Industrial

SCHURTER introduces DTCD and DTCJ series ultra‑miniature 1.27 mm pitch SMT DIP switches designed for high‑density electronic assemblies where classic...

Bourns has introduced the SRP2008DP Series, a family of low‑profile, high current shielded power inductors in a 2.0 × 1.6...

The Applied Power Electronics Conference (APEC) 2026 confirmed how quickly power conversion is evolving across AI data centers, EVs, industrial...

Hydra, the traditional film capacitor producer, has developed a new proprietary gel filler for its cylindrical protected film capacitors that...

Würth Elektronik has expanded its thermal management range with a modular heat sink portfolio for power semiconductors in TO packages...

Binder has introduced a new triangular moulding design for selected M16 and M12 cable connectors to improve mechanical robustness, strain...

Panasonic’s super high precision thick film chip resistors target designs that need thin‑film‑class accuracy but with higher power handling and...

The global electronics industry has gained a significant update to one of its key assembly-process standards with the release of...

Vishay’s new Sfernice 40 LHE is a compact linear position sensor based on non‑contact Hall Effect technology, designed for accurate...

Exxelia, in collaboration with CEA‑Leti, has demonstrated a miniaturized inverted‑F antenna (IFA) operating around 400 MHz by loading it with...