Researchers from the Institute of Science Tokyo demonstrated ultrathin ferroelectric capacitor stack with a total thickness of only 30 nm...
Read moreDetailsResearchers from Regional Centre of Advanced Technologies and Materials CATRIN Olomouc and VSB Ostrava, Czech republic published a scientific paper...
Read moreDetailsThis article by Vladimir Azbel, an independent consultant on tantalum capacitors, introduces Mechanochemical Model of Structurally Disordered Transition Layer Formation...
Read moreDetailsBourns has released the BTJ Series thermal jumper chips, a family of surface‑mount thermal links designed to move heat efficiently...
Read moreDetailsThis article and presentation by Sam Ben-Yaakov describes one-pulse nonlinear-inductor measurement method that provides a compact way to extract nonlinear...
Read moreDetailsElectronics Supply Chain Weekly Digest 12-19-25. DATAPOINT OF THE WEEK: S&P December Flash Eurozone mfg PMI decreased to 49.2 from...
Read moreDetailsSamsung Electro-Mechanics has introduced the world’s first CLLC resonant multilayer ceramic capacitor (MLCC) in a compact 1210 (3.2 × 2.5...
Read moreDetailsBourns® introduced PF-SRC50E fuse series offering a compact high-voltage protection solution that complies with UL 248-13 and IEC 60269-4 (aR...
Read moreDetailsAs AI servers and GPU accelerators push to higher performance and power density, their power delivery networks are undergoing a...
Read moreDetailsAccording to article by Wu et al. from YAGEO researcher team in the International Journal of Applied Ceramic Technology, alloying nickel...
Read moreDetails
© EPCI - Leading Passive Components Educational and Information Site
© EPCI - Leading Passive Components Educational and Information Site