in many areas.

Source and top image: Drexel University

Related

Recent Posts

Features of BCZT and strontium titanate dielectric layers in a thin-film superlattice

Relaxor superlattice capacitors approach 99% efficiency

12.10.2026
6
Stackpole RMAN thick-film chip resistors with rectangular bodies and metal end terminations

Stackpole 2512 AlN Thick-Film Resistors Rated up to 3.5 W

12.10.2026
3
Concept illustration of TT Electronics resistor and sensing technologies with chip resistors, a shaft potentiometer and a slotted optical sensor

TT Electronics: Resistor and Sensing Trends at electronica 2026

9.10.2026
7
Conceptual Toray heat-resistant film capacitor beside an inverter cooling structure.

Toray Film Capacitor Enables 150°C Inverter Operation

9.10.2026
15
Silicon capacitors and integrated passives dossier cover

Silicon Capacitors and Integrated Passives Dossier Report 10/26

8.10.2026
35
Panasonic Industry PGS graphite heat-spreading technology and passive components for spacecraft thermal management

Panasonic Targets Space Thermal Design at SPCD 2026

8.10.2026
25
tungsten-bronze-ceramic-capacitor-stack

Tungsten bronze capacitors combine high κ and thermal stability

7.10.2026
26
Murata electronica 2026 technology preview featuring MGJ2T2 power converters and SCI36LT inertial sensors.

Murata Previews SiC Power and AI Sensors at electronica 2026

6.10.2026
44
Ruggedized passive component customization overview covering capacitors, resistors and inductors.

Ruggedized Passive Components: Reliability Beyond the Datasheet

6.10.2026
36

Upcoming Events

Oct 14
17:00 - 18:00 CEST

Live Demo! Discover KYOCERA AVX Antenna Integrator Studio (AIS)

Oct 19
15:00 - 16:00 CEST

ESCC-qualified Pt Temperature Sensors for Space Applications

Oct 27
15:00 - 16:00 CET

Heraeus Electronics Webinar: What materials perform when failure is not an option?

View Calendar

Popular Posts

  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Capacitor Charging and Discharging

    0 shares
    Share 0 Tweet 0
  • Audio Capacitors: Choosing Capacitors for Crossover Circuits

    0 shares
    Share 0 Tweet 0
  • MLCC and Ceramic Capacitors

    0 shares
    Share 0 Tweet 0
  • Resistor Symbols

    0 shares
    Share 0 Tweet 0
  • Thermistors Basics, NTC and PTC Thermistors

    0 shares
    Share 0 Tweet 0
  • RF Connector Types: How To Choose the Right One

    0 shares
    Share 0 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© 2015–2026
All rights reserved

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • Dossiers
  • PCNS

© 2015–2026
All rights reserved