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Microhardness — the Hidden Key to Understanding MnOx Cathode Quality in Tantalum Capacitors

Samsung to Invest in its Philippine MLCC Facility to Meet Automotive Demand

Lightweight Model for MLCC Appearance Defect Detection

DMASS Reports First Positive Signs of European Distribution Market in Q3/25

TAIYO YUDEN Releases 22uF MLCC in 0402 Size for AI Servers

Wk 44 Electronics Supply Chain Digest

Bourns Releases High Current Metal Alloy-based, Multilayer Power Chip Inductors

Smiths Interconnect Extends Space-Qualified, High-Reliability Fixed Chip Attenuators

Samtec Expands Offering of Slim, High-Density HD Array Connectors
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Common Mode Chokes Selection for RF Circuits in Next-Generation Communication Systems

Capacitor Self-balancing in a Flying-Capacitor Buck Converter

How to Select Ferrite Bead for Filtering in Buck Boost Converter

Power Inductors Future: Minimal Losses and Compact Designs

Percolation Phenomenon: Degradation of Molded Power Inductors in DC/DC Converters

Connector PCB Design Challenges

Efficient Power Converters: Duty Cycle vs Conduction Losses

Ripple Steering in Coupled Inductors: SEPIC Case

SEPIC Converter with Coupled and Uncoupled Inductors
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