Source: Exxelia news April 16th, 2019 – Paris, France - Exxelia, a leading global designer and manufacturer of highly engineered...
Read moreSource: EPCI original article By Tomas Zednicek Ph.D. European Passive Components Institute. This article summarizes history, main features and potentials...
Read moreSource: AVX news The Components for Military & Space Electronics Conference & Exhibition has invited AVX to contribute for the...
Read moreStretchable electronics is emerging as a promising new technology for next-generation wearable devices, according to a review published in Science...
Read moreSource: EE Times article By Balaji Siva Prasad Emandi. A method for simulating stress and faults early in the design...
Read moresource: Würth Elektronik eiSos news Würth Elektronik eiSos presents its reference book on wireless power transmission. Waldenburg (Germany), 21 March...
Read morePaumanok Publications, Inc. has announced the release of “Passive Electronic Components: World Market Outlook: 2019-2024. This report is designed for...
Read moreHigh-voltage multi-layer ceramic chip capacitors (MLCCs) can experience field failures that are instantaneous and catastrophic. The initiator of the failure...
Read moreSource: eeNews article KEMET Electronics Corp. (Fort Lauderdale, Florida) – now known as a world-leading manufacturer of passive components –...
Read moreSource: iConnect007 article by Nolan Johnson; The ripples start at the very front of the process when the engineering and...
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